- RF/Analog/Mixed-Signal
Working Groups
- MS/RF
Working Group
- MS/RF PDK
Sub Working Group
- MS/RF PCM/Process
Checklist Sub Working Group
- MS/RF Model
Sub Working Group
RF/Analog/Mixed-Signal Working Groups
The Analog/Mixed-Signal Interest Group's mission of addressing technical and business challenges
within the analog/mixed-signal ecosystem, such as the lack of models, managing the power budget, over
customization (harder to have proven IP blocks), choosing the right process and lack of planning
through the entire process, will be further promoted by its MS/RF Working Group.
The MS/RF Working Group is focused on accelerating the formation of an
advanced mixed-signal/RF supply chain and ecosystem for fabless and hybrid companies. The MS/RF
Working Group's initiatives are carried out through its sub-working groups:
For more information regarding the MS/RF Working Group, contact Chelsea Boone, Senior Research
Analyst at 972.866.7579 ext.123 or via email at cboone@gsaglobal.org.
MS/RF Working Group
Purpose
The Mixed-Signal/RF Working Group's mission is to accelerate the formation of an advanced
mixed-signal/RF supply chain and ecosystem for fabless and hybrid companies.
The Working Group's objectives include:
- Developing a format for process design kit (PDK) roadmap representation and development
criteria at various stages in the process lifecycle.
- Developing mixed-signal/RF requirements for characterization vehicle, SPICE modeling,
design-for-manufacturing (DFM) and package modeling.
- Creating a common language for mixed-signal/RF intellectual property (IP) and establishing
an environment where analog and RF IP can be reused.
- Defining a standard way of communicating basic process parameters and criteria for
mixed-signal/RF processes.
- Developing standard definitions for quantitative and qualitative metrics that can be
used for classification and as figures of merit in selecting an appropriate process and
process options for a specific design application.
Article: GSA
Mixed-Signal/RF Subcommittee Is Facilitating an Analog Ecosystem (Chip Design) by
Marco Racanelli, VP, Technology & Engineering & GM, Aerospace & Defense, Jazz
Semiconductor, Inc., a Tower Group Company, GSA MS/RF Working Group Chairman
Initiatives
Mixed-Signal/RF PDK Checklist – The Working Group's PDK Sub-Working Group has further improved
and revised the current version of the Checklist to include a "PDK Details" section which can help
one assess if a PDK can be used with a given software.
Mixed-Signal/RF SPICE Model Checklist – The Working Group's Model Sub-Working Group is working to
further improve and revise the current version (1.2).
AMS/RF Process Checklist – The Working Group's Process Control Monitoring (PCM)/Process Checklist
Sub-Working Group has developed a four-page Process Checklist that (1) reflects the key attributes
of an AMS/RF foundry process offering and (2) provides standard definitions for the quantitative and
qualitative metrics that can be used for classification and as figures of merit in selecting an
appropriate process and process options for a specific design application.
Mixed-Signal/RF PCM Checklist – Now that the Process Checklist has been completed, the Working
Group's PCM/Process Checklist Sub-Working Group will work to develop a checklist that will help in
communicating basic process parameters and criteria for mixed-signal and RF processes.
Deliverables
AMS/RF
Process Checklist – A checklist that identifies the different elements of a foundry's
AMS/RF process and its ability to fulfill a semiconductor company's needs; serves as a
basic set of guidelines for measuring available items in an AMS/RF foundry process; and is an
efficient way to communicate information in a consistent format across all foundries.
Mixed-Signal/RF PDK
Checklist – A document completed by the PDK developer and delivered with each new release of a
mixed-signal/RF PDK. This document helps developers obtain a better understanding of the source data,
completeness and quality of the PDK before using it to design ICs or to modify it to fit into your
in-house design flow. A Checklist
Users Guide is also available for download.
Click here for the PDK Checklist Adoption Table
Mixed-Signal/RF
SPICE Model Checklist – A document completed by the SPICE model developer and delivered with each new
release of an SPICE model. This document helps developers better understand the source data, completeness
and quality of the model before using it to design ICs or to re-extract it to fit into specific product
needs. A Checklist
Users Guide and Checklist
Taxonomy & Definitions are also available for download.
Click here for the SPICE Model Checklist Adoption Table
IP Deliverable Checklist – A checklist that is integrated
into the Hard IP Quality Risk Assessment Tool.
Sub-Working Groups
MS/RF PDK Sub-Working Group – Developing a format for
PDK roadmap representation and development criteria at various stages in the process lifecycle.
MS/RF Model Sub-Working Group – Developing mixed-signal
and RF requirements for characterization vehicle, SPICE modeling, DFM and package modeling.
MS/RF PCM/Process Checklist Sub-Working Group – (1)
Defining a standard way of communicating basic process parameters and criteria for mixed-signal and RF
processes. (2) Developing standard definitions for quantitative and qualitative metrics that can
be used for classification and as figures of merit in selecting an appropriate process and process options
for a specific design application.
Leadership
Marco Racanelli, MS/RF Working Group Chairman, Jazz Semiconductor, Inc., a Tower Group Company
(T) 949-435-8309
(E) marco.racanelli@jazzsemi.com
|
Upcoming Events
Events to come.
Get Involved
Those who deal with MS/RF-related issues are encouraged to get involved.
Join This Working Group – By signing up, you will
be added to a distribution list and receive upcoming meeting notifications.
Social Media
Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.


Questions?
GSA Contact
Chelsea Boone
Sr. Research Analyst
(T) 972-866-7579 ext. 123
(E) cboone@gsaglobal.org
|
MS/RF Process Design Kit (PDK) Sub Working Group
Purpose
The Process Design Kit (PDK) Sub-Working Group is developing a format for PDK roadmap
representation and development criteria at various stages in the process lifecycle.
Initiatives
Mixed-Signal/RF PDK Checklist – The Working Group has improved and revised the current version
of the Checklist to include a "PDK Details" section, which can help one assess if a PDK
can be used with a given software.
Deliverables
Mixed-Signal/RF
PDK Checklist – A document completed by the process design kit (PDK) developer and delivered
with each new release of a mixed-signal/RF PDK. This document helps obtain a better understanding
of the source data, completeness and quality of the PDK before using it to design ICs or to modify
it to fit into your in-house design flow. A
Checklist
Users Guide is also available for download.
Leadership
Thomas Moerth, MS/RF PDK Sub-Working Group Chairman, austriamicrosystems
(T) +43 3136 500 5154
(E) thomas.moerth@austriamicrosystems.com
Resources
- Dec 1, 2009 - PDK
Sub-Working Group Meeting Presentation (PDF, 2541 KB)
- Nov 10, 2009 - PDK
Sub-Working Group Meeting Minutes (PDF, 20 KB)
- Dec 2, 2008 - PDK
Sub-Working Group Meeting Minutes (PDF, 19 KB)
- Nov 4, 2008 - PDK
Sub-Working Group Meeting Minutes (PDF, 24 KB)
- Oct 7, 2008 - PDK
Sub-Working Group Meeting Minutes (PDF, 21 KB)
- June 24, 2008 - PDK
Sub-Working Group Meeting Minutes (PDF, 20 KB)
- Apr 22, 2008 - PDK
Sub-Working Group Meeting Minutes (PDF, 21 KB)
- Feb 26, 2008 - PDK
Sub-Working Group Meeting Minutes (PDF, 21 KB)
- Oct 23, 2007 - PDK
Sub-Working Group Meeting Minutes (PDF, 26 KB)
- July 10, 2007 - PDK
Sub-Working Group Meeting Minutes (PDF, 26 KB)
- Apr 24, 2007 - PDK
Sub-Working Group Meeting Minutes (PDF, 23 KB)
- Feb 27, 2007 - PDK
Sub-Working Group Meeting Minutes (PDF, 23 KB)
- Jan 9, 2007 - PDK
Sub-Working Group Meeting Minutes (PDF, 23 KB)
For copies of meeting minutes prior to 2007, please contact Chelsea Boone.
PDK Checklist Adoption Table
| Foundry |
Process |
PDK Checklist Version Used |
Link to PDK Checklist |
PDK Support Contact |
| Grace Semiconductor Manufacturing Corporation |
0.18um IBG MS/RF CMOS |
2.0 |
PDK Checklist |
Emir Yu
(T)86-21-51318888-83505 (E)emiryu@gsmcthw.com |
| Silterra Malaysia Sdn Bhd |
CL130MR |
2.0 |
PDK Checklist |
Al Kordesch
(T)60-4-401-5572 (E)al_kordesch@silterra.com |
| Taiwan Semiconductor Manufacturing Company Ltd. |
0.60um, 0.35um, 0.25um, 0.18um, 0.13um, N80um, N90um, N65um |
1.5 |
N/A |
Bryan Chang
(T) 886-3-563-6688 ext. 7073456 (E)bryan_chang@tsmc.com |
| austriamicrosystems AG |
C35 |
2.0 |
PDK Checklist
|
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@austriamicrosystems.com |
| |
S35 |
2.0 |
PDK Checklist
|
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@austriamicrosystems.com |
| |
H35 |
2.0 |
PDK Checklist
|
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@austriamicrosystems.com |
| Jazz Semiconductor |
CA18, SBC18 |
2.0 |
PDK Checklist
(need customer account) |
N/A |
X-FAB
Semiconductor Foundries |
XC018, XH018, XA035, XH035, XO035, XC06, XB06, XHB06, XT06, CX08A, CX08H, XDH10, XDM10 |
3.0 |
N/A |
Sabine Perko
(E) sabine.perko@xfab.com |
|
Upcoming Events
PDK Sub-Working Group Meeting
Date: March 30, 2010
Time: 10:00am (Pacific)
Get Involved
Those who deal with MS/RF PDK-related issues are encouraged to get involved.
Join This Working Group – By signing up, you will
be added to a distribution list and receive upcoming meeting notifications.
Social Media
Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.


Questions?
GSA Contact
Chelsea Boone
Sr. Research Analyst
(T) 972-866-7579 ext. 123
(E) cboone@gsaglobal.org
|
MS/RF PCM/Process Checklist Sub Working Group
Purpose
The PCM/Process Checklist Sub-Working Group's mission is to define a standard way of communicating
basic process parameters and criteria for mixed-signal/RF processes and to develop standard
definitions for quantitative and qualitative metrics that can be used for classification and as
figures of merit in selecting an appropriate process and process options for a specific design
application.
Initiatives
AMS/RF Process Checklist – The Sub-Working Group has developed a four-page Process Checklist
that reflects the key attributes of an AMS/RF foundry process offering and provides standard
definitions for quantitative and qualitative metrics that can be used for classification and as
figures of merit in selecting an appropriate process and process options for a specific design
application. The current version 1.0 includes sections for process type, process release status,
process attributes, passive device attributes, foundry logistics, active device attributes, and
libraries and IP.
Mixed-Signal/RF PCM Checklist – Now that the Process Checklist is complete, the Working Group's
PCM/Process Checklist Sub-Working Group will work to develop a checklist that will help in
communicating basic process parameters and criteria for mixed-signal and RF processes.
Deliverables
AMS/RF
Process Checklist – This document identifies the different elements of a foundry's AMS/RF
process and its ability to fulfill a semiconductor company's needs; it serves as a basic
set of guidelines for measuring available items in an AMS/RF foundry process; and it is an efficient
way to communicate information in a consistent format across all foundries.
Leadership
David Schwan, PCM/Process Checklist Sub-Working Group Chairman, RF Micro Devices (RFMD)
(T) 408-428-6537
(E) david.schwan@rfmd.com
Resources
- Oct 21, 2009 - PCM/Process Checklist Sub-Working Group Meeting Minutes (PDF, 34 KB)
- Sept 23, 2009 - PCM/Process Checklist Sub-Working
Group Meeting Minutes (PDF, 35 KB)
- Jun 24, 2009 - PCM/Process Checklist Sub-Working
Group Meeting Minutes (PDF, 33 KB)
- May 20, 2009 - PCM/Process Checklist Sub-Working
Group Meeting Minutes (PDF, 33 KB)
- Feb 18, 2009 - PCM/Process Checklist
Sub-Working Group Meeting Minutes (PDF, 24 KB)
- Dec 4, 2007 - PCM/Process
Checklist Sub-Working Group Meeting Minutes (PDF, 23 KB)
- Nov 5, 2007 - PCM/Process
Checklist Sub-Working Group Meeting Minutes (PDF, 29 KB)
- Apr 17, 2007 - Process
Checklist Sub-Working Group Meeting Minutes (PDF, 26 KB)
- Mar 13, 2007 - Process
Checklist Sub-Working Group Meeting Minutes (PDF, 26 KB)
- Jan 30, 2007 - Process
Checklist Sub-Working Group Meeting Minutes (PDF, 26 KB)
|
Upcoming Events
PCM Checklist Meeting
Date: April 21, 2010
Time: 10:00am (Pacific)
Get Involved
Join This Working Group – By signing up, you will
be added to a distribution list and receive upcoming meeting notifications.
Social Media
Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.


Questions?
GSA Contact
Chelsea Boone
Sr. Research Analyst
(T) 972-866-7579 ext. 123
(E) cboone@gsaglobal.org
|
MS/RF Model Sub Working Group
Purpose
The Model Sub-Working Group is developing mixed-signal and RF requirements for
characterization vehicle, SPICE modeling, design-for-manufacturing (DFM) and package modeling.
Initiatives
Mixed-Signal/RF SPICE Model Checklist – The Sub-Working Group is working to further improve
and revise the current version (1.2).
Deliverables
Mixed-Signal/RF
SPICE Model Checklist – A document completed by the SPICE model developer and delivered with each new
release of an SPICE model. This document helps developers better understand the source data, completeness
and quality of the model before using it to design ICs or to re-extract it to fit into specific product needs.
A Checklist
Users Guide and Checklist
Taxonomy & Definitions are also available for download.
Leadership
Roberto Tinti, MS/RF Model Sub-Working Group Chairman, Agilent Technologies
(T) 818-879-6368
(E) roberto_tinti@agilent.com
SPICE Model Checklist Adoption Table
| Foundry |
Process |
SPICE Model Checklist Version Used |
Link to SPICE
Model Checklist |
SPICE Model
Support Contact |
| Jazz Semiconductor |
SBC18, CA18 |
1.2 |
Model
Checklist
(need customer account) |
N/A |
| Taiwan Semiconductor Manufacturing Company Ltd. |
0.60um, 0.35um, 0.25um, 0.18um, 0.13um, N80um, N90um, N65um |
1.5 |
N/A |
Bryan Chang
(T)886-3-563-6688 ext. 7073456 (E)bryan_chang@tsmc.com |
| austriamicrosystems AG |
C35 |
1.2 |
Model Checklist
|
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@
austriamicrosystems.com |
| |
S35 |
1.2 |
Model Checklist
|
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@
austriamicrosystems.com |
| |
H35 |
1.2 |
Model Checklist
|
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@
austriamicrosystems.com |
X-FAB
Semiconductor Foundries |
XC018, XH018, XA035, XH035, XO035, XC06, XB06, XHB06, XT06, XDH10, XDM10 |
1.2 |
Model Checklist (need customer account) |
Contact List |
|
Upcoming Events
Events to come.
Get Involved
Those who deal with MS/RF model-related issues are encouraged to get involved.
Join This Working Group – By signing up, you will
be added to a distribution list and receive upcoming meeting notifications.
Social Media
Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.


Questions?
GSA Contact
Chelsea Boone
Sr. Research Analyst
(T) 972-866-7579 ext. 123
(E) cboone@gsaglobal.org
|
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