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| This GSA eNewsletter provides valuable information about events, research, reports and publications that keep you up-to-date on current trends, tools and practices essential to the industry. As a member of GSA you could receive this material complimentary or at a substantial discount. To learn more about becoming a member of GSA, contact, Lisa Tafoya. |
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Featuring keynotes from Jim Denney, Vice President of Product Marketing, TiVo, Inc. and Paul Kempf, Vice President, Silicon, Research In Motion, this conference, taking place in Santa Clara, CA, delves into the technologies in consumer electronics and wireless communications offering new avenues of growth and increased market share. Register now!
Get an advance look at some of the most exciting emerging technologies and understand the impact of the underlying microelectronics–based advancements that enable these technologies: nano-electronics, photonics, MEMS, biotech and much more. In addition to the robust conference, this event will host tours of the DALSA Applications Laboratory and the Institute for Quantum Computing. Act now and register for this event!
In an effort to provide the industry with timely information, the GSA Ecosystem Company Indexes will provide the supply chain with a complete listing of companies in your area of expertise. As a complimentary feature on the GSA site, we encourage all semiconductor supply chain professionals to add their listing. Go to the Company Index Form to create or update your existing record. Add your listing here.
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As part of GSA’s mission to foster a more effective ecosystem through collaboration, integration and innovation, we are looking for industry reports, whitepapers and articles that you feel are relevant and timely to add to our Ecosystem Portals. Visit this link for easy download instructions.
Fabless and IDM companies that participated in the Q1 2009 Wafer & Back-End Pricing Survey may now access the Q1 2009 results. If you are a fabless or IDM company that is interested in participating in next quarter’s survey, click here. Suppliers may purchase the most recent results here.
Highlight your company in one of the following sections of the June GSA Forum: "Foundry Focus," "Back-End Alley," "Supply Chain Chronicles" or "Semiconductor Member News." For questions, contact Kayal Rajendran.
Providing the industry with timely data on semiconductor investment activity in the private and public sector, GSA releases a monthly two-page update and a downloadable, sort-able Excel spreadsheet of all funding, initial public offering (IPO), and merger and acquisition (M&A) activity for fabless companies, IDMs and semiconductor suppliers. The March 2009 issue will be released shortly. Purchase the February 2009 update today!
The PCM/Process Checklist Sub-Working Group will work to develop a checklist that will help in communicating basic process parameters and criteria for mixed-signal and RF processes. Their next meeting will be Wednesday, April 22nd at 12:00pm CDT. Please contact Chelsea Boone if you are interested in joining.
GSA has re-established the Modeling Working Group with MOS-AK and is looking for industry experts who deal with modeling-related issues, such as model generation, extraction, validation and comparison, to get involved. Please contact Chelsea Boone to sign up.
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April 17, 2009
On-line
Attendees will receive an overview of the REACH directive and the proposed RoHS II draft, registration and documentation requirements depending on your location of manufacture and product type and suggestions on collecting and managing your data for reporting purposes. GSA members receive a 10% discount. Reference code "GSA."
May 7, 2009
Hsinchu, Taiwan
The conference will address the business, quality and legal issues in strengthening an IP ecosystem and how important it is for semiconductor suppliers to incorporate quality IP into their business strategy.Registration for this event is complimentary to all semiconductor professionals. Don’t wait, register today!
National Microelectronics Institute
May 12 – 13, 2009
London, UK
June 2-3, 2009
Munich, Germany
Take advantage of early bird pricing though April 30th! The 2009 Forum is focused on leveraging and maximizing European expertise in analog/mixed-signal, wireless and MEMS applications, as well as addressing the markets for ASICs and multi-die packaging trends. The forum will feature a town hall discussion on the future of the emerging company semiconductor business model and its impact on sourcing innovation.
For event sponsorship opportunities in 2009, contact Darryl Leavitt at 888.322.5195 ext 113. |
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