IC Foundry Almanac, 2010 Edition Available
This comprehensive guide to the global IC foundry market combines IC Insights' analysis of market growth and capacity trends with GSA's wafer pricing trends, comprehensive company tracking information and its global reach across semiconductor companies and the foundry sector. Companies that purchased the 2009 edition will receive a $100 discount on the latest edition. Contact Nicole Bowman for the discount code.

3D Integration Initiatives
3D through-silicon via (TSV) design will require significant enhancements to existing 2D design flows and tools, as well as new methods for design exploration and implementation across a 3rd dimension. GSA's EDA/Design Interest Group is collaborating with Si2 to develop a 3D/TSV Standard to help alleviate these challenges. View presentations from our workshop held on October 1st, where nearly 50 attendees across the supply chain gathered to discuss requirements for 3D design flow interoperability. To help this group’s efforts, all semiconductor companies and foundries are invited to participate in a brief 3D Integration Survey.

Free Access to the Q4 2009 Wafer Fabrication & Back-End Pricing Reports
If you are a fabless, fab-lite or IDM company purchasing wafers directly from an established foundry relationship, sign up to participate in the Q4 2009 Wafer Fabrication & Back-End Pricing Survey. Companies participating in each pricing survey will receive a complimentary copy of the pricing results for that quarter. If you are interested in participating, click here.

2010 GSA Forum Editorial Calendar Now Available
The 2010 GSA Forum editorial calendar is now available to view abstract/article deadlines and topics of interest for each issue. Deadlines for Foundry Focus, Back-End Alley, Supply Chain Chronicles, Semiconductor Member News and Private Showing have also been posted at gsaglobal.org/publications/forum/submit.asp. Submit your abstract now for our March 2010 issue focused on Semiconductor Memory.

MS/RF PCM/Process Checklist Sub-Working Group Meeting
Now that the Working Group's parameter list is complete, we will now look at how people would expect these parameters to be measured. This will be discussed in our next meeting on November 18, 2009 at 10:00am (Pacific). For dial-in information, contact Chelsea Boone.

Semiconductor Leaders Forum TAIWAN
November 11, 2009
Hsinchu, Taiwan

Join us as we hear perspectives from prominent leaders, including Joep van Beurden, CEO, CSR, Lip-Bu Tan, President and CEO, Cadence Design Systems, Dr. Luke Hsieh, CEO & Co-Founder, Richtek Technology Corporation, Lars Jensen, Director, Strategy and Business Development, Nokia, Jim Seto, VP, Foundry Operations, AMD and Kevin Lin, Taiwan Managing Director, Accenture. Register today!

MOS-AK/GSA Modeling Workshop
December 9, 2009
Baltimore, MD

This high-tech forum will help to classify the most important directions for the future development of compact models and to clearly identify areas that need further research. This workshop is designed for device process engineers; ICs designers; and device characterization, modeling and parameter extraction engineers.

GSA Awards Dinner Celebration
December 10, 2009
Santa Clara, CA

Join GSA and industry executives as we recognize companies that have demonstrated excellence in vision, strategy, execution and future opportunity. No other industry event brings together this caliber of executives for an evening of networking. We are pleased to feature Larry Kudlow, a nationally syndicated columnist and contributing editor of National Review magazine, as well as  host of CNBC's primetime "The Kudlow Report" and co-host of CNBC's "The Call," as our 2009 keynote. Reserve your table or seat today!

For event sponsorship opportunities in 2009 and 2010, contact Monica Dominguez at 972.866.7579 ext. 161.