GSA Member Login | March 17, 2010
RF / Analog / Mixed-Signal
IC Foundry Almanac, 2010 Edition
  • RF/Analog/Mixed-Signal
    Working Groups
  • MS/RF
    Working Group
  • MS/RF PDK
    Sub Working Group
  • MS/RF PCM/Process
    Checklist Sub Working Group
  • MS/RF Model
    Sub Working Group

RF/Analog/Mixed-Signal Working Groups

The Analog/Mixed-Signal Interest Group's mission of addressing technical and business challenges within the analog/mixed-signal ecosystem, such as the lack of models, managing the power budget, over customization (harder to have proven IP blocks), choosing the right process and lack of planning through the entire process, will be further promoted by its MS/RF Working Group.

The MS/RF Working Group is focused on accelerating the formation of an advanced mixed-signal/RF supply chain and ecosystem for fabless and hybrid companies. The MS/RF Working Group's initiatives are carried out through its sub-working groups:

For more information regarding the MS/RF Working Group, contact Chelsea Boone, Senior Research Analyst at 972.866.7579 ext.123 or via email at cboone@gsaglobal.org.

MS/RF Working Group

Purpose

The Mixed-Signal/RF Working Group's mission is to accelerate the formation of an advanced mixed-signal/RF supply chain and ecosystem for fabless and hybrid companies.

The Working Group's objectives include:

  • Developing a format for process design kit (PDK) roadmap representation and development criteria at various stages in the process lifecycle.
  • Developing mixed-signal/RF requirements for characterization vehicle, SPICE modeling, design-for-manufacturing (DFM) and package modeling.
  • Creating a common language for mixed-signal/RF intellectual property (IP) and establishing an environment where analog and RF IP can be reused.
  • Defining a standard way of communicating basic process parameters and criteria for mixed-signal/RF processes.
  • Developing standard definitions for quantitative and qualitative metrics that can be used for classification and as figures of merit in selecting an appropriate process and process options for a specific design application.

Article: GSA Mixed-Signal/RF Subcommittee Is Facilitating an Analog Ecosystem (Chip Design) by Marco Racanelli, VP, Technology & Engineering & GM, Aerospace & Defense, Jazz Semiconductor, Inc., a Tower Group Company, GSA MS/RF Working Group Chairman

Initiatives

Mixed-Signal/RF PDK Checklist – The Working Group's PDK Sub-Working Group has further improved and revised the current version of the Checklist to include a "PDK Details" section which can help one assess if a PDK can be used with a given software.

Mixed-Signal/RF SPICE Model Checklist – The Working Group's Model Sub-Working Group is working to further improve and revise the current version (1.2).

AMS/RF Process Checklist – The Working Group's Process Control Monitoring (PCM)/Process Checklist Sub-Working Group has developed a four-page Process Checklist that (1) reflects the key attributes of an AMS/RF foundry process offering and (2) provides standard definitions for the quantitative and qualitative metrics that can be used for classification and as figures of merit in selecting an appropriate process and process options for a specific design application.

Mixed-Signal/RF PCM Checklist – Now that the Process Checklist has been completed, the Working Group's PCM/Process Checklist Sub-Working Group will work to develop a checklist that will help in communicating basic process parameters and criteria for mixed-signal and RF processes.

Deliverables

AMS/RF Process Checklist – A checklist that identifies the different elements of a foundry's AMS/RF process and its ability to fulfill a semiconductor company's needs; serves as a basic set of guidelines for measuring available items in an AMS/RF foundry process; and is an efficient way to communicate information in a consistent format across all foundries.

Mixed-Signal/RF PDK Checklist – A document completed by the PDK developer and delivered with each new release of a mixed-signal/RF PDK. This document helps developers obtain a better understanding of the source data, completeness and quality of the PDK before using it to design ICs or to modify it to fit into your in-house design flow. A Checklist Users Guide is also available for download.

Click here for the PDK Checklist Adoption Table

Mixed-Signal/RF SPICE Model Checklist – A document completed by the SPICE model developer and delivered with each new release of an SPICE model. This document helps developers better understand the source data, completeness and quality of the model before using it to design ICs or to re-extract it to fit into specific product needs. A Checklist Users Guide and Checklist Taxonomy & Definitions are also available for download.

Click here for the SPICE Model Checklist Adoption Table

IP Deliverable Checklist – A checklist that is integrated into the Hard IP Quality Risk Assessment Tool.

Sub-Working Groups

MS/RF PDK Sub-Working Group – Developing a format for PDK roadmap representation and development criteria at various stages in the process lifecycle.

MS/RF Model Sub-Working Group – Developing mixed-signal and RF requirements for characterization vehicle, SPICE modeling, DFM and package modeling.

MS/RF PCM/Process Checklist Sub-Working Group – (1) Defining a standard way of communicating basic process parameters and criteria for mixed-signal and RF processes. (2) Developing standard definitions for quantitative and qualitative metrics that can be used for classification and as figures of merit in selecting an appropriate process and process options for a specific design application.

Leadership

Marco Racanelli, MS/RF Working Group Chairman, Jazz Semiconductor, Inc., a Tower Group Company
(T) 949-435-8309
(E) marco.racanelli@jazzsemi.com

Upcoming Events

Events to come.

Resources

Dec 11, 2008 - MS/RF Meeting Presentation (PDF, 778 KB)

Sept 12, 2007 - MS/RF Meeting Presentation (PDF, 276 KB)

May 30, 2007 - MS/RF Meeting Presentation (PDF, 280 KB)

For meeting minutes prior to 2007, please contact Chelsea Boone.

Get Involved

Those who deal with MS/RF-related issues are encouraged to get involved.

Join This Working Group – By signing up, you will be added to a distribution list and receive upcoming meeting notifications.

Social Media

Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.

LinkedIn

Twitter

Questions?

GSA Contact
Chelsea Boone
Sr. Research Analyst
(T) 972-866-7579 ext. 123
(E) cboone@gsaglobal.org

MS/RF Process Design Kit (PDK) Sub Working Group

Purpose

The Process Design Kit (PDK) Sub-Working Group is developing a format for PDK roadmap representation and development criteria at various stages in the process lifecycle.

Initiatives

Mixed-Signal/RF PDK Checklist – The Working Group has improved and revised the current version of the Checklist to include a "PDK Details" section, which can help one assess if a PDK can be used with a given software.

Deliverables

Mixed-Signal/RF PDK Checklist – A document completed by the process design kit (PDK) developer and delivered with each new release of a mixed-signal/RF PDK. This document helps obtain a better understanding of the source data, completeness and quality of the PDK before using it to design ICs or to modify it to fit into your in-house design flow. A Checklist Users Guide is also available for download.

Leadership

Thomas Moerth, MS/RF PDK Sub-Working Group Chairman, austriamicrosystems
(T) +43 3136 500 5154
(E) thomas.moerth@austriamicrosystems.com

Resources

For copies of meeting minutes prior to 2007, please contact Chelsea Boone.

PDK Checklist Adoption Table

Foundry Process PDK Checklist Version Used Link to PDK Checklist  PDK Support Contact 
Grace Semiconductor Manufacturing Corporation 0.18um IBG MS/RF CMOS 2.0 PDK Checklist Emir Yu
(T)86-21-51318888-83505 (E)emiryu@gsmcthw.com
Silterra Malaysia Sdn Bhd CL130MR 2.0 PDK Checklist

Al Kordesch
(T)60-4-401-5572 (E)al_kordesch@silterra.com

Taiwan Semiconductor Manufacturing Company Ltd. 0.60um, 0.35um, 0.25um, 0.18um, 0.13um, N80um, N90um, N65um 1.5 N/A Bryan Chang
(T) 886-3-563-6688 ext. 7073456 (E)bryan_chang@tsmc.com
austriamicrosystems AG C35 2.0 PDK Checklist
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@austriamicrosystems.com
  S35 2.0 PDK Checklist
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@austriamicrosystems.com
  H35 2.0 PDK Checklist
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@austriamicrosystems.com
Jazz Semiconductor CA18, SBC18 2.0 PDK Checklist
(need customer account)
N/A
X-FAB
Semiconductor Foundries
XC018, XH018, XA035, XH035, XO035, XC06, XB06, XHB06, XT06, CX08A, CX08H, XDH10, XDM10 3.0 N/A

Sabine Perko
(E) sabine.perko@xfab.com

Upcoming Events

PDK Sub-Working Group Meeting
Date: March 30, 2010
Time: 10:00am (Pacific)

Resources

Jan 26, 2010 - PDK Sub-Working Group Meeting Minutes (PDF, 30KB)

For more meeting minutes, see the Resources section below.

Get Involved

Those who deal with MS/RF PDK-related issues are encouraged to get involved.

Join This Working Group – By signing up, you will be added to a distribution list and receive upcoming meeting notifications.

Social Media

Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.

LinkedIn

Twitter

Questions?

GSA Contact
Chelsea Boone
Sr. Research Analyst
(T) 972-866-7579 ext. 123
(E) cboone@gsaglobal.org

MS/RF PCM/Process Checklist Sub Working Group

Purpose

The PCM/Process Checklist Sub-Working Group's mission is to define a standard way of communicating basic process parameters and criteria for mixed-signal/RF processes and to develop standard definitions for quantitative and qualitative metrics that can be used for classification and as figures of merit in selecting an appropriate process and process options for a specific design application.

Initiatives

AMS/RF Process Checklist – The Sub-Working Group has developed a four-page Process Checklist that reflects the key attributes of an AMS/RF foundry process offering and provides standard definitions for quantitative and qualitative metrics that can be used for classification and as figures of merit in selecting an appropriate process and process options for a specific design application. The current version 1.0 includes sections for process type, process release status, process attributes, passive device attributes, foundry logistics, active device attributes, and libraries and IP.

Mixed-Signal/RF PCM Checklist – Now that the Process Checklist is complete, the Working Group's PCM/Process Checklist Sub-Working Group will work to develop a checklist that will help in communicating basic process parameters and criteria for mixed-signal and RF processes.

Deliverables

AMS/RF Process Checklist – This document identifies the different elements of a foundry's AMS/RF process and its ability to fulfill a semiconductor company's needs; it serves as a basic set of guidelines for measuring available items in an AMS/RF foundry process; and it is an efficient way to communicate information in a consistent format across all foundries.

Leadership

David Schwan, PCM/Process Checklist Sub-Working Group Chairman, RF Micro Devices (RFMD)
(T) 408-428-6537
(E) david.schwan@rfmd.com

Resources

Upcoming Events

PCM Checklist Meeting
Date: April 21, 2010
Time: 10:00am (Pacific)

Resources

February 17, 2010 - Meeting Minutes (PDF, 33 KB)

PCM Parameter List w/Measurement Definitions (v4) (MS Excel, 49 KB)

For more meeting mintues, see the Resources section below.

Get Involved

Join This Working Group – By signing up, you will be added to a distribution list and receive upcoming meeting notifications.

Social Media

Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.

LinkedIn

Twitter

Questions?

GSA Contact
Chelsea Boone
Sr. Research Analyst
(T) 972-866-7579 ext. 123
(E) cboone@gsaglobal.org

MS/RF Model Sub Working Group

Purpose

The Model Sub-Working Group is developing mixed-signal and RF requirements for characterization vehicle, SPICE modeling, design-for-manufacturing (DFM) and package modeling.

Initiatives

Mixed-Signal/RF SPICE Model Checklist – The Sub-Working Group is working to further improve and revise the current version (1.2).

Deliverables

Mixed-Signal/RF SPICE Model Checklist – A document completed by the SPICE model developer and delivered with each new release of an SPICE model. This document helps developers better understand the source data, completeness and quality of the model before using it to design ICs or to re-extract it to fit into specific product needs. A Checklist Users Guide and Checklist Taxonomy & Definitions are also available for download.

Leadership

Roberto Tinti, MS/RF Model Sub-Working Group Chairman, Agilent Technologies
(T) 818-879-6368
(E) roberto_tinti@agilent.com

SPICE Model Checklist Adoption Table

Foundry Process SPICE Model Checklist Version Used Link to SPICE
Model Checklist
SPICE Model
Support Contact 
Jazz Semiconductor SBC18, CA18 1.2 Model Checklist
(need customer account)
N/A
Taiwan Semiconductor Manufacturing Company Ltd. 0.60um, 0.35um, 0.25um, 0.18um, 0.13um, N80um, N90um, N65um 1.5 N/A

Bryan Chang
(T)886-3-563-6688 ext. 7073456 (E)bryan_chang@tsmc.com

austriamicrosystems AG C35 1.2 Model Checklist
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@
austriamicrosystems.com
  S35 1.2 Model Checklist
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@
austriamicrosystems.com
  H35 1.2 Model Checklist
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@
austriamicrosystems.com
X-FAB
Semiconductor Foundries
XC018, XH018, XA035, XH035, XO035, XC06, XB06, XHB06, XT06, XDH10, XDM10 1.2 Model Checklist (need customer account) Contact List

Upcoming Events

Events to come.

Resources

Dec 17, 2007 - Model Sub-Working Group Meeting Minutes (PDF, 23 KB)

Mar 20, 2007 - Model Sub-Working Group Meeting Minutes (PDF, 26 KB)

Jan 23, 2007 - Model Sub-Working Group Meeting Minutes (PDF, 26 KB)

For meeting minutes prior to 2007, please contact Chelsea Boone.

Get Involved

Those who deal with MS/RF model-related issues are encouraged to get involved.

Join This Working Group – By signing up, you will be added to a distribution list and receive upcoming meeting notifications.

Social Media

Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.

LinkedIn

Twitter

Questions?

GSA Contact
Chelsea Boone
Sr. Research Analyst
(T) 972-866-7579 ext. 123
(E) cboone@gsaglobal.org

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