GSA Interest Group Survey

• GSA's Interest Groups are driving industry solutions in EDA/Design, IP, Wafer Manufacturing, Packaging and Test. Help us by giving your feedback in these areas.

Suppliers and Service Partners

• Suppliers to the semiconductor industry are eligible for inclusion in the GSA Supplier & Service Partner Profile Directory. To submit your company for inclusion, please complete this survey and submit it to GSA.

Semiconductor End Markets

• It is well known that the semiconductor industry changes rapidly; therefore, GSA surveys its database of companies regularly to ensure all information is updated and correct. This year, we are sending an abbreviated survey to capture your company’s detailed end market information. By completing the survey, it will guarantee your company is listed correctly in our database, which, in turn, will help us serve you better.

2010 GSA Memory Conference Report

• “Bridging Memory and Logic ICs for Better System Performance”
  

  The GSA Memory Conference, held in Taipei on March 16, 2010, ended with great success. The 2010 GSA Memory Conference Report records the key perspectives and insights from the distinguished speakers and the companies they represented at this conference. It also brings together impartial views and comments from the Industrial Economics and Knowledge Center (IEK), the industrial research arm of the Industrial Technology Research Institute (ITRI), a long-term associate to GSA.

Global Semiconductor Funding, IPO and M&A Update

• To provide the industry with timely data on semiconductor investment activity in the private and public sector, GSA releases a monthly two-page update and a downloadable, sort-able Excel spreadsheet of all semiconductor funding, initial public offering (IPO), and merger and acquisition (M&A) activity.

Global Semiconductor Financial Tracker

• GSA's quarterly Global Semiconductor Financial Report is a comprehensive report, which includes detailed trend analysis, regional breakdowns, etc. on financial data. This report is complimentary to GSA members. Non-members may purchase it at the GSA Store.

IC Foundry Almanac

• The IC Foundry Almanac puts essential information at your fingertips, including foundry-segment analysis, five-year forecasts, wafer-pricing trends from outsourcing semiconductor suppliers and supplier-profile data. Use the Foundry Almanac to make corporate decisions, support the outsourcing business model in presentations and meetings, and gain a better understanding of the foundry market's status.

Understanding Fabless IC Technology

• Authors: Jeorge S. Hurtarte, Evert A. Wolsheimer, Lisa M. Tafoya

  Understanding Fabless IC Technology focuses on the differences between the IDM and fabless business model and provides the reader with an overview of how to conduct business in the outsourced semiconductor industry environment as well as discusses technical, cultural and global issues. It also discusses key business topics such as negotiating with outside fabrication companies, choosing the right electronic design tools, protection of intellectual property and business plans, and maintaining quality control.

India Semiconductor Market Research Reports

• The India Semiconductor Association (ISA) is the trade body representing the Indian semiconductor driven industry. ISA is committed to building global awareness for the Indian semiconductor-driven industry and supporting its growth through focused activities. ISA has played a prominent role in supporting the Government of India in the Semiconductor Policy.

Consumer Electronics Boom: How Semiconductor and Consumer Electronics Companies can Improve Cost, Time-to-Market and Product Quality

• GSA, CEA and KPMG

  This report explores how semiconductor companies and consumer electronics original equipment manufacturers (OEMs) can better partner to improve time-to-market and product quality. It also provides valuable insight to both CE and IC OEMs in developing new consumer products, where time-to-market, product differentiation, quality and product profitability are tantamount.

Understanding the Needs & Perceptions of SOI Technology: Silicon-on-Insulator Survey Analysis

• Given the critical low-power and high-performance needs in the semiconductor industry today, Silicon-on-Insulator (SOI) technology may become an enabler to companies attempting to meet these requirements, especially at more advanced nodes. GSA hosted the survey to better understand the needs and perceptions of SOI from users within the industry.

Lead-Free Resources

• GSA provides you resources including presentations, reports and links to additional sites with helpful information such as defining RoHS, WEEE, lead facts, and more.

Building a Better Supply Chain: Successful Collaboration in the Fabless Semiconductor Industry

• Industry Directions and GSA

  A collaborative effort between industry analyst firm Industry Directions, Inc. and GSA, the study demonstrates that while fabless companies are adept at operating in the outsourced model and recognize the importance of the supply chain and how it helps drive competitive advantage, there is significant opportunity for improvement.

GSA Semiconductor Market Report: An Essential Data Resource for Outsourcing Companies

• The Semiconductor Market Report, last updated in May 2007, is an essential historical data resource that encompasses the entire fabless ecosystem. There is no single source or publication of this caliber with the more than 550 pages of easy-to-read charts, graphs and written analysis.

The Sure Path to 40nm Success

• Virage Logic
  Virage Logic

  PDF, 144 KB

Can MIPI and MDDI Really Co-Exist?

• Ashraf K. Takla, Mixel & Timothy Saxe, QuickLogic

  Since MIPI and MDDI standards both target interfaces to cameras and displays on mobile devices, are two separate standards really needed?

  PDF, 4.55 MB

Challenges, solutions for EDA start-ups

• Tom Kozas, President, Energo Design Solutions Michael Sanie, Maestro International

  PDF

Current Economic Downturn Monitor

• Throughout the current economic downturn, GSA is providing the industry with the latest data, resources and analysis supporting the GSA Hypothesis. We encourage you to download the articles and presentations for the most comprehensive analysis.

Lithography for dummies (well, us EDA guys)

• EDN

  PDF

Viewpoint: Competitive Advantage vs. Collaborative Advantage

• Saranyan Vigraham, Ph.D., RF Analog Group
  QUALCOMM

  PDF

What My Dad Taught Me About Yield

• Prashant Maniar, Chief Strategy officer
  Stratosphere Solutions Inc.

  PDF, 112 KB

GSA & IET International Semiconductor Forum
Munich, Germany
June 3, 2009

• Portable Device Power Management: Evolution from Discretes to Configurable System Power Management Platform IC’s LOGIN
  Mark Jacob, Director of Marketing, Audio & Power Management Business Unit
  Dialog Semiconductor

  PDF

• IC Design: Rethink Everything for Recovery Readiness! LOGIN
  Dr. Aart de Geus, Chairman & CEO
  Synopsys, Inc.

  Dr. de Geus presents his perspective on what’s driving the current economic and technological realities for companies doing IC design, what looming challenges are waiting just down the road and what solutions will be necessary to equip them to be recovery ready.

  PDF

• Are ASIC's Really on the Decline? The ASIC Model: Future Directions LOGIN
  Tatsuo Noguchi, Technology Executive, Semiconductor Technology Laboratories
  TOSHIBA Corporation

  The presentation highlighted the ASIC model applicability for CE companies, the future of the ASIC model globally, ASIC model impact on Europe and the role fabless companies play in the chip development process

  PDF

IP Conference Taiwan
Hsinchu, Taiwan
May 7, 2009

• Strategizing for a healthy IP ecosystem
  Future Prospective of Programmable Logic Non-Volatile Memory
  Charles Hsu, President
  eMemory Technology Inc.

  PDF, 1.016 MB

• Strategizing for a healthy IP ecosystem
  A New IP Verification Flow Using ESL
  Dr. Alan P. Su
  Global UnichipCorporation

  PDF, 1.243 MB

• Strategizing for a healthy IP ecosystem
  IP Litigation During Economic Hard Times: Are You Ready?
  Paul M. Saraceni, Esq., Chief IP Officer
  RPX Corporation

  PDF, 783 KB

• Strategizing for a healthy IP ecosystem
  Strategies for Managing Development Costs & Risks at Advanced Technology Nodes
  Brani Buric, Executive Vice President
  Virage Logic Corporation

  PDF, 2.002 MB

ITAC and GSA Conference
Waterloo, Ontario, CANADA
April 15, 2009

• Semiconductor Industry Will Innovate its Way Out of the Downturn
  Lisa Tafoya, Vice President of Global Research
  Global Semiconductor Alliance

  The semiconductor industry has a rich tradition of managing through dramatic and unforgiving cycles, ranging from years of extraordinary growth, to steep declines. After several unprecedented years of contiguous growth, the industry is now facing a downturn stunning even industry veterans. Semiconductor companies will not go unscathed in this current environment. Start-ups needing additional rounds of funding and do not yet have a product and are not cash-flow positive are the most vulnerable. However, in general, the industry is in a much stronger position to weather this downturn than it was in 2001. The presentation will provide data and analysis supporting the hypothesis that the semiconductor industry will innovate its way out of the downturn, and how great companies will be prepared for next-generation opportunities.

  PDF, 4.35 MB

• IDC Semiconductor Update: Semiconductor Industry Downturn Prolonged by Economic Reality
  Flint Pulskamp, Program Manager Wireless Semiconductors
  IDC

  At what point can we expect to reach the bottom of this current downturn? How does this downturn compare to 1996, 1998 and 2001?

  PDF, 908 KB

• Small World Large Impact: A WIN Perspective on the Potential of Nanotechnology
  Dr. Arthur Carty, Executive Director
  Waterloo Institute for Nanotechnology

  The science and engineering of materials, devices and systems with size features in the range of atoms and molecules (0.1-100 nm) has seen spectacular growth, with global funding reaching $US 18.2 B in 2008, up 15% from 07. Using the unique properties of nanoscale materials- high surface atom/bulk atom ratios and the emergence of quantum effects- together with access to new tools and methods for seeing, manipulating and creating new forms of matter and devices, research is accelerating in the areas of: Nanomaterials for energy storage and conversion, OLEDS for flexible, transparent display technologies, Nano-fluidics, MEMS, NEMS, Lab-on-a-chip devices for biodiagnosis, Nanosystems for targeted drug delivery and Quantum nanophotonics. But what applications are likely to impact our day-to-day lives?

  PDF, 6.168 MB

• Living Star Trek Technologies: Advanced Microelectronics at Work and Play
  Moderator: Peter Middleton, Principal Analyst
  Gartner, Inc.

  Panel
  Brian Doody, Chief Executive Officer, DALSA Corporation;
  Paul Kempf, Vice President, Silicon, Research In Motion;
  Gerry Remers, President and Chief Operation Officer, Christie Digital Systems Canada, Inc.;
  Robert Tong, Vice President, Medical Products Group, ON Semiconductor
  

  This panel of senior industry executives share their thoughts on the technologies that have the potential to change our lives just like: iPods; cell phones; satellite TV; and virtual communities.

  PDF, 4.926 MB

• Solar Power: Not Free but Affordable & Renewable
  Dr. Johanna Schmidtke, Analyst
  Lux Research

  Solar power promises affordable clean energy, helped by technological innovations and government subsidies. However, it is not yet cost-competitive, and concerns about continued growth have mounted in the difficult economy. Semiconductor manufacturing and design techniques have provided a valuable start, but can they adapt to overcome solar’s financial challenges?

  PDF, 1.471 MB

EDA Interest Group Discussion and Notes

• EDA Interest Group
  GSA

  PDF, 1.018 MB

SOI Technology and EcoSystem: Emerging SOI Applications

• Horacio Mendez, Executive Director
  SOI Consortium

  PDF, 1.38 MB

DesignCon 2009
Santa Clara, CA
February 4, 2009

• EDA Standards Questionnaire
  Herb Reiter, President
  EDA 2 ASIC Consulting, Inc.

  PDF, 146 KB

• Interoperability –Standards –Collaborative Technology: Innovation Through Collaboration
  Steven Slupsky, President and CEO
  Si2, Inc.

  PDF, 3.19 MB

• Embracing a New Paradigm: EDA Tools and IP as Solutions Enablers LOGIN
  Bill Martin, General Manager, Verification IP Division
  Mentor Graphics

  PDF, 4 MB

• SPIRIT IP-XACT & IEEE Standards, GSA EDA Standards Discussion
  Gary Delp, Distinguished Engineer, Platform Roadmap & Architechure
  LSI

  PDF, 868 KB

• Semiconductor Market Forecast 2009-2010
  Brian Mata, Vice President
  IC Insights

  PDF, 1.47 MB

GSA Semiconductor Leaders Forum TAIWAN
Ambassador Hotel Hsinchu, Taiwan R.O.C.
November 5, 2008

• Keynote Address
  How Asia is Changing the Analog IC Business LOGIN
  David Bell, President, Chief Executive Officer and Director, Intersil Corporation
  Intersil Corporation

  PDF, 942 KB

GSA Suppliers Expo & Conference
Santa Slara, CA
October 2, 2008

• GSA Annual Briefing LOGIN GSA

  PDF, 1.6 MB

• Global: Markets, Perspectives, Technology
  Cellular Chipset – Connectivity Integration: Holy Grail or Hail Mary? LOGIN
  Joep van Beurden, Chief Executive Officer, CSR
  CSR

  Mr. van Beurden’s keynote presentation represented the C-level global aspect of a company such as CSR that has enjoyed many diverse and successful business models. van Beurden highlighted CSR’s global markets and perspectives and how they impact technical and business markets.

  PDF, 10.31 MB

• Panel Discussion
  Challenges in, and Solutions for, Design and Verification of Low Power Devices LOGIN
  Moderator: Herb Reiter, President, eda 2 asic Consulting, Inc.
  eda 2 asic Consulting, Inc.

  Panel
  Albert Chen, Field Application and Marketing Manager, Faraday Technology Corporation
  Joseph Greco, Vice President, VLSI Engineering, NVIDIA
  Don Kurelich, Technical Director Americas Sales, Mentor Graphics
  Richard Owen, Group Director, Cadence Design Systems

  Some of the topics discussed during the morning panel at the 2008 Suppliers Expo included outlining the power challenges designers face and the solutions each vendor offers, insight on how customers utilize the current solutions available, roadmaps for low-power tools, and how to efficiently adapt low-power solutions.

  PDF, 2.16 MB

• Keynote Address
  Diversity and Dynamics – Global Semiconductor Eco-system From a Design Services Perspective LOGIN
  Vasudevan Aghoramoorthy, Vice President, Semiconductor and System Solutions, Wipro Technologies
  Wipro Technologies

  The 2008 Suppliers Expo afternoon keynote addess presented the diversified business model and gave a global perspective from Wipro, an EDA/Design Company. Mr. Nandy highlighted how this diversity has enabled Wipro to connect with most players of the semiconductor and electronics product ecosystem like IP, design services, ASSP, ASIC and OEM/systems companies.

  PDF, 1.5 MB

IET & GSA International Semiconductor Forum
London, United Kingdom
May 15, 2008

• Panel Discussion
  Town Hall Session: Leveraging Talent and Opportunities Through Diverse Design Centers LOGIN
  Moderator: Neil Dickins, Director
  IC Resources

  PDF

• Panel Discussion
  Software - The X Factor LOGIN
  Moderator: Chris Turner, Business Development Manager, Semiconductor Industry, Cambridge Consultants
  Cambridge Consultants

  PDF

FSA Suppliers Expo & Conference
Santa Clara, California, US
September 12, 2007

• Panel Discussion: Building A Better Supply Chain... Successful Collaboration in an Outsourced Industry LOGIN
  Moderator: Bill Brandel, Principal, Industry Directions Inc.
  Industry Directions Inc.

  The 2007 Suppliers Expo aftrenoon panel highlighted the collaboration between FSA and Industry Directions (IDI) on a study of the impact of outsourced operations in design, manufacturing, logistics and other related operations in the outsourced industry.

  PDF, 185 KB

• Panel Discussion: Divination and Wizarding Skills for Consumer Electronics Suppliers LOGIN
  Moderator: Brian Markwalter, Vice President, Technology & Standards, Consumer Electronics Association
  Consumer Electronics Association

  The 2007 Suppliers Expo morning panel discussion focused on how consumer electronics are driving the entire supply chain from consumer to OEM to semiconductor. The panel identified the challenges faced by fabless and OEM companies given the intensity of the consumer electronics market. They also explored how the demands of consumers have a profound effect and impact on all parts of the supply chain.

  PDF, 2.5 MB

• FSA Annual Briefing LOGIN
  Jodi Shelton, Executive Director, FSA
  FSA

  PDF, 2 MB

FSA International Collaboration Series: Low Power Solutions
August 22, 2007

• Low Power Design Challenge LOGIN
  Albert Li, Director, Global Unichip
  Global Unichip

  PDF

• Low-Power Design Flows: A Collaborative Approach LOGIN
  Mickie Liu, Field Applications Engineer, ARM
  ARM

  PDF

• Low Power Designs Using CPF LOGIN
  Pinhong Chen, Engineering Director, Cadence Design Systems
  Cadence Design Systems, Inc.

  PDF

• Low Power Design – It Takes Innovation and Leadership LOGIN
  Pankaj Mayor, Group Director Industry Alliances, Cadence Design Systems
  Cadence Design Systems, Inc.

  PDF

IET & FSA International Semiconductor Forum
Paris, France
May 15, 2007

• Technical Theme: Implementing Emerging Technology
  Asynchronous Circuits Adopted: Lessons Learned LOGIN
  Ad Peeters, CTO, Handshake Solutions
  Handshake Solutions

  PDF, 1.36 MB

• Technical Theme: IP and Reuse
  Leveraging Knowledge and Design Reuse is Critical to Success LOGIN
  Gabriele Saucier, CEO, Chairman of the Board, Design and Re-Use
  Design and Re-Use

  PDF, 608 KB

• Keynote Address: The Changing Semiconductor Landscape Requires Special Focus on Multi-Company Alliances LOGIN
  Jan Willis, Senior Vice President of Industry Alliances, Cadence Design Systems, Inc.
  Cadence Design Systems, Inc.

  PDF, 13.3 MB

FSA International Collaboration Series: Low-Power Design
March 31, 2007

• Low Power Design - It Takes Design Chain Collaboration LOGIN
  an Willis, Senior Vice President Industry Alliances, Cadence Design Systems, Inc.
  Cadence Design Systems, Inc.

  PDF

• Low Power Coalition LOGIN
  Frank W. Childers, Vice President, Business Operations, Silicon Integration Initiative, Inc.
  Silicon Integration Initiative, Inc.

  PDF

• Low Power Design from Design Foundry Perspective LOGIN
  Nianfeng Li, Corporate Vice President, Design Methodology, Verisilicon Inc.
  Verisilicon Inc.

  PDF

• ARM Solutions and Collaborations for Low Power LOGIN
  Felix Fei, ARM
  ARM

  PDF

Supply Chain Issues In The High-Technology Semiconductor Industry

• Sanjiv Chopra
  Oracle Corporation

  Results of the supply chain survey conducted by Oracle & Global Semiconductor Alliance (GSA) Sanjiv Chopra, Oracle Corporation

  PDF

EDA Tools Confront the Complexity by Supporting Vehicle Design Processes

• LOGIN
  Enrique Ortega
  Mentor Graphics

  PDF, 243 KB

New Application Areas Driving Higher Dynamic Range Converters

• Michael Connolly
  Silicon & Software Systems(S3)

  With the advent of higher broadband speeds in the fixed line and wireless systems, the need for higher performing data converters has become apparent. In this article, we discuss the different standards that are pushing this trend and how single tone testing, in some cases, does not accurately determine the performance in communication systems. This is particularly true in systems that employ multi-tone signalling or OFDM (orthogonal frequency division multiplexing), in which the available bandwidth is split into a large number of sub-channels, which then allows data to be transmitted over many sub-carriers, thereby enabling higher data rates.

  PDF, 231.2 MB

Pipeline vs. Sigma Delta ADC for Communications Applications

• Noel O'Riordan
  Silicon & Software Systems(S3)

  The Analog-to-Digital Converter (ADC) is a key component in digital communications receive channels, and the correct choice of ADC is critical for optimizing system design. In this white paper, we discuss what design factors drive the selection of the ADC, how to specify the ADC and when to choose between a Pipeline ADC and a Sigma-Delta (??) ADC.

  PDF, 362.513 MB

SpyGlass®-CDC: Combining Structural and Functional Verification Techniques to Improve Effective Clock Domain Crossing Verification

• LOGIN
  Artrenta, Inc.

  PDF, 799 KB

Designing for Test at RTL

• LOGIN
  Dr. Ralph Marlett
  Atrenta Inc.

  PDF

Exploiting Core’s Law: Get “More than Moore” productivity from your ASIC and SOC Design Teams

• LOGIN
  Tensilica

  PDF, 705 KB

GuideWare™

• LOGIN
  Satish Soman, Krishna Uppuluri
  Atrenta, Inc.

  PDF

Facilitating At-speed Test at the Register Transfer Level

• LOGIN
  Dr. Ralph Marlett, Kiran Vittal
  Atrenta Inc

  PDF, 323 KB

The Emergence of Intelligent Operations Management (IOM)

• LOGIN
  Bob Parker

  Manufacturing organizations in the electronics value chain are seeking to harvest value from the information they have and to harmonize processes and utilize the expertise of their trading partners. The information technology required to support these efforts demands a new kind of application with a modern architecture. For value chain management, this will be the IOM platform.

  PDF, 339 KB

Constraints Management: Approaches and Techniques for Preserving the Intent of Timing Constraints Throughout the Design Flow

• LOGIN
  Sridhar Gangadharan, Ramesh Dewangan
  Atrenta, Inc

  PDF, 368 KB

Low Power Design: Approach and Techniques for Power Estimation, Reduction and Verification

• LOGIN
  Michael Carrell, Dave Allen
  Atrenta

  PDF, 377 KB

• LOGIN
  Michael Carrell, Dave Allen
  Atrenta

  PDF, 378 KB

Do Your Chip a Favor! Manage the Constraints!!

• LOGIN
  Ramesh Dewangan, Sridhar Gangadharan, Sanjay Churiwala
  Atrenta, inc.

  PDF, 916 KB

Offshoring in the Semiconductor Industry: A Historical Perspective

• LOGIN
  Clair Brown and Greg Linden
  UC Berkeley

  PDF, 244 KB

Estimating Fault Coverage from RTL without Fault Simulation

• LOGIN
  Dr. Ralph Marlett and Chandan Kumar
  Atrenta Inc.

  PDF

Addressing Design Challenges at 130-Nanometer and Below: The Silicon Readiness Approach

• LOGIN
  Aurangzeb Khan
  Cadence Design Systems

  PDF