- RF/Analog/Mixed-Signal
Working Groups
- MS/RF PDK
Working Group
- MS/RF PCM/Process
Checklist Working Group
- MOS-AK/GSA Modeling
Working Group
RF/Analog/Mixed-Signal Working Groups
The Analog/Mixed-Signal Interest Group's mission of addressing technical and business challenges
within the analog/mixed-signal ecosystem, such as the lack of models, managing the power budget, over
customization (harder to have proven IP blocks), choosing the right process and lack of planning
through the entire process, will be further promoted by its working groups:
For more information regarding these working groups, contact Chelsea Boone, Senior Research
Analyst at 972.866.7579 ext.123 or via email at cboone@gsaglobal.org.
MS/RF Process Design Kit (PDK) Working Group
Purpose
The Process Design Kit (PDK) Working Group is developing a format for PDK roadmap
representation and development criteria at various stages in the process lifecycle.
Initiatives
Creating a industry forum to gain a better understanding of the different PDK formats that currently exist within the industry, how they differ from one another, what they define, who can use them, etc.
Mixed-Signal/RF PDK Checklist – The Working Group has improved and revised the current version
of the Checklist to include a "PDK Details" section, which can help one assess if a PDK
can be used with a given software.
Deliverables
Mixed-Signal/RF
PDK Checklist – A document completed by the process design kit (PDK) developer and delivered
with each new release of a mixed-signal/RF PDK. This document helps obtain a better understanding
of the source data, completeness and quality of the PDK before using it to design ICs or to modify
it to fit into your in-house design flow. A
Checklist
Users Guide is also available for download.
Leadership
Thomas Moerth, MS/RF PDK Working Group Chairman, austriamicrosystems
(T) +43 3136 500 5154
(E) thomas.moerth@austriamicrosystems.com
Resources
- March 30, 2010 - PDK Working Group Meeting Minutes (PDF, 20KB)
- Jan 26, 2010 - PDK Working Group Meeting Minutes (PDF, 30KB)
- Dec 1, 2009 - PDK
Working Group Meeting Presentation (PDF, 2541 KB)
- Nov 10, 2009 - PDK
Working Group Meeting Minutes (PDF, 20 KB)
- Dec 2, 2008 - PDK
Working Group Meeting Minutes (PDF, 19 KB)
- Nov 4, 2008 - PDK
Working Group Meeting Minutes (PDF, 24 KB)
- Oct 7, 2008 - PDK
Working Group Meeting Minutes (PDF, 21 KB)
- June 24, 2008 - PDK
Working Group Meeting Minutes (PDF, 20 KB)
- Apr 22, 2008 - PDK
Working Group Meeting Minutes (PDF, 21 KB)
- Feb 26, 2008 - PDK
Working Group Meeting Minutes (PDF, 21 KB)
- Oct 23, 2007 - PDK
Working Group Meeting Minutes (PDF, 26 KB)
- July 10, 2007 - PDK
Working Group Meeting Minutes (PDF, 26 KB)
- Apr 24, 2007 - PDK
Working Group Meeting Minutes (PDF, 23 KB)
- Feb 27, 2007 - PDK
Working Group Meeting Minutes (PDF, 23 KB)
- Jan 9, 2007 - PDK
Working Group Meeting Minutes (PDF, 23 KB)
For copies of meeting minutes prior to 2007, please contact Chelsea Boone.
PDK Checklist Adoption Table
| Foundry |
Process |
PDK Checklist Version Used |
Link to PDK Checklist |
PDK Support Contact |
| Grace Semiconductor Manufacturing Corporation |
0.18um IBG MS/RF CMOS |
2.0 |
PDK Checklist |
Emir Yu
(T)86-21-51318888-83505 (E)emiryu@gsmcthw.com |
| Silterra Malaysia Sdn Bhd |
CL130MR |
2.0 |
PDK Checklist |
Al Kordesch
(T)60-4-401-5572 (E)al_kordesch@silterra.com |
| Taiwan Semiconductor Manufacturing Company Ltd. |
0.60um, 0.35um, 0.25um, 0.18um, 0.13um, N80um, N90um, N65um |
1.5 |
N/A |
Bryan Chang
(T) 886-3-563-6688 ext. 7073456 (E)bryan_chang@tsmc.com |
| austriamicrosystems AG |
C35 |
2.0 |
PDK Checklist
|
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@austriamicrosystems.com |
| |
S35 |
2.0 |
PDK Checklist
|
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@austriamicrosystems.com |
| |
H35 |
2.0 |
PDK Checklist
|
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@austriamicrosystems.com |
| Jazz Semiconductor |
CA18, SBC18 |
2.0 |
PDK Checklist
(need customer account) |
N/A |
X-FAB
Semiconductor Foundries |
XC018, XH018, XA035, XH035, XO035, XC06, XB06, XHB06, XT06, CX08A, CX08H, XDH10, XDM10 |
3.0 |
PDK Checklist (ID and Passcode Needed) |
Sabine Perko
(E) sabine.perko@xfab.com |
|
Get Involved
Those who deal with MS/RF PDK-related issues are encouraged to get involved.
Join This Working Group – By signing up, you will
be added to a distribution list and receive upcoming meeting notifications.
Social Media
Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.


Questions?
GSA Contact
Chelsea Boone
Sr. Research Analyst
(T) 972-866-7579 ext. 123
(E) cboone@gsaglobal.org
|
MS/RF PCM/Process Checklist Working Group
Purpose
The PCM/Process Checklist Working Group's mission is to define a standard way of communicating
basic process parameters and criteria for mixed-signal/RF processes and to develop standard
definitions for quantitative and qualitative metrics that can be used for classification and as
figures of merit in selecting an appropriate process and process options for a specific design
application.
Initiatives
AMS/RF Process Checklist – The Working Group has developed a four-page Process Checklist
that reflects the key attributes of an AMS/RF foundry process offering and provides standard
definitions for quantitative and qualitative metrics that can be used for classification and as
figures of merit in selecting an appropriate process and process options for a specific design
application. The current version 1.0 includes sections for process type, process release status,
process attributes, passive device attributes, foundry logistics, active device attributes, and
libraries and IP.
Mixed-Signal/RF PCM Checklist – Now that the Process Checklist is complete, the Working Group will work to develop a checklist that will help in
communicating basic process parameters and criteria for mixed-signal and RF processes.
Deliverables
AMS/RF
Process Checklist – This document identifies the different elements of a foundry's AMS/RF
process and its ability to fulfill a semiconductor company's needs; it serves as a basic
set of guidelines for measuring available items in an AMS/RF foundry process; and it is an efficient
way to communicate information in a consistent format across all foundries.
Leadership
David Schwan, PCM/Process Checklist Working Group Chairman
(E) davidsch@earthlink.net
Resources
- February 17, 2010 - PCM/Process Checklist Working Group Meeting Minutes (PDF, 33 KB)
- Oct 21, 2009 - PCM/Process Checklist Working Group Meeting Minutes (PDF, 34 KB)
- Sept 23, 2009 - PCM/Process Checklist Working
Group Meeting Minutes (PDF, 35 KB)
- Jun 24, 2009 - PCM/Process Checklist Working
Group Meeting Minutes (PDF, 33 KB)
- May 20, 2009 - PCM/Process Checklist Working
Group Meeting Minutes (PDF, 33 KB)
- Feb 18, 2009 - PCM/Process Checklist
Working Group Meeting Minutes (PDF, 24 KB)
- Dec 4, 2007 - PCM/Process
Checklist Working Group Meeting Minutes (PDF, 23 KB)
- Nov 5, 2007 - PCM/Process
Checklist Working Group Meeting Minutes (PDF, 29 KB)
- Apr 17, 2007 - Process
Checklist Working Group Meeting Minutes (PDF, 26 KB)
- Mar 13, 2007 - Process
Checklist Working Group Meeting Minutes (PDF, 26 KB)
- Jan 30, 2007 - Process
Checklist Working Group Meeting Minutes (PDF, 26 KB)
|
Get Involved
Join This Working Group – By signing up, you will
be added to a distribution list and receive upcoming meeting notifications.
Social Media
Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.


Questions?
GSA Contact
Chelsea Boone
Sr. Research Analyst
(T) 972-866-7579 ext. 123
(E) cboone@gsaglobal.org
|
MOS-AK/GSA Modeling Working Group
|
In January 2009, GSA merged its efforts with MOS-AK, a
well-known industry compact modeling volunteer group primarily focused in Europe,
to re-activate its Modeling Working Group. In April 2010, the MOS-AK/GSA Modeling Working Group then merged its efforts with GSA's MS/RF Model Working Group. Its purpose, initatives and deliverables
coincide with MOS-AK's purpose, initatives and delieverables as outlined below.
Purpose
To Connect:
- Encourage interaction and sharing of all information related to compact modeling at all
levels of the device and circuit characterization, modeling and simulations. The Working Group
aspires to build a community with global connections by:
- Promoting standardization of compact models and its implementation into software tools.
- Connecting national and local modeling groups.
- Building strong bilateral ties with similar organizations around the world.
To Benchmark:
- Conduct regular meetings with industry players and academia to exchange information on the strengths and weaknesses of the industrialization of compact models. Activities include:
- Drafting of standards and providing a center of competence for engineers, designers,
managers and decision makers.
- Evaluating world-wide best practices and success stories.
- Delivering a comprehensive view of compact modeling education
To Educate:
- The Working Group believes that the transfer of advanced compact modeling methodologies to
industry can be accelerated by providing comprehensive reports and reference papers on the subjects of:
- Basic issues and concepts of device characterization and compact modeling.
- Global device characterization and compact modeling issues.
- Examples and analysis of best practice of the commercialization of compact models.
Initiatives
The MOS-AK/GSA Modeling Working Group will play a central role in developing a common language among
foundries, CAD vendors, IC designers and model developers by contributing and promoting different
elements of compact model standardization and related tools for model development, validation/implementation
and distribution.
Deliverables
2010 Events:
- MOS-AK/GSA Modeling Workshop
Date: April 8-9, 2010
Location: The Faculty of Engineering, Sapienza Università di Roma, Via Eudossiana 18, Rome
Press Release (April 26, 2010): MOS-AK/GSA Modeling Working Group Holds Workshop in Rome
- Analog Modeling Panel in connection with GSA & IET International Semiconductor Forum
Date: May 18, 9:00am-12:00pm
Location: Novotel London St Pancras
- Special MIXDES Modeling Session
Date: June 24-26
Location: Wroclaw, Poland
- Compact Modeling Training Course
Date: June 30-July 1
Location: Tarragona, Spain
- MOS-AK/GSA Modeling Workshop
Date: Sept. 17
Location: Seville, Spain
- MOS-AK/GSA Modeling Meeting
Date: Dec. 2010
Location: San Francisco, CA
Publications: All publications can be found online at http://www.mos-ak.org/.
Books:
- Transistor Level Modeling for Analog/RF IC Design; Editors:W.Grabinski, B.Nauwelaers,
D.Schreurs ISBN: 1-4020-4555-7; 2006, Approx. 290 p., Hardcover; www.springer.com
- Power/HVMOS Devices Compact Modeling Editors:W.Grabinski, T.Gneiting ISBN: n/a, Approx.
250 p., (2009 exp) Hardcover; www.springer.com
Tools:
Mixed-Signal/RF SPICE Model Checklist – A document completed by the SPICE model developer and delivered with each new release of an SPICE model. This document helps developers better understand the source data, completeness and quality of the model before using it to design ICs or to re-extract it to fit into specific product needs. A Checklist Users Guide and Checklist Taxonomy & Definitions are also available for download.
SPICE Model Checklist Adoption Table
| Foundry |
Process |
SPICE Model Checklist Version Used |
Link to SPICE
Model Checklist |
SPICE Model
Support Contact |
| Jazz Semiconductor |
SBC18, CA18 |
1.2 |
Model
Checklist
(need customer account) |
N/A |
| Taiwan Semiconductor Manufacturing Company Ltd. |
0.60um, 0.35um, 0.25um, 0.18um, 0.13um, N80um, N90um, N65um |
1.5 |
N/A |
Bryan Chang
(T)886-3-563-6688 ext. 7073456 (E)bryan_chang@tsmc.com |
| austriamicrosystems AG |
C35 |
1.2 |
Model Checklist
|
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@
austriamicrosystems.com |
| |
S35 |
1.2 |
Model Checklist
|
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@
austriamicrosystems.com |
| |
H35 |
1.2 |
Model Checklist
|
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@
austriamicrosystems.com |
X-FAB
Semiconductor Foundries |
XC018, XH018, XA035, XH035, XO035, XC06, XB06, XHB06, XT06, XDH10, XDM10 |
1.2 |
Model Checklist (need customer account) |
Contact List |
Leadership
|
North America
Chair: Pekka Ojala, Exar Corporation
(T) 510.668.7543
(E) pekka.ojala@exar.com
Co-Chair:
Geoffrey Coram,
Analog Devices, Inc.
Co-Chair: Jamal Deen, McMaster University
Co-Chair:
Roberto Tinti, Agilent EEsof Division
South America
Chair: Prof. Gilson I Wirth, Universidade Federal Do Rio Grande Do Sul (UFRGS), Brazil
(T)
+ 55 (51) 3308-4443
(E)
wirth@inf.ufrgs.br
Co-Chair: Prof. Carlos Galup-Montoro, Universidade Federal de Santa Catarina (UFSC), Brazil
Co-Chair: TBD
Europe
Chair: Ehrenfried Seebacher, austriamicrosystems AG
(T) +43 3136 500 5487
(E) ehrenfried.seebacher@austriamicrosystems.com
Co-Chair: Sebastian Schmidt, X-FAB Semiconductor Foundries AG
Co-Chair: Benjamin Iniguez, Universitat Rovira I Virgili (URV) |
Asia
Chair:
Goichi Yokomizo, STARC
(T) +81-45-478-3750
(E) yokomizo.goichi@starc.or.jp
Co-Chair: Sadayuki Yoshitomi, Toshiba
Co-Chair:
Prof. Xing Zhou,
Nanyang Technological University
MOS-AK/GSA Group Manager
Wladek Grabinski, GMC Suisse
(T)
+41 22 349 0939
(E) wladek@grabinski.ch |
|
Get Involved
Those who deal with modeling-related issues, such as model generation, extraction,
validation and comparison are encouraged to get involved (modeling engineers, model developers,
compact model designers, etc.).
Join This Working Group – By signing up, you will
be added to a distribution list and receive upcoming meeting notifications.
Social Media
Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.


Questions?
GSA Contact
Chelsea Boone, Sr. Research Analyst
(T) 972-866-7579 ext. 123
(E) cboone@gsaglobal.org
|
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