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GSA recognized the importance of high-productivity EDA design tools and flows for the profitability of the semiconductor eco system and formed the EDA Interest Group in early 2008. In bi-monthly meetings, chaired by Herb Reiter, president of eda 2 asic Consulting, Inc., representatives from EDA firms, design services, IDMs, major foundries and other industry organizations raise specific industry challenges for EDA vendors to address.
In mid-2009, this team decided to focus its efforts on the rapidly emerging 3D/stacked die technology and develop high productivity design tools to accelerate market acceptance for 3D. Good tools not only ensure cost-effective and high-quality 3D designs but also minimize risk and shorten time-to-profit for the companies that design and manufacture 3D ICs.
Resources
2010
DAC 2010
2009
Requirements for 3D Design Flow Interoperability Standards Workshop - October 1, 2009, Santa Clara, CA
- Presentations
(Listed in order presented at event)
3D Architecture for Semiconductor Integration & Packaging Conference
December 9-11, 2009 San Francisco, CA
Si2 Presentation - Sumit Gupta
Your feedback is needed! The group is currently surveying semiconductor companies on 3D
Integration. We would like your input on motivations and plans regarding using
3D technology with Through Silicon Vias (TSV), including preferences and recommendations.
Click here to answer
the brief online survey.
For more information, contact Kristen Pillans at 972.866.7579 ext. 124 or
kpillans@gsaglobal.org. |
Events
SEMICON West
San Francisco, CA
"3D-IC Co-Design Challenges: How to Speed 3DIC Deployment"
Tuesday 7/13
2:00pm-4:30pm
TechSITE North stage
Get Involved
Social Media
Join our Social Media groups and stay informed. LinkedIn groups
are specific to each GSA Interest Group/Working Group.
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