Global Semiconductor Alliance (GSA) Events

DesignCon 2009   February 2 - 5, 2009

GSA is pleased to be an associate sponsor of DesignCon and to host an interactive Business Forum Panel titled, "Embracing a New Paradigm: EDA Tools and IP as Solutions Enablers" and a presentation, "Intellectual Property - Fraud Protection". Join us as we collaborate on these critical issues that affect the entire ecosystem.

GSA facilitates thought leadership to solve industry challenges, accelerate the growth and increase the return on invested capital of the global semiconductor industry though insightful and in depth research and communication with executives and professionals worldwide. We need your feedback and support to continue our mission in providing a platform for industry collaboration.

Tell us which topics you feel are most important and require the most improvement in EDA/Design, Intellectual Property, Wafer Manufacturing, Packaging and Test.

Be a solutions driver and take the survey now!

Date, Time and Location

February 2 - 5, 2009
Santa Clara Convention Center
Santa Clara, CA

GSA Business Forum Panel

Embracing a New Paradigm: EDA Tools and IP as Solutions Enablers
Tuesday, February 3
10:15 a.m. - 11:45 a.m.

Power Point Presentation Link

Chairperson

Bill Martin Bill Martin
IP Interest Group Chair, Global Semiconductor Alliance (GSA)
Product Line Director, Mentor Graphics

The focus will be on the positive shifts in an emerging paradigm, injecting fresh ideas that demonstrate a how a mix of disciplines can lead to successful collaboration and cooperation in a worldwide supply-chain based economy. Read more.

Panelists

Bill Finch Bill Finch
Senior Vice President, CAST, Inc.
Camille Kokozaki Camille Kokozaki
Director of Design Automation Services, IDT
Herb Reiter Herb Reiter
President, eda2asic
Piyush Sancheti Piyush Sancheti
Senior Director of Business Development, Atrenta Inc.
Ravi Thummarukudy Ravi Thummarukudy
Vice President and General Manager IC Business Unit, GDA Technologies, Inc.
Mahesh Triupattur Mahesh Tirupattur
Executive Vice President, Analog Bits Inc.

GSA Presentation

Intellectual Protection - Fraud Protection
Tuesday, February 3
10:15 a.m. - 10:55 a.m.

Chris Jensen, Vice President, Marketing, New Momentum
Raminderpal Singh, Senior Technical Staff member, 300 mm Semiconductor Fab Systems and Technology Group, IBM

With one out of ten IT products containing counterfeits, according to a study by AGMA and KPMG, 1.5 billion of those imported ICs are likely counterfeit. Read more.

DesignCon 2009 Schedule

DesignCon offers a rich program of educational sessions coupled with the technology exhibition covering the broad spectrum of IC, verification, IP, PCB, PDN, and signal integrity. Chipheads who need to stay abreast of current developments regarding design-engineering theories, techniques, and applications strategies will benefit from attending both the conference and exhibition. View the full schedule!

Why Should You Attend

DesignCon 2009 is a definitive event for electronic design experts spanning chip, package, board, and system domains, addressing common issues in signal integrity, power management, interconnection, and design verification. Designed by engineers, for engineers, the conference and exhibition brings together the brightest minds in electronic design.

This year, IEC will host the IP Summit at DesignCon, featuring dedicated educational sessions and technology demonstrations on semiconductor IP and system-on-chip design. As the industry increasingly relies on semiconductor IP to deliver complex designs in a timely manner, the IP Summit will raise the visibility of this subject area at DesignCon.

Registration

By registering with GSA you will receive a 30% discount off the conference registration and receive a complimentary Exhibits PLUS ChipHead Express Pass - a $100.00 USD value! Click here to take advantage of this special offer.

The Exhibits PLUS ChipHead Express Pass includes access to the following:

  • Keynote Addresses
  • Technical Panels
  • Exhibition
  • Networking Receptions
  • TecPreview Presentations

Register Now!

Who Attends

DesignCon Attracts a Broad Spectrum of Electronic Design Chipheads
Attendees range from all levels and disciplines of engineering professionals, including the following:

  • Applications engineering
  • Architecture and systems design
  • ASIC design
  • Circuit-board design
  • Embedded-systems design
  • Hardware/software integration
  • High-performance systems
  • IC design
  • Packaging
  • Semiconductor product management
  • Service and support
  • SoC design
  • Software development
  • Testing and debugging
  • And more!

 


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