- RF/Analog/Mixed-Signal
Working Groups
- MS/RF PDK
Working Group
- MS/RF PCM/Process
Checklist Working Group
- MOS-AK/GSA Modeling
Working Group
RF/Analog/Mixed-Signal Working Groups
The Analog/Mixed-Signal Working Group's mission of addressing technical and business challenges
within the analog/mixed-signal ecosystem, such as the lack of models, managing the power budget, over
customization (harder to have proven IP blocks), choosing the right process and lack of planning
through the entire process, will be further promoted by its sub-working groups:
For more information regarding these sub-working groups, contact Chelsea Boone, Director or Research, at
(972) 866-7579 ext. 123 or via email at cboone@gsaglobal.org.
MS/RF Process Design Kit (PDK) Working Group
Purpose
The Process Design Kit (PDK) Sub-Working Group is developing a format for PDK roadmap
representation and development criteria at various stages in the process lifecycle.
Initiatives
Creating a industry forum to gain a better understanding of the different PDK formats that currently exist within the industry, how they differ from one another, what they define, who can use them, etc.
Mixed-Signal/RF PDK Checklist – The Sub-Working Group has improved and revised the current version
of the Checklist to include a "PDK Details" section, which can help one assess if a PDK
can be used with a given software.
Deliverables
Mixed-Signal/RF
PDK Checklist – A document completed by the process design kit (PDK) developer and delivered
with each new release of a mixed-signal/RF PDK. This document helps obtain a better understanding
of the source data, completeness and quality of the PDK before using it to design ICs or to modify
it to fit into your in-house design flow. A
Checklist
Users Guide is also available for download.
Leadership
Thomas Moerth, MS/RF PDK Sub-Working Group Chairman, austriamicrosystems
(T) +43 3136 500 5154
(E) thomas.moerth@austriamicrosystems.com
Resources
- Jan 31, 2011 Meeting - PDK WG Meeting Minutes (PDF, 32 KB), GSA Presentation (PDF, 263 KB), IPL Presentation (PDF, 868 KB), OpenPDK Presentation (PDF, 237 KB)
- Sept 16, 2010 -PDK WG Meeting Minutes (PDF, 19 KB), GSA Presentation (PDF, 634 KB), IPL Presentation (PDF, 2022 KB), TSMC Presentation (PDF, 258 KB), Si2 Presentation (PDF, 139 KB)
- May 25, 2010 - PDK Working Group Meeting Minutes (24 KB)
- March 30, 2010 - PDK Working Group Meeting Minutes (PDF, 20KB)
- Jan 26, 2010 - PDK Working Group Meeting Minutes (PDF, 30KB)
- Dec 1, 2009 - PDK
Working Group Meeting Presentation (PDF, 2541 KB)
- Nov 10, 2009 - PDK
Working Group Meeting Minutes (PDF, 20 KB)
- Dec 2, 2008 - PDK
Working Group Meeting Minutes (PDF, 19 KB)
- Nov 4, 2008 - PDK
Working Group Meeting Minutes (PDF, 24 KB)
- Oct 7, 2008 - PDK
Working Group Meeting Minutes (PDF, 21 KB)
- June 24, 2008 - PDK
Working Group Meeting Minutes (PDF, 20 KB)
- Apr 22, 2008 - PDK
Working Group Meeting Minutes (PDF, 21 KB)
- Feb 26, 2008 - PDK
Working Group Meeting Minutes (PDF, 21 KB)
- Oct 23, 2007 - PDK
Working Group Meeting Minutes (PDF, 26 KB)
- July 10, 2007 - PDK
Working Group Meeting Minutes (PDF, 26 KB)
- Apr 24, 2007 - PDK
Working Group Meeting Minutes (PDF, 23 KB)
- Feb 27, 2007 - PDK
Working Group Meeting Minutes (PDF, 23 KB)
- Jan 9, 2007 - PDK
Working Group Meeting Minutes (PDF, 23 KB)
For copies of meeting minutes prior to 2007, please contact Chelsea Boone.
PDK Checklist Adoption Table
| Foundry |
Process |
PDK Checklist Version Used |
Link to PDK Checklist |
PDK Support Contact |
| Grace Semiconductor Manufacturing Corporation |
0.18um IBG MS/RF CMOS |
2.0 |
PDK Checklist |
Emir Yu
(T)86-21-51318888-83505 (E)emiryu@gsmcthw.com |
| Silterra Malaysia Sdn Bhd |
CL130MR |
2.0 |
PDK Checklist |
Al Kordesch
(T)60-4-401-5572 (E)al_kordesch@silterra.com |
| Taiwan Semiconductor Manufacturing Company Ltd. |
0.60um, 0.35um, 0.25um, 0.18um, 0.13um, N80um, N90um, N65um |
1.5 |
N/A |
Bryan Chang
(T) 886-3-563-6688 ext. 7073456 (E)bryan_chang@tsmc.com |
| austriamicrosystems AG |
C35 |
2.0 |
PDK Checklist
|
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@austriamicrosystems.com |
| |
S35 |
2.0 |
PDK Checklist
|
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@austriamicrosystems.com |
| |
H35 |
2.0 |
PDK Checklist
|
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@austriamicrosystems.com |
| Jazz Semiconductor |
CA18, SBC18 |
2.0 |
PDK Checklist
(need customer account) |
N/A |
X-FAB
Semiconductor Foundries |
XC018, XH018, XA035, XH035, XO035, XC06, XB06, XHB06, XT06, CX08A, CX08H, XDH10, XDM10 |
3.0 |
PDK Checklist (ID and Passcode Needed) |
Sabine Perko
(E) sabine.perko@xfab.com |
|
Upcoming Events
PDK Sub-Working Group Meeting
Date: September 12 or 13, 2011 (TBD)
Time:
10am PST
Place: Teleconference
Resources
May 24, 2011 Meeting
For more meeting minutes, see the Resources section below.
Get Involved
Those who deal with MS/RF PDK-related issues are encouraged to get involved.
Join This Sub-Working Group – By signing up, you will
be added to a distribution list and receive upcoming meeting notifications.
Social Media
Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.


Questions?
GSA Contact
Chelsea Boone
Director of Research
(T) 972-866-7579 ext. 123
(E) cboone@gsaglobal.org
|
MS/RF PCM/Process Checklist Working Group
Purpose
The PCM/Process Checklist Sub-Working Group's mission is to define a standard way of communicating
basic process parameters and criteria for mixed-signal/RF processes and to develop standard
definitions for quantitative and qualitative metrics that can be used for classification and as
figures of merit in selecting an appropriate process and process options for a specific design
application.
Initiatives
AMS/RF Process Checklist – The Sub-Working Group has developed a four-page Process Checklist
that reflects the key attributes of an AMS/RF foundry process offering and provides standard
definitions for quantitative and qualitative metrics that can be used for classification and as
figures of merit in selecting an appropriate process and process options for a specific design
application. The current version 1.0 includes sections for process type, process release status,
process attributes, passive device attributes, foundry logistics, active device attributes, and
libraries and IP.
AMS/RF Process Control Monitoring (PCM) Checklist – The Sub-Working Group has developed a Checklist that provides a recommended list of parameters that foundries should measure (i.e., test); a uniform way to measure each parameter (i.e., describe the measurement); and a consistent way to describe the test data.
Deliverables
AMS/RF Process Control Monitoring (PCM) Checklist – Provides a recommended list of parameters that foundries should measure (i.e., test); a uniform way to measure each parameter (i.e., describe the measurement); and a consistent way to describe the test data.
AMS/RF
Process Checklist – Identifies the different elements of a foundry's AMS/RF
process and its ability to fulfill a semiconductor company's needs; it serves as a basic
set of guidelines for measuring available items in an AMS/RF foundry process; and it is an efficient
way to communicate information in a consistent format across all foundries.
Leadership
David Schwan, PCM/Process Checklist Sub-Working Group Chairman
(E) dschwan@volterra.com
Resources
- Sept 16, 2010 - PCM/Process ChecklistWorking Group Meeting Minutes (PDF, 33 KB)
- May 20, 2010 - PCM/Process Checklist Working Group Meeting Minutes (PDF, 33 KB)
- February 17, 2010 - PCM/Process Checklist Working Group Meeting Minutes (PDF, 33 KB)
- Oct 21, 2009 - PCM/Process Checklist Working Group Meeting Minutes (PDF, 34 KB)
- Sept 23, 2009 - PCM/Process Checklist Working
Group Meeting Minutes (PDF, 35 KB)
- Jun 24, 2009 - PCM/Process Checklist Working
Group Meeting Minutes (PDF, 33 KB)
- May 20, 2009 - PCM/Process Checklist Working
Group Meeting Minutes (PDF, 33 KB)
- Feb 18, 2009 - PCM/Process Checklist
Working Group Meeting Minutes (PDF, 24 KB)
- Dec 4, 2007 - PCM/Process
Checklist Working Group Meeting Minutes (PDF, 23 KB)
- Nov 5, 2007 - PCM/Process
Checklist Working Group Meeting Minutes (PDF, 29 KB)
- Apr 17, 2007 - Process
Checklist Working Group Meeting Minutes (PDF, 26 KB)
- Mar 13, 2007 - Process
Checklist Working Group Meeting Minutes (PDF, 26 KB)
- Jan 30, 2007 - Process
Checklist Working Group Meeting Minutes (PDF, 26 KB)
|
Upcoming Events
PCM Checklist Sub-WG Meeting
Date: June 30, 2011
Time: 9am PST
Place: Teleconference
Resources
May 26, 2011 Meeting
For more meeting minutes, see the Resources section below.
Get Involved
Join This Sub-Working Group – By signing up, you will
be added to a distribution list and receive upcoming meeting notifications.
Social Media
Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.


Questions?
GSA Contact
Chelsea Boone
Director of Research
(T) 972-866-7579 ext. 123
(E) cboone@gsaglobal.org
|
MOS-AK/GSA Modeling Working Group
|
In January 2009, GSA merged its efforts with MOS-AK, a
well-known industry compact modeling volunteer group primarily focused in Europe,
to re-activate its Modeling Working Group. In April 2010, the MOS-AK/GSA Modeling Working Group then merged its efforts with GSA's MS/RF Model Working Group. Its purpose, initatives and deliverables
coincide with MOS-AK's purpose, initatives and delieverables as outlined below.
Purpose
To Connect:
- Encourage interaction and sharing of all information related to compact modeling at all
levels of the device and circuit characterization, modeling and simulations. The Sub-Working Group
aspires to build a community with global connections by:
- Promoting standardization of compact models and its implementation into software tools.
- Connecting national and local modeling groups.
- Building strong bilateral ties with similar organizations around the world.
To Benchmark:
- Conduct regular meetings with industry players and academia to exchange information on the strengths and weaknesses of the industrialization of compact models. Activities include:
- Drafting of standards and providing a center of competence for engineers, designers,
managers and decision makers.
- Evaluating world-wide best practices and success stories.
- Delivering a comprehensive view of compact modeling education
To Educate:
- The Sub-Working Group believes that the transfer of advanced compact modeling methodologies to
industry can be accelerated by providing comprehensive reports and reference papers on the subjects of:
- Basic issues and concepts of device characterization and compact modeling.
- Global device characterization and compact modeling issues.
- Examples and analysis of best practice of the commercialization of compact models.
Initiatives
The MOS-AK/GSA Modeling Sub-Working Group will play a central role in developing a common language among
foundries, CAD vendors, IC designers and model developers by contributing and promoting different
elements of compact model standardization and related tools for model development, validation/implementation
and distribution.
Deliverables
2012 Events:
2011 Events:
2010 Events:
- MOS-AK/GSA Modeling Workshop
Date: December 8, 2010
Location: San Francisco, California
Press Release (January 10, 2011): MOS-AK/GSA Modeling Working Group Holds Workshop in San Francisco
- MOS-AK/GSA Modeling Workshop
Date: April 8-9, 2010
Location: The Faculty of Engineering, Sapienza Università di Roma, Via Eudossiana 18, Rome
Press Release (April 26, 2010): MOS-AK/GSA Modeling Working Group Holds Workshop in Rome
- Analog Modeling Panel in connection with GSA & IET International Semiconductor Forum
Date: May 18, 9:00am-12:00pm
Location: Novotel London St Pancras
Press Release (June 14, 2010): Modeling Workshop Panel Brings Complexity Challenges to Forefront
- Special MIXDES Modeling Session
Date: June 24-26
Location: Wroclaw, Poland
- Compact Modeling Training Course
Date: June 30-July 1
Location: Tarragona, Spain
- MOS-AK/GSA Modeling Workshop
Date: Sept. 17
Location: Seville, Spain
Press Release (October 14, 2010): MOS-AK/GSA Modeling Working Group Holds Workshop in Seville
- MOS-AK/GSA Modeling Workshop
Date: Dec 8, 2010
Location: San Francisco, CA
Press Release (January 10, 2011): MOS-AK/GSA Modeling Working Group Holds Workshop in San
Francisco
Publications: All publications can be found online at http://www.mos-ak.org/.
Books:
- Transistor Level Modeling for Analog/RF IC Design; Editors:W.Grabinski, B.Nauwelaers,
D.Schreurs ISBN: 1-4020-4555-7; 2006, Approx. 290 p., Hardcover; www.springer.com
- Power/HVMOS Devices Compact Modeling Editors:W.Grabinski, T.Gneiting ISBN: n/a, Approx.
250 p., (2009 exp) Hardcover; www.springer.com
Tools:
Mixed-Signal/RF SPICE Model Checklist – A document completed by the SPICE model developer and delivered with each new release of an SPICE model. This document helps developers better understand the source data, completeness and quality of the model before using it to design ICs or to re-extract it to fit into specific product needs. A Checklist Users Guide and Checklist Taxonomy & Definitions are also available for download.
SPICE Model Checklist Adoption Table
| Foundry |
Process |
SPICE Model Checklist Version Used |
Link to SPICE
Model Checklist |
SPICE Model
Support Contact |
| Jazz Semiconductor |
SBC18, CA18 |
1.2 |
Model
Checklist
(need customer account) |
N/A |
| Taiwan Semiconductor Manufacturing Company Ltd. |
0.60um, 0.35um, 0.25um, 0.18um, 0.13um, N80um, N90um, N65um |
1.5 |
N/A |
Bryan Chang
(T)886-3-563-6688 ext. 7073456 (E)bryan_chang@tsmc.com |
| austriamicrosystems AG |
C35 |
1.2 |
Model Checklist
|
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@
austriamicrosystems.com |
| |
S35 |
1.2 |
Model Checklist
|
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@
austriamicrosystems.com |
| |
H35 |
1.2 |
Model Checklist
|
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@
austriamicrosystems.com |
X-FAB
Semiconductor Foundries |
XC018, XH018, XA035, XH035, XO035, XC06, XB06, XHB06, XT06, XDH10, XDM10 |
1.2 |
Model Checklist (need customer account) |
Contact List |
Leadership
|
North America
Chair: Pekka Ojala, Exar Corporation
(T) 510.668.7543
(E) pekka.ojala@exar.com
Co-Chair:
Geoffrey Coram,
Analog Devices, Inc.
Co-Chair: Jamal Deen, McMaster University
Co-Chair:
Roberto Tinti, Agilent EEsof Division
South America
Chair: Prof. Gilson I Wirth, Universidade Federal Do Rio Grande Do Sul (UFRGS), Brazil
(T)
+ 55 (51) 3308-4443
(E)
wirth@inf.ufrgs.br
Co-Chair: Prof. Carlos Galup-Montoro, Universidade Federal de Santa Catarina (UFSC), Brazil
Co-Chair:
Sergio Bampi,
Universidade Federal Do Rio Grande Do Sul (UFRGS), Brazil
Co-Chair: Antonio Cerdeira Altuzarra, Cinvestav - IPN
Europe
Chair: Ehrenfried Seebacher, austriamicrosystems AG
(T) +43 3136 500 5487
(E) ehrenfried.seebacher@austriamicrosystems.com
Co-Chair: Alexander Petr, X-FAB Semiconductor Foundries AG
Co-Chair: Benjamin Iniguez, Universitat Rovira I Virgili (URV)
Co-Chair: James Victory, Sentinel IC Technologies |
Asia
Chair:
Goichi Yokomizo, STARC
(T) +81-45-478-3750
(E) yokomizo.goichi@starc.or.jp
Co-Chair: Sadayuki Yoshitomi, Toshiba
Co-Chair:
Prof. Xing Zhou,
Nanyang Technological University
Co-Chair: A.B. Bhattacharyya, JIIT
MOS-AK/GSA Group Manager
Wladek Grabinski
(T)
+41 22 349 0939
(E) wladek@mos-ak.org |
|
Upcoming Events
Q1 MOS-AK/GSA Modeling Workshop
Date: March 16-18, 2012
Location:
Noida, India
Get Involved
Those who deal with modeling-related issues, such as model generation, extraction,
validation and comparison are encouraged to get involved (modeling engineers, model developers,
compact model designers, etc.).
Join This Sub-Working Group – By signing up, you will
be added to a distribution list and receive upcoming meeting notifications.
Social Media
Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.


Questions?
GSA Contact
Chelsea Boone
Director of Research
(T) 972-866-7579 ext. 123
(E) cboone@gsaglobal.org
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