In January 2009, GSA merged its efforts with MOS-AK, a well-known industry compact modeling volunteer group primarily focused in Europe, to re-activate its Modeling Working Group. Its purpose, initatives and deliverables coincide with MOS-AK's purpose, initatives and delieverables as outlined below.

Purpose

To Connect:

• Encourage interaction and sharing of all information related to compact modeling at all levels of the device and circuit characterization, modeling and simulations. The Working Group aspires to build a community with global connections by:
• Promoting standardization of compact models and its implementation into software tools.
• Connecting national and local modeling groups.
• Building strong bilateral ties with similar organizations around the world.

To Benchmark:

• Conduct regular meetings with industry players and academia to exchange information on the strengths and weaknesses of the industrialization of compact models. Activities include:
  • Drafting of standards and providing a center of competence for engineers, designers, managers and decision makers.
  • Evaluating world-wide best practices and success stories.
  • Delivering a comprehensive view of compact modeling education

To Educate:

• The Working Group believes that the transfer of advanced compact modeling methodologies to industry can be accelerated by providing comprehensive reports and reference papers on the subjects of:
  • Basic issues and concepts of device characterization and compact modeling.
  • Global device characterization and compact modeling issues.
  • Examples and analysis of best practice of the commercialization of compact models.

Initiatives

The Modeling Working Group will play a central role in developing a common language among foundries, CAD vendors, IC designers and model developers by contributing and promoting different elements of compact model standardization and related tools for model development, validation/implementation and distribution.

Deliverables

Events:

• C4F MOS-AK/GSA Rome Workshop
  Date: April 8-9, 2010
  Location: The Faculty of Engineering, Sapienza Università di Roma, Via Eudossiana 18, Rome
• MOS-AK/GSA Workshop in Baltimore
  Date: Dec 9, 2009
  Location: Johns Hopkins University, Homewood Campus, Computational Sciences and Engineering, Building (CSEB), Room CSEB 17
• ESSDERC/ESSCIRC Workshop
  Date: Sept.18, 2009
  Location: Athens, Greece
  Greek Compact Modeling Map

Publications: All publications can be found online at http://www.mos-ak.org/.

Books:

• Transistor Level Modeling for Analog/RF IC Design; Editors:W.Grabinski, B.Nauwelaers, D.Schreurs ISBN: 1-4020-4555-7; 2006, Approx. 290 p., Hardcover; www.springer.com
• Power/HVMOS Devices Compact Modeling Editors:W.Grabinski, T.Gneiting ISBN: n/a, Approx. 250 p., (2009 exp) Hardcover; www.springer.com

Leadership

GSA is collaborating with Si2 on 3D standards, primarily focusing on through silicon via (TSV) modeling and the significant challenges 3D design brings to existing design flows and tools for 2D design.

A "Requirements for 3D Design Flow Interoperability Standards" workshop was held on October 1st in Santa Clara, CA, where nearly 50 attendees represented all parts of the supply chain, academia and other standards organizations. Click on the links below to download each presentation (Listed in order they were presented at event).

• Si2
• GSA
• IMEC
• SPIRIT
• SEMI
• IBM
• Qualcomm
• STMicroelectronics
• SUN
• Xilinx
• North Carolina State
• PRC/Georgia Tech
• Atrenta
• Cadence
• Gradient
• Magma
• Mentor Graphics
• R3 Logic
• Synopsys

3D Architecture for Semiconductor Integration & Packaging Conference
December 9-11, 2009 San Francisco, CA
Si2 Presentation - Sumit Gupta

Your feedback is needed! The group is currently surveying semiconductor companies on 3D Integration. We would like {Company}’s input on motivations and plans regarding using 3D technology with Through Silicon Vias (TSV), including preferences and recommendations. Click here to answer the brief online survey.

For more information, contact Kristen Pillans at 972.866.7579 ext. 124 or kpillans@gsaglobal.org.