GSA Member Login | March 13, 2010
EDA/Design Working Groups
IC Technology
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  • Modeling

  • 3D Standards

EDA/Design Working Groups

3D Standards

GSA is collaborating with Si2 on 3D standards, primarily focusing on through silicon via (TSV) modeling and the significant challenges 3D design brings to existing design flows and tools for 2D design. Semiconductor companies and foundries are encouraged to help this working group by filling out a brief survey on 3D integration efforts.

For more information, contact Kristen Pillans at 972.866.7579 ext. 124 or kpillans@gsaglobal.org.

Modeling

In January 2009, GSA merged its efforts with MOS-AK, a well-known industry compact modeling volunteer group primarily focused in Europe, to re-activate its Modeling Working Group. This working group will help to create a smooth compact modeling interface between the technology (CMOS fabrication) and the IC design. For more information, contact Chelsea Boone at 972.866.7579 ext. 123 or cboone@gsaglobal.org.

Modeling Working Group

In January 2009, GSA merged its efforts with MOS-AK, a well-known industry compact modeling volunteer group primarily focused in Europe, to re-activate its Modeling Working Group. Its purpose, initatives and deliverables coincide with MOS-AK's purpose, initatives and delieverables as outlined below.

Purpose

To Connect:

  • Encourage interaction and sharing of all information related to compact modeling at all levels of the device and circuit characterization, modeling and simulations. The Working Group aspires to build a community with global connections by:
    • Promoting standardization of compact models and its implementation into software tools.
    • Connecting national and local modeling groups.
    • Building strong bilateral ties with similar organizations around the world.

To Benchmark:

  • Conduct regular meetings with industry players and academia to exchange information on the strengths and weaknesses of the industrialization of compact models. Activities include:
    • Drafting of standards and providing a center of competence for engineers, designers, managers and decision makers.
    • Evaluating world-wide best practices and success stories.
    • Delivering a comprehensive view of compact modeling education

To Educate:

  • The Working Group believes that the transfer of advanced compact modeling methodologies to industry can be accelerated by providing comprehensive reports and reference papers on the subjects of:
    • Basic issues and concepts of device characterization and compact modeling.
    • Global device characterization and compact modeling issues.
    • Examples and analysis of best practice of the commercialization of compact models.

Initiatives

The Modeling Working Group will play a central role in developing a common language among foundries, CAD vendors, IC designers and model developers by contributing and promoting different elements of compact model standardization and related tools for model development, validation/implementation and distribution.

Modeling Initiatives

Deliverables

Events:

Publications: All publications can be found online at http://www.mos-ak.org/.

Books:

  • Transistor Level Modeling for Analog/RF IC Design; Editors:W.Grabinski, B.Nauwelaers, D.Schreurs ISBN: 1-4020-4555-7; 2006, Approx. 290 p., Hardcover; www.springer.com
  • Power/HVMOS Devices Compact Modeling Editors:W.Grabinski, T.Gneiting ISBN: n/a, Approx. 250 p., (2009 exp) Hardcover; www.springer.com

Leadership

North America
Chair: Pekka Ojala, Exar Corporation
(T) 510.668.7543
(E) pekka.ojala@exar.com
Co-Chair: Geoffrey Coram, Analog Devices, Inc.
Co-Chair: Jamal Deen, McMaster University

South America
Chair: Prof. Gilson I Wirth, Universidade Federal Do Rio Grande Do Sul (UFRGS), Brazil
(T) + 55 (51) 3308-4443
(E) wirth@inf.ufrgs.br
Co-Chair: Prof. Carlos Galup-Montoro, Universidade Federal de Santa Catarina (UFSC), Brazil
Co-Chair: TBD

Europe
Chair: Ehrenfried Seebacher, austriamicrosystems AG
(T) +43 3136 500 5487
(E) ehrenfried.seebacher@austriamicrosystems.com
Co-Chair: Sebastian Schmidt, X-FAB Semiconductor Foundries AG
Co-Chair: Benjamin Iniguez, Universitat Rovira I Virgili (URV)

Asia
Chair: Goichi Yokomizo, STARC
(T) +81-45-478-3750
(E) yokomizo.goichi@starc.or.jp
Co-Chair: Sadayuki Yoshitomi, Toshiba
Co-Chair: Prof. Xing Zhou, Nanyang Technological University

MOS-AK Workshop Manager
Wladek Grabinski, GMC Suisse
(T) +41 22 349 0939
(E) wladek@grabinski.ch

MOS-AK | GSA

Upcoming Events

C4F MOS-AK/GSA Rome Workshop
Date: April 8-9, 2010
Location: The Faculty of Engineering, Sapienza Università di Roma, Via Eudossiana 18, Rome

Resources

January 27, 2009 - PowerPoint Presentation (PDF, 1088 KB)

January 27, 2009 - Meeting Minutes (PDF, 25 KB)

Get Involved

Those who deal with modeling-related issues, such as model generation, extraction, validation and comparison are encouraged to get involved (modeling engineers, model developers, compact model designers, etc.).

Join This Working Group – By signing up, you will be added to a distribution list and receive upcoming meeting notifications.

Social Media

Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.

LinkedIn

Twitter

Questions?

GSA Contact
Chelsea Boone, Sr. Research Analyst
(T) 972-866-7579 ext. 123
(E) cboone@gsaglobal.org

GSA is collaborating with Si2 on 3D standards, primarily focusing on through silicon via (TSV) modeling and the significant challenges 3D design brings to existing design flows and tools for 2D design.

A "Requirements for 3D Design Flow Interoperability Standards" workshop was held on October 1st in Santa Clara, CA, where nearly 50 attendees represented all parts of the supply chain, academia and other standards organizations. Click on the links below to download each presentation (Listed in order they were presented at event).

3D Architecture for Semiconductor Integration & Packaging Conference
December 9-11, 2009 San Francisco, CA
Si2 Presentation - Sumit Gupta

Your feedback is needed! The group is currently surveying semiconductor companies on 3D Integration. We would like {Company}’s input on motivations and plans regarding using 3D technology with Through Silicon Vias (TSV), including preferences and recommendations. Click here to answer the brief online survey.

For more information, contact Kristen Pillans at 972.866.7579 ext. 124 or kpillans@gsaglobal.org.

Events

Going to DATE? Attend GSA-supported 3D events throughout the week

Resources

Information to come.

Get Involved

Contact Kristen Pillans, GSA or Herb Reiter, EDA Interest Group Chair

Social Media

Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.

LinkedIn

Twitter

Questions?

GSA Contact
Kristen Pillans, GSA
(T) 972-866-7579 ext. 124
(E) kpillans@gsaglobal.org

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