GSA Member Login | February 3, 2012
EDA/Design Working Groups
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EDA/Design Working Groups

3D/TSV Technology

GSA's 3D/TSV Technology Working Group is focusing on through silicon via (TSV) modeling and the significant challenges 3D design brings to existing design flows and tools for 2D design. For more information, contact Kristen Pillans at 972.866.7579 ext. 124 or kpillans@gsaglobal.org.

GSA recognized the importance of high-productivity EDA design tools and flows for the profitability of the semiconductor eco system and formed the EDA Interest Group in early 2008. In bi-monthly meetings, chaired by Herb Reiter, president of eda 2 asic Consulting, Inc., representatives from EDA firms, design services, IDMs, major foundries and other industry organizations raise specific industry challenges for EDA vendors to address.

In mid-2009, this team decided to focus its efforts on the rapidly emerging 3D/stacked die technology and develop high productivity design tools to accelerate market acceptance for 3D. Good tools not only ensure cost-effective and high-quality 3D designs but also minimize risk and shorten time-to-profit for the companies that design and manufacture 3D ICs.

Resources

  • Presentations - Download presentations from 3D IC meetings and events.

  • 3D IC Alliance - Your feedback is needed! The group is currently surveying semiconductor companies on 3D Integration. We would like your input on motivations and plans regarding using 3D technology with Through Silicon Vias (TSV), including preferences and recommendations. Click here to answer the brief online survey.

For more information, contact Kristen Pillans at 972.866.7579 ext. 124 or kpillans@gsaglobal.org.

Events

RTI Conference - December 8-10. San Francisco, CA
3D Test Workshop, Austin, TX, Nov 4-5
3DIC Conference, Munich, Nov 16-18
Working Group Meetings
- September 13, 2010: Download Presentations
LSI Accelerating Innovation Conference

Industry Panel: More than Moore!3D Silicon-to-Silicon Stack Solutions for Your Next SoC (Oct 6, 2010)

Get Involved

Contact Kristen Pillans, GSA or Herb Reiter, EDA Interest Group Chair

Social Media

Join our Social Media groups and stay informed. LinkedIn groups are specific to each GSA Interest Group/Working Group.

LinkedIn

Twitter

Questions?

GSA Contact
Kristen Pillans, GSA
(T) 972-866-7579 ext. 124
(E) kpillans@gsaglobal.org

EDA Working Groups Presentations

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