SYSTEM-IN-PACKAGE (SiP) ConferenceJanuary 23-24, 2007

AGENDA

Tuesday, January 23, 2007

8:00 AM - 9:00 AM Registration    
       
9:00 AM - 11:30 AM SiP Tutorials
The four SiP tutorials are designed to provide a foundation for all attendees to participate fully in the conference. One tutorial track focuses on SiP technology and addresses the drivers, applications and issues in SiP solutions as well as emerging 3D integration at the wafer level. The other tutorial track focuses on tools and applications and addresses SiP co-design flow and simulation and the important considerations of Design for Test (DFT) in the SiP environment.
       
9:00 AM - 10:00 AM

Track A-1
SiP Technology Focused Tutorials

SiP Driver Applications and Issues
Jan Vardaman, TechSearch International, Inc.

 

Track B-1
Tools and Application Focused Tutorials

Co-Design Flow/Modeling & Simulation for SiP
Robert Mullen, Cadence Design Systems, Inc.
Dr. Amit Agrawal, Broadcom Corporation

       
10:00 AM - 10:30 AM Morning Break   Morning Break
       
10:30 AM - 11:30 AM Track A-2
3D Integration at Wafer Level
TSV Technology

Dr. Sitaram Arkalgud, Sematech Corporation
Dr. Susan Vikavage, Sematech Corporation
  Track B-2
DFT for the SiP Environment

Alfred Crouch, Inovys Corporation
       
11:30 AM - 12:30 PM Networking Luncheon
       
12:30 PM - 12:45 PM

Conference Official Opening Address

Chris Malachowsky, Co-Founder, NVIDIA Fellow and Senior Vice President of Engineering and Operation, NVIDIA Corporation

       
12:45 PM - 1:15 PM Keynote: "SiP Application and Business Trends"
Jim Walker, Gartner Dataquest
       
1:15 PM - 2:00 PM Keynote: "SiP Technology Overview"
Dr. Homing Tong, ASE Group
       
2:00 PM - 2:30 PM Afternoon Networking Break
       
2:30 PM - 4:45 PM Case Studies: Advanced SiP Applications - Methodologies & Lessons Learned
Different market segments and applications have different needs and drivers. In this session, we have invited a cross-section of industry experts to present their methodologies and the lessons they have learned from leading edge applications in diverse market segments.
   
2:30 PM - 3:15 PM RF/Mixed Signals
Tom Gregorich, QUALCOMM
       
3:15 PM - 4:00 PM High Performance Applications
Dr. Jie Xue, Cisco Systems
       
4:00 PM - 4:45 PM Consumer System Integration
John Savic, Motorola
       
5:00 PM -7:00 PM Networking Cocktail Reception



Wednesday, January 24, 2007

8:00 AM - 9:00 AM Registration & Breakfast
   
9:00 AM - 9:30 AM Keynote: "SiP & Systems Integration - Perspective from ITRS"
Dr. W.R. (Bill) Bottoms, NanoNexus & 3MTS
   
  The diverse market drivers led by the fast-changing consumer segment have ignited a surging renaissance in innovations in SiP design and system integration. The speaker will articulate the perspective from ITRS, particularly from the ITRS Assembly & Packaging International Technical Working Group.
   
9:30 AM - 10:00 AM Keynote: "SiP Approach in Samsung"
Dr. Jason Cho, Samsung
   
  How are SiP technologies utilized in this well known and well respected consumer electronics and device manufacturer?
   
10:00 AM - 10:30 AM Morning Break
   
10:30 AM - 12:00 PM

Panel Discussion: "SiP Co-Design Flow Challenges "

Panelists:

  • Flynn Carson, STATS ChipPAC
  • Kim Chen, TSMC
  • David Cheskis, Jazz Semiconductor
  • Matt Kaufmann, Broadcom Corporation
  • Jochen Reisinger, Infineon Technologies
  • Hem Takiar, SanDisk Corporation

What are the user perspectives of SiP co-design tools?
Industry user experts from representative stake holders in the SiP food chain will articulate the visions for future co-design, simulation and test environments.

   
12:00 PM - 1:00 PM Networking Luncheon
   
1:00 PM - 2:30 PM

Panel Discussion: "Co-Design/Simulation Tool Vision/Roadmap, To Align Tool Supply Chain Development with The SiP Design Requirements"

Panelists:

  • Michael Breneman , Ansoft Corporation
  • Keith A. Felton, Cadence Design Systems, Inc.
  • Humair Mandavia , Zuken Inc.
  • An-Yu Kuo, Optimal Corporation
  • Kevin Rinebold, Sigrity, Inc.
  • Per Viklund, Mentor Graphics Corporation
   
2:30 PM - 3:00 PM Afternoon Break
   
3:00 PM - 4:30 PM

Panel Discussion: "SiP Test Methodology, the Need for DFT, Debug Capability and Improving SiP Yields"

Panelists:

  • Bruce Cory, NVIDIA Corporation
  • Alfred Crouch, Inovys Corporation
  • Merrill Hunt, QUALCOMM
  • Ajay Khoche, Verigy
  • James McEleney, Teradyne
   
4:30 PM - 5:00 PM Wrap Up: "SiP in the Fabless Environment"
Dr. Bill Chen, ASE Group
GSA & IET International Semiconductor Forum GSA Profile Directories Silicon Series Luncheon - May 4 IC Foundry Almanac TSMC