Mixed-Signal/RF PDK Checklist

• This document is completed by the process design kit (PDK) developer and delivered with each new release of a mixed-signal/RF PDK. This document helps you obtain a better understanding of the source data, completeness and quality of the PDK before using it to design ICs or to modify it to fit into your in-house design flow. A Checklist Users Guide is also available for download.

AMS/RF Process Checklist

• The MS/RF Working Group's Process Control Monitoring (PCM)/Process Checklist Working Group has established a checklist that identifies the different elements of a foundry’s AMS/RF process and its ability to fulfill a semiconductor company’s needs; serves as a basic set of guidelines for measuring available items in an AMS/RF foundry process; and is an efficient way to communicate information in a consistent format across all foundries.

Mixed-Signal/RF SPICE Model Checklist

• This document is completed by the SPICE model developer and delivered with each new release of a SPICE model. This document helps developers better understand the source data, completeness and quality of the model before using it to design ICs or to re-extract it to fit into specific product needs. A Checklist Users Guide and Checklist Taxonomy & Definitions are also available for download.

Semiconductor End Markets

• It is well known that the semiconductor industry changes rapidly; therefore, GSA surveys its database of companies regularly to ensure all information is updated and correct. This year, we are sending an abbreviated survey to capture your company’s detailed end market information. By completing the survey, it will guarantee your company is listed correctly in our database, which, in turn, will help us serve you better.

2010 GSA Memory Conference Report

• “Bridging Memory and Logic ICs for Better System Performance”
  

  The GSA Memory Conference, held in Taipei on March 16, 2010, ended with great success. The 2010 GSA Memory Conference Report records the key perspectives and insights from the distinguished speakers and the companies they represented at this conference. It also brings together impartial views and comments from the Industrial Economics and Knowledge Center (IEK), the industrial research arm of the Industrial Technology Research Institute (ITRI), a long-term associate to GSA.

Global Semiconductor Funding, IPO and M&A Update

• To provide the industry with timely data on semiconductor investment activity in the private and public sector, GSA releases a monthly two-page update and a downloadable, sort-able Excel spreadsheet of all semiconductor funding, initial public offering (IPO), and merger and acquisition (M&A) activity.

Understanding Fabless IC Technology

• Authors: Jeorge S. Hurtarte, Evert A. Wolsheimer, Lisa M. Tafoya

  Understanding Fabless IC Technology focuses on the differences between the IDM and fabless business model and provides the reader with an overview of how to conduct business in the outsourced semiconductor industry environment as well as discusses technical, cultural and global issues. It also discusses key business topics such as negotiating with outside fabrication companies, choosing the right electronic design tools, protection of intellectual property and business plans, and maintaining quality control.

Lead-Free Resources

• GSA provides you resources including presentations, reports and links to additional sites with helpful information such as defining RoHS, WEEE, lead facts, and more.

Building a Better Supply Chain: Successful Collaboration in the Fabless Semiconductor Industry

• Industry Directions and GSA

  A collaborative effort between industry analyst firm Industry Directions, Inc. and GSA, the study demonstrates that while fabless companies are adept at operating in the outsourced model and recognize the importance of the supply chain and how it helps drive competitive advantage, there is significant opportunity for improvement.

GSA Semiconductor Market Report: An Essential Data Resource for Outsourcing Companies

• The Semiconductor Market Report, last updated in May 2007, is an essential historical data resource that encompasses the entire fabless ecosystem. There is no single source or publication of this caliber with the more than 550 pages of easy-to-read charts, graphs and written analysis.

To DFM (Design for Manufacture) or not DFM?

• Wes Hansford
  MOSIS

  This article discusses packaging options available for prototyping silicon ICs

  PDF, 1277.091 MB

• Wes Hansford
  MOSIS

  This article discusses whether design for manufacture and optimizing yield should be the most important criteria in designing ICs.

  PDF, 763.586 MB

Can MIPI and MDDI Really Co-Exist?

• Ashraf K. Takla, Mixel & Timothy Saxe, QuickLogic

  Since MIPI and MDDI standards both target interfaces to cameras and displays on mobile devices, are two separate standards really needed?

  PDF, 4.55 MB

Current Economic Downturn Monitor

• Throughout the current economic downturn, GSA is providing the industry with the latest data, resources and analysis supporting the GSA Hypothesis. We encourage you to download the articles and presentations for the most comprehensive analysis.

Analog and Mixed-Signal Connectivity IP at 65nm and Below

• Navraj S. Nandra, Director of Marketing Mixed-Signal IP
  Synopsys, Inc.

  PDF

GSA & IET International Semiconductor Forum
Munich, Germany
June 2, 2009

• Module Packaging Trends LOGIN
  Dr. Mohamed Wahab, Managing Director
  DELTA Microelectronics, Ltd.

  This presentation addresses digital chips and mixed-signal combinations in a single package, with emphasis on System-in-Package (SiP) applications. This presentation sheds light on this topic by illuminating case studies, providing best practices and general guidelines on how to evaluate the tradeoffs.

  PDF, 1.72 MB

IP Conference Taiwan
Hsinchu, Taiwan
May 7, 2009

• Strategizing for a healthy IP ecosystem
  Strategies for Managing Development Costs & Risks at Advanced Technology Nodes
  Brani Buric, Executive Vice President
  Virage Logic Corporation

  PDF, 2.002 MB

• Strategizing for a healthy IP ecosystem
  Future Prospective of Programmable Logic Non-Volatile Memory
  Charles Hsu, President
  eMemory Technology Inc.

  PDF, 1.016 MB

ITAC and GSA Conference
Waterloo, Ontario, CANADA
April 15, 2009

• Semiconductor Industry Will Innovate its Way Out of the Downturn
  Lisa Tafoya, Vice President of Global Research
  Global Semiconductor Alliance

  The semiconductor industry has a rich tradition of managing through dramatic and unforgiving cycles, ranging from years of extraordinary growth, to steep declines. After several unprecedented years of contiguous growth, the industry is now facing a downturn stunning even industry veterans. Semiconductor companies will not go unscathed in this current environment. Start-ups needing additional rounds of funding and do not yet have a product and are not cash-flow positive are the most vulnerable. However, in general, the industry is in a much stronger position to weather this downturn than it was in 2001. The presentation will provide data and analysis supporting the hypothesis that the semiconductor industry will innovate its way out of the downturn, and how great companies will be prepared for next-generation opportunities.

  PDF, 4.35 MB

• IDC Semiconductor Update: Semiconductor Industry Downturn Prolonged by Economic Reality
  Flint Pulskamp, Program Manager Wireless Semiconductors
  IDC

  At what point can we expect to reach the bottom of this current downturn? How does this downturn compare to 1996, 1998 and 2001?

  PDF, 908 KB

GSA Semiconductor Leaders Forum TAIWAN
Ambassador Hotel Hsinchu, Taiwan R.O.C.
November 5, 2008

• Keynote Address
  How Asia is Changing the Analog IC Business LOGIN
  David Bell, President, Chief Executive Officer and Director, Intersil Corporation
  Intersil Corporation

  PDF, 942 KB

GSA Suppliers Expo & Conference
Santa Slara, CA
October 2, 2008

• GSA Annual Briefing LOGIN GSA

  PDF, 1.6 MB

FSA Suppliers Expo & Conference
Santa Clara, California, US
September 12, 2007

• FSA Annual Briefing LOGIN
  Jodi Shelton, Executive Director, FSA
  FSA

  PDF, 2 MB

Supply Chain Issues In The High-Technology Semiconductor Industry

• Sanjiv Chopra
  Oracle Corporation

  Results of the supply chain survey conducted by Oracle & Global Semiconductor Alliance (GSA) Sanjiv Chopra, Oracle Corporation

  PDF

Analog Circuits: World Class Design Part 5

• PDF

Analog Circuits: World Class Design Part 4

• PDF

Analog Circuits: World Class Design Part 3

• PDF

Analog Circuits: World Class Design Part 2

• PDF

Analog Circuits: World Class Design Part 1

• PDF

New Application Areas Driving Higher Dynamic Range Converters

• Michael Connolly
  Silicon & Software Systems(S3)

  With the advent of higher broadband speeds in the fixed line and wireless systems, the need for higher performing data converters has become apparent. In this article, we discuss the different standards that are pushing this trend and how single tone testing, in some cases, does not accurately determine the performance in communication systems. This is particularly true in systems that employ multi-tone signalling or OFDM (orthogonal frequency division multiplexing), in which the available bandwidth is split into a large number of sub-channels, which then allows data to be transmitted over many sub-carriers, thereby enabling higher data rates.

  PDF, 231.2 MB

The PSP Model in RF CMOS Design

• LOGIN
  Fujitsu Microelectronics America, Inc.

  The new white paper from Fujitsu Microelectronics features the technology behind Penn State Philips (PSP) transistor models and how they relate to actual device behavior. When included in a well-developed RF process design kit (PDK) with effective statistical and inductance tools, the PSP model provides better RF simulation accuracy than ever before. A good RF PDK for deep sub-micron technology helps RF designers meet tight constraints on power consumption and n

  PDF, 773 KB

Pipeline vs. Sigma Delta ADC for Communications Applications

• Noel O'Riordan
  Silicon & Software Systems(S3)

  The Analog-to-Digital Converter (ADC) is a key component in digital communications receive channels, and the correct choice of ADC is critical for optimizing system design. In this white paper, we discuss what design factors drive the selection of the ADC, how to specify the ADC and when to choose between a Pipeline ADC and a Sigma-Delta (??) ADC.

  PDF, 362.513 MB

Implementing Physical Layer Connectivity IP in Deep Sub-Micron Technologies

• LOGIN
  Navraj S. Nandra, Director of Marketing, Mixed-Signal IP
  Synopsys, Inc.

  PDF, 193 KB

Motivation for RF Integration

• Fujitsu Microelectronics America

  PDF, 866 KB

Offshoring in the Semiconductor Industry: A Historical Perspective

• LOGIN
  Clair Brown and Greg Linden
  UC Berkeley

  PDF, 244 KB