| This GSA eNewsletter provides valuable information about events, research, reports and publications that keep you up-to-date on current trends, tools and practices essential to the industry. As a member of GSA you would receive this material complimentary or at a substantial discount. To learn more about becoming a member of GSA, contact, Nicole Tidwell. |
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3D through-silicon via (TSV) design will require significant enhancements to existing 2D design
flows and tools, as well as new methods for design exploration and implementation across a
3rd dimension. GSA's EDA/Design Interest Group is collaborating with Si2 to develop a 3D/TSV
Standard to help alleviate these challenges.
View presentations from our workshop held on October 1st, where nearly 50 attendees across the supply chain
gathered to discuss requirements for 3D design flow interoperability. To help this group's
efforts, all semiconductor companies and foundries are invited to participate in a brief 3D Integration
Survey.
This comprehensive guide to the global IC foundry market combines IC Insights' analysis of
market growth and capacity trends with GSA's wafer pricing trends, comprehensive company
tracking information and its global reach across semiconductor companies and the foundry
sector. Companies that purchased the 2009 edition will receive a $100 discount on the
latest edition. Contact Nicole Bowman
(nbowman@gsaglobal.org) for the discount code.
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This preliminary paper was prepared for the conference "Measurement Issues Arising from the
Growth of Globalization," sponsored by the W.E. Upjohn Institute for Employment Research and
the National Academy of Public Administration. See how GSA's Wafer Fabrication Pricing Data was
used as a key part of this study.
Submit your abstract
for the March 2010 issue of GSA Forum focused on semiconductor memory. For topics
of interest, abstract and article deadlines, as well as guidelines,
click
here. For more information, contact Chelsea Boone.
The Sub-Working Group has created a list of parameters and now needs to make a decision on a
measurement definition for each parameter description. This will be discussed in their next
meeting on January 20, 2010 at 10:00am (Pacific). Please contact
Chelsea Boone if you are interested in joining.
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December 9, 2009
Baltimore, MD
This high-tech forum will help to classify the most important directions for the
future development of compact models and to clearly identify areas that need further
research. This workshop is designed for device process engineers; ICs designers; and
device characterization, modeling and parameter extraction engineers.
December 10, 2009
Santa Clara, CA
The Awards Dinner is next Thursday! Join GSA and industry executives as we recognize
companies that have demonstrated excellence in vision, strategy, execution and future
opportunity. No other industry event brings together this caliber of executives for an
evening of networking. Contact Tiffany Olson
for any updates or changes to new or exiting reservations.
For event sponsorship and advertising opportunities in 2010, contact
Monica Dominguez at 972.866.7579 ext. 161.
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