GSA recognized the importance of high-productivity EDA design tools and flows for the profitability of the semiconductor eco system and formed the EDA Interest Group in early 2008. In bi-monthly meetings, chaired by Herb Reiter, president of eda 2 asic Consulting, Inc., representatives from EDA firms, design services, IDMs, major foundries and other industry organizations raise specific industry challenges for EDA vendors to address.

In mid-2009, this team decided to focus its efforts on the rapidly emerging 3D/stacked die technology and develop high productivity design tools to accelerate market acceptance for 3D. Good tools not only ensure cost-effective and high-quality 3D designs but also minimize risk and shorten time-to-profit for the companies that design and manufacture 3D ICs.

Resources

• Presentations - Download presentations from 3D IC meetings and events.
  
  
• 3D IC Alliance - Your feedback is needed! The group is currently surveying semiconductor companies on 3D Integration. We would like your input on motivations and plans regarding using 3D technology with Through Silicon Vias (TSV), including preferences and recommendations. Click here to answer the brief online survey.

For more information, contact Kristen Pillans at 972.866.7579 ext. 124 or kpillans@gsaglobal.org.