GSA Member Login | February 3, 2012
RF / Analog / Mixed-Signal
  • RF/Analog/Mixed-Signal
    Working Groups
  • MS/RF PDK
    Working Group
  • MS/RF PCM/Process
    Checklist Working Group
  • MOS-AK/GSA Modeling
    Working Group

RF/Analog/Mixed-Signal Working Groups

The Analog/Mixed-Signal Working Group's mission of addressing technical and business challenges within the analog/mixed-signal ecosystem, such as the lack of models, managing the power budget, over customization (harder to have proven IP blocks), choosing the right process and lack of planning through the entire process, will be further promoted by its sub-working groups:

For more information regarding these sub-working groups, contact Chelsea Boone, Director or Research, at (972) 866-7579 ext. 123 or via email at cboone@gsaglobal.org.

MS/RF Process Design Kit (PDK) Working Group

Purpose

The Process Design Kit (PDK) Sub-Working Group is developing a format for PDK roadmap representation and development criteria at various stages in the process lifecycle.

Initiatives

Creating a industry forum to gain a better understanding of the different PDK formats that currently exist within the industry, how they differ from one another, what they define, who can use them, etc.

Mixed-Signal/RF PDK Checklist – The Sub-Working Group has improved and revised the current version of the Checklist to include a "PDK Details" section, which can help one assess if a PDK can be used with a given software.

Deliverables

Mixed-Signal/RF PDK Checklist – A document completed by the process design kit (PDK) developer and delivered with each new release of a mixed-signal/RF PDK. This document helps obtain a better understanding of the source data, completeness and quality of the PDK before using it to design ICs or to modify it to fit into your in-house design flow. A Checklist Users Guide is also available for download.

Leadership

Thomas Moerth, MS/RF PDK Sub-Working Group Chairman, austriamicrosystems
(T) +43 3136 500 5154
(E) thomas.moerth@austriamicrosystems.com

Resources

For copies of meeting minutes prior to 2007, please contact Chelsea Boone.

PDK Checklist Adoption Table

Foundry Process PDK Checklist Version Used Link to PDK Checklist  PDK Support Contact 
Grace Semiconductor Manufacturing Corporation 0.18um IBG MS/RF CMOS 2.0 PDK Checklist Emir Yu
(T)86-21-51318888-83505 (E)emiryu@gsmcthw.com
Silterra Malaysia Sdn Bhd CL130MR 2.0 PDK Checklist

Al Kordesch
(T)60-4-401-5572 (E)al_kordesch@silterra.com

Taiwan Semiconductor Manufacturing Company Ltd. 0.60um, 0.35um, 0.25um, 0.18um, 0.13um, N80um, N90um, N65um 1.5 N/A Bryan Chang
(T) 886-3-563-6688 ext. 7073456 (E)bryan_chang@tsmc.com
austriamicrosystems AG C35 2.0 PDK Checklist
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@austriamicrosystems.com
  S35 2.0 PDK Checklist
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@austriamicrosystems.com
  H35 2.0 PDK Checklist
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@austriamicrosystems.com
Jazz Semiconductor CA18, SBC18 2.0 PDK Checklist
(need customer account)
N/A
X-FAB
Semiconductor Foundries
XC018, XH018, XA035, XH035, XO035, XC06, XB06, XHB06, XT06, CX08A, CX08H, XDH10, XDM10 3.0 PDK Checklist (ID and Passcode Needed)

Sabine Perko
(E) sabine.perko@xfab.com

Upcoming Events

PDK Sub-Working Group Meeting
Date: September 12 or 13, 2011 (TBD)
Time: 10am PST
Place: Teleconference


Resources

May 24, 2011 Meeting

For more meeting minutes, see the Resources section below.

Get Involved

Those who deal with MS/RF PDK-related issues are encouraged to get involved.

Join This Sub-Working Group – By signing up, you will be added to a distribution list and receive upcoming meeting notifications.

Social Media

Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.

LinkedIn

Twitter

Questions?

GSA Contact
Chelsea Boone
Director of Research
(T) 972-866-7579 ext. 123
(E) cboone@gsaglobal.org

MS/RF PCM/Process Checklist Working Group

Purpose

The PCM/Process Checklist Sub-Working Group's mission is to define a standard way of communicating basic process parameters and criteria for mixed-signal/RF processes and to develop standard definitions for quantitative and qualitative metrics that can be used for classification and as figures of merit in selecting an appropriate process and process options for a specific design application.

Initiatives

AMS/RF Process Checklist – The Sub-Working Group has developed a four-page Process Checklist that reflects the key attributes of an AMS/RF foundry process offering and provides standard definitions for quantitative and qualitative metrics that can be used for classification and as figures of merit in selecting an appropriate process and process options for a specific design application. The current version 1.0 includes sections for process type, process release status, process attributes, passive device attributes, foundry logistics, active device attributes, and libraries and IP.

AMS/RF Process Control Monitoring (PCM) Checklist – The Sub-Working Group has developed a Checklist that provides a recommended list of parameters that foundries should measure (i.e., test); a uniform way to measure each parameter (i.e., describe the measurement); and a consistent way to describe the test data.

Deliverables

AMS/RF Process Control Monitoring (PCM) Checklist – Provides a recommended list of parameters that foundries should measure (i.e., test); a uniform way to measure each parameter (i.e., describe the measurement); and a consistent way to describe the test data.

AMS/RF Process Checklist – Identifies the different elements of a foundry's AMS/RF process and its ability to fulfill a semiconductor company's needs; it serves as a basic set of guidelines for measuring available items in an AMS/RF foundry process; and it is an efficient way to communicate information in a consistent format across all foundries.

Leadership

David Schwan, PCM/Process Checklist Sub-Working Group Chairman
(E) dschwan@volterra.com

Resources

Upcoming Events

PCM Checklist Sub-WG Meeting
Date: June 30, 2011
Time: 9am PST
Place: Teleconference

Resources

May 26, 2011 Meeting

For more meeting minutes, see the Resources section below.

Get Involved

Join This Sub-Working Group – By signing up, you will be added to a distribution list and receive upcoming meeting notifications.

Social Media

Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.

LinkedIn

Twitter

Questions?

GSA Contact
Chelsea Boone
Director of Research
(T) 972-866-7579 ext. 123
(E) cboone@gsaglobal.org

MOS-AK/GSA Modeling Working Group

In January 2009, GSA merged its efforts with MOS-AK, a well-known industry compact modeling volunteer group primarily focused in Europe, to re-activate its Modeling Working Group. In April 2010, the MOS-AK/GSA Modeling Working Group then merged its efforts with GSA's MS/RF Model Working Group. Its purpose, initatives and deliverables coincide with MOS-AK's purpose, initatives and delieverables as outlined below.

Purpose

To Connect:

  • Encourage interaction and sharing of all information related to compact modeling at all levels of the device and circuit characterization, modeling and simulations. The Sub-Working Group aspires to build a community with global connections by:
    • Promoting standardization of compact models and its implementation into software tools.
    • Connecting national and local modeling groups.
    • Building strong bilateral ties with similar organizations around the world.

To Benchmark:

  • Conduct regular meetings with industry players and academia to exchange information on the strengths and weaknesses of the industrialization of compact models. Activities include:
    • Drafting of standards and providing a center of competence for engineers, designers, managers and decision makers.
    • Evaluating world-wide best practices and success stories.
    • Delivering a comprehensive view of compact modeling education

To Educate:

  • The Sub-Working Group believes that the transfer of advanced compact modeling methodologies to industry can be accelerated by providing comprehensive reports and reference papers on the subjects of:
    • Basic issues and concepts of device characterization and compact modeling.
    • Global device characterization and compact modeling issues.
    • Examples and analysis of best practice of the commercialization of compact models.

Initiatives

The MOS-AK/GSA Modeling Sub-Working Group will play a central role in developing a common language among foundries, CAD vendors, IC designers and model developers by contributing and promoting different elements of compact model standardization and related tools for model development, validation/implementation and distribution.

Modeling Initiatives

Deliverables

2012 Events:

2011 Events:

2010 Events:

Publications: All publications can be found online at http://www.mos-ak.org/.

Books:

  • Transistor Level Modeling for Analog/RF IC Design; Editors:W.Grabinski, B.Nauwelaers, D.Schreurs ISBN: 1-4020-4555-7; 2006, Approx. 290 p., Hardcover; www.springer.com
  • Power/HVMOS Devices Compact Modeling Editors:W.Grabinski, T.Gneiting ISBN: n/a, Approx. 250 p., (2009 exp) Hardcover; www.springer.com

Tools:

Mixed-Signal/RF SPICE Model Checklist – A document completed by the SPICE model developer and delivered with each new release of an SPICE model. This document helps developers better understand the source data, completeness and quality of the model before using it to design ICs or to re-extract it to fit into specific product needs. A Checklist Users Guide and Checklist Taxonomy & Definitions are also available for download.

SPICE Model Checklist Adoption Table

Foundry Process SPICE Model Checklist Version Used Link to SPICE
Model Checklist
SPICE Model
Support Contact 
Jazz Semiconductor SBC18, CA18 1.2 Model Checklist
(need customer account)
N/A
Taiwan Semiconductor Manufacturing Company Ltd. 0.60um, 0.35um, 0.25um, 0.18um, 0.13um, N80um, N90um, N65um 1.5 N/A

Bryan Chang
(T)886-3-563-6688 ext. 7073456 (E)bryan_chang@tsmc.com

austriamicrosystems AG C35 1.2 Model Checklist
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@
austriamicrosystems.com
  S35 1.2 Model Checklist
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@
austriamicrosystems.com
  H35 1.2 Model Checklist
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@
austriamicrosystems.com
X-FAB
Semiconductor Foundries
XC018, XH018, XA035, XH035, XO035, XC06, XB06, XHB06, XT06, XDH10, XDM10 1.2 Model Checklist (need customer account) Contact List

Leadership

North America
Chair: Pekka Ojala, Exar Corporation
(T) 510.668.7543
(E) pekka.ojala@exar.com
Co-Chair: Geoffrey Coram, Analog Devices, Inc.
Co-Chair: Jamal Deen, McMaster University
Co-Chair: Roberto Tinti, Agilent EEsof Division

South America
Chair: Prof. Gilson I Wirth, Universidade Federal Do Rio Grande Do Sul (UFRGS), Brazil
(T) + 55 (51) 3308-4443
(E) wirth@inf.ufrgs.br
Co-Chair: Prof. Carlos Galup-Montoro, Universidade Federal de Santa Catarina (UFSC), Brazil
Co-Chair: Sergio Bampi, Universidade Federal Do Rio Grande Do Sul (UFRGS), Brazil
Co-Chair: Antonio Cerdeira Altuzarra, Cinvestav - IPN

Europe
Chair: Ehrenfried Seebacher, austriamicrosystems AG
(T) +43 3136 500 5487
(E) ehrenfried.seebacher@austriamicrosystems.com
Co-Chair: Alexander Petr, X-FAB Semiconductor Foundries AG
Co-Chair: Benjamin Iniguez, Universitat Rovira I Virgili (URV)
Co-Chair: James Victory, Sentinel IC Technologies

Asia
Chair: Goichi Yokomizo, STARC
(T) +81-45-478-3750
(E) yokomizo.goichi@starc.or.jp
Co-Chair: Sadayuki Yoshitomi, Toshiba
Co-Chair: Prof. Xing Zhou, Nanyang Technological University
Co-Chair: A.B. Bhattacharyya, JIIT

MOS-AK/GSA Group Manager
Wladek Grabinski
(T) +41 22 349 0939
(E) wladek@mos-ak.org

MOS-AK | GSA

Upcoming Events

Q1 MOS-AK/GSA Modeling Workshop
Date: March 16-18, 2012
Location: Noida, India

Resources

Dec 7, 2011 - D.C. Workshop Presentations

April 7-8, 2011 - Paris Workshop Presentations

Dec 8, 2010 - CA Workshop Presentations

Sept 17, 2010

April 8-9, 2010 - Rome Workshop Presentations

January 27, 2009 - PowerPoint Presentation (PDF, 1088 KB)

January 27, 2009 - Meeting Minutes (PDF, 25 KB)

Get Involved

Those who deal with modeling-related issues, such as model generation, extraction, validation and comparison are encouraged to get involved (modeling engineers, model developers, compact model designers, etc.).

Join This Sub-Working Group – By signing up, you will be added to a distribution list and receive upcoming meeting notifications.

Social Media

Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.

LinkedIn

Twitter

Questions?

GSA Contact
Chelsea Boone
Director of Research
(T) 972-866-7579 ext. 123
(E) cboone@gsaglobal.org