GSA BLOGSIP Quality – Is it Time For an IP Consumer Reports?IP Quality – Is it Time For an IP Consumer Reports? By Mike Gianfagna, VP corporate marketing, Atrenta Inc. Like many people, I’ve subscribed to Consumer Reports for years. Generally speaking, I will look at their reviews before venturing out to buy anything that costs more than $50. Sometimes, impulse buying kicks in, and then I rush back to look at the article on what I just bought to see how it fared. That creates positive validation or buyer’s remorse in about the same quantities typically. Continue reading
Posted in Blogs
Leave a comment
More than Moore and 3D IC: Decoding the Code at the GSA Silicon Summit 2013There’s probably no more fitting venue for discussing future directions for processing and packaging technology in integrated circuit fabrication than the Computer History Museum in Mountain View, CA. After all, “The mission of the Computer History Museum is to preserve and present for posterity the artifacts and stories of the information age. As such, the Museum plays a unique role in the history of the computing revolution and its worldwide impact on the human experience.” “What’s past is prologue,” right? “The child is father of the man.” Or at least that’s how the English poets (Shakespeare, Wordsworth) would have us see it. Continue reading
Posted in Blogs, News
Leave a comment
GSA Working Group April BlogGSA Working Group April Blog Second quarter working group meetings kicked off with a flourish. We held both the IP and 3D IC meetings the day before GSA’s annual Silicon Summit. Presentations and minutes can be found here. Continue reading
Posted in Blogs
Leave a comment
MEMS in Medical ApplicationsOn March 20, 2013 Alissa Fitzgerald, Founder, AMFitzgerald, gave an excellent and insightful presentation “MEMS in Medical Applications” to the GSA MEMS working group. The breadth of opportunity this application area provides, as well as the improved medical care from existing and future products are exciting for the entire MEMS and semiconductor ecosystems. Continue reading
Posted in Blogs, Working Groups
Comments Off
Learning from an old dog? Easier IP (SIP, VIP, ESIP) integrationBill Martin, E-System Design: This past weekend, I needed to replace a Ground Fault Interrupter, GFI for short, outlet in my garage. The last time I replaced one was several years ago in my sister’s condo. GFI outlets are a little trickier than standard outlets, but can be swapped out pretty easily. Continue reading
Posted in Blogs, Intellectual Property
1 Comment
IoT – The Next Market DriverJack Browne, Marketing Guru: Fueling the Internet of Things (IOT) is the next semiconductor growth opportunity with opportunities for the billions of M2M (Machine-to-Machine) connected devices as well as the smart devices that provide the man-machine User experience. System companies offer consumer benefits by leveraging the IOT nodes; teasing out valuable information using big data, crowd sourcing and location information. One example, as shared recently by EETimes reporter Peter Clarke explored Connected Cars updating commuting conditions and drive times analyzing crowd sourced data of driver’s usage of wipers, defrosters, brakes, etc. Continue reading
Posted in Blogs, Intellectual Property
1 Comment
Maximizing the Value of Your Internal IPWarren Savage, CEO, IPextreme: Everyone today understands the essential importance of third-party semiconductor intellectual property (IP) to the health of the semiconductor industry. Considerably less attention is given to the importance of a strong, serviceable portfolio of internal IP within a semiconductor company. Continue reading
Posted in Blogs, Intellectual Property, Working Groups
Comments Off
GSA Working Groups – January Meeting NewsHarrison Beasley, GSA Working Groups: GSA working groups for Intellectual Property and 3D IC kicked off 2013 meetings on January 23rd. The 3D IC group saw a significant increase in attendance with seven new companies joining the effort. These new members helped offset absent regular members attending 3D IC conferences in Europe and Singapore. Continue reading
Posted in Blogs, Intellectual Property, Working Groups
Comments Off
Brave New World: 2.5/3D packaging impact on IP?Bill Martin, E-System Design: Let us assume that 2.5/3D packaging will become main stream. 2.5/3D concerning packaging applies to using Package on Package (PoP), System in Package (SiP) and/or TSV/CGA interposers to dramatically shrink or completely eliminate a printed circuit board. Yes, we are not there yet but the momentum and benefits exist to drive this to a reality. Over the next few years, these new packaging capabilities will impact every aspect of high tech development. How will this packaging revolution affect this ecosystem? It can open up many opportunities and challenges for various participants. Continue reading
Posted in Blogs, Intellectual Property
Comments Off
Connected IcebergJack Browne, VP Marketing, Sonics, Inc.: The worldwide semiconductor market is finishing a tough year with IHS iSuppli forecasting 2012 at $303B down 2.3% from 2011. At first blush this is not very exciting, but just take a moment and think about the increasing capabilities of the chips shipping in 2012 due to Moore’s law advancing capabilities across all semiconductors. Mobile devices like smart phones, media tablets and mobile PCs are driving semiconductor innovation and revenues. But these devices are the most visible part of the iceberg. Continue reading
Posted in Blogs
Comments Off
|
NEWS
|
