Speakers
Mr. Behrooz Abdi
Executive Vice President and General Manager
NetLogic Microsystems, Inc.
Before taking his position with NetLogic Microsystems, Inc., Mr. Abdi was President and CEO at RMI. He is a seasoned veteran with over 22 years of experience in the semiconductor industry, has a proven track record of growing profitable businesses at Qualcomm, Inc. (NasdaqGS:QCOM) and Motorola SPS (now Freescale Semiconductor, Inc.).
Prior to his appointment at RMI, Mr. Abdi held the position of Senior Vice President and General Manager of Qualcomm's CDMA Technologies (QCT). During his tenure, QCT became the driving force behind the transition to 65nm technologies, successfully acquired and integrated several product and technology companies and moved into the top ten list of semiconductor companies.
Prior to joining Qualcomm, Mr. Abdi held leadership and engineering positions of increasing responsibility at Motorola in its Semiconductor Products Sector (SPS). His last role at Motorola was Vice President and General Manager for the radio products division, in charge of RF and mixed signal ICs for the wireless mobile market, where he led Motorola to its number one market position in RF ICs. Mr. Abdi received his Bachelor of Science in Electrical Engineering from Montana State University and his Master degree in Electrical Engineering from the Georgia Institute of Technology.
Charlie Cheng
Chief Executive Officer
Kilopass Technology, Inc.
Charlie Cheng joined Kilopass as CEO in October 2008 with overall responsibility for leading the company and its business growth worldwide. His career spans more than 10 years of experience in the semiconductor IP industry and an additional 15 years in the global technology marketplace. Prior to Kilopass, he served as vice president of marketing and international business at Faraday Technology, where he grew the Taiwan-centric company into an international presence. Previously, he was co-founder and CEO of Lexra Inc., an embedded RISC CPU IP company. Charlie began his technology career at General Electric and IBM, and pioneered in the semiconductor IP business as VP of Marketing at Aspec Technology. He also served in various technical and management positions at Iomega, Zycad and Viewlogic. He holds a Bachelor of Science degree in Computer Science and Mechanical Engineering, with an emphasis on computer architecture and algorithms, from Cornell University, Ithaca, NY. He also completed the Executive Management Training Program on Leadership at Carnegie Mellon University, in addition to various other executive training programs.
Dr. Mojy Chian
SVP, Design Services & Enablement
GLOBALFOUNDRIES
Mojy Chian is Senior Vice President; Design Services and Enablement at GLOBALFOUNDRIES. He is responsible for our global design enablement, services and solutions and will be the primary technical customer interface for GLOBALFOUNDRIES. Mojy will be based in Sunnyvale, which serves as a Design Enablement center of excellence, and will have responsibility for our DE capabilities around the world.
Mojy has extensive leadership experience in silicon process technologies, specifically in the areas of design methodology and automation. Prior to joining GLOBALFOUNDRIES, he served as the Vice President of Technology Development at Altera Corporation, where he managed all development, infrastructure, and manufacturing aspects of silicon process technologies. Prior to that, Mojy was Senior Vice President of Core Technology and Analog Engineering at Mindspeed Technologies, where he oversaw all central engineering and common technology activities, as well as all engineering disciplines for analog products development.
Mojy holds bachelor's, master's and doctorate degrees in electrical engineering, as well as a masters' degree in applied math from Florida Institute of Technology.
Sol Gradman
Publisher
TapeOut
Sol (Shlomo) Gradman is a seasoned executive of high-technology companies. Gradman gained his rich managerial and global experience while living both in Israel & the US . He led (as Chairman/CEO/Vice President) five companies to success. Three of them were acquired by large multinational companies, one went public and the fifth is still private and survived the recent global crisis.
Today, Gradman is involved with several young high tech companies and is a board member of a public company called Calanit Carmon.
Gradman also serves as the Chairman of Israel's High Tech CEO Forum and is specifically involved with the Israeli semiconductor industry where he founded the industry magazine called TapeOut, The industry annual conference called ChipEx and the industry portal called ChipOrtal.
Mr. Gradman holds a degree in Electrical Engineering from the Technion - Israel Institute of Technology, a BA in Economics from Bar Ilan University and an MBA (with concentration on Entrepreneurship and Innovation) from Swinburne University. Mr. Gradman also completed the program for Business Strategies, at Stanford University, CA.
Jack Harding
Chairman, President & Chief Executive Officer
eSilicon Corporation
Jack Harding is president and CEO of eSilicon Corporation and brings more than 25 years of management experience spanning the semiconductor and EDA sectors. Mr. Harding co-founded eSilicon in 2000 and is responsible for eSilicon overall leadership, strategy and management. Several years ago, Mr. Harding introduced a new business model called the Value Chain Producer (VCP) that is today a $1B market segment. In 2009, the Global Semiconductor Alliance (GSA) recognized this new market segment by creating a VCP Board seat.
Mr. Harding is currently on the Board of Directors of RF Micro Devices (NASDAQ: RFMD) and Global Semiconductor Alliance (GSA) in addition to being the Chairman of eSilicon Corporation.
As a GSA board member over the past three years, Mr. Harding led the finance committee and guided the GSA and its membership through turbulent economic times ensuring that there was no loss in member benefits or focus on important programs. He has also served as a key spokesperson for GSA.
Prior to eSilicon, he served as president and CEO of Cadence during which time Cadence achieved the status of world's largest supplier of EDA software and provided the greatest shareholder value in the history of that company. Mr. Harding entered Cadence upon the acquisition of Cooper & Chyan Technology (CCT), where he served as the president and CEO, and was responsible for leading the company to an IPO. Prior to CCT, Mr. Harding served as the executive vice president of Zycad Corporation. Mr. Harding began his career at IBM.
Mr. Harding has held various directorships in both public and private organizations and served as a member of the prestigious Steering Committee at the U.S. Council on Competiveness and was a former National Academies' Committee member for Software, Growth and the Future of the U.S. Economy. Mr. Harding is a frequent international speaker on the topics of innovation, entrepreneurship and semiconductor trends and policies. He holds a B.A. from Drew University in Chemistry and Economics and attended the Stern School of Business at New York University.
Dr. Lucio Lanza
Managing Partner
Lanza Tech Ventures
Lucio Lanza is the Managing Director of Lanza techVentures, an early stage venture capital and investment firm, which he founded in January 2001. In 1990, he joined US Venture Partners, a venture capital firm, as a venture partner and was a general partner. From 1990 to 1995, he was an independent consultant to companies in the semiconductor, communications and computer-aided design industries, including Cadence Design Systems, Inc. and, from 1986 to 1989, was Chief Executive Officer of EDA Systems, Inc. Before that he was at Daisy Systems Corp, as VP of Marketing and later as GM of the EDA division. From 1977 to 1983 he held several positions with responsibility for strategy and innovation at Intel Corp including Chairman of the Microprocessor Strategic business segment. From 1968 to 1977 he was responsible for processor architecture and design at Olivetti Corporation. He is currently a non-executive director of ARM, and serves on the board of directors of PDF Solutions, Inc., a provider of technologies to improve semiconductor manufacturing yields. He holds a doctorate in electronic engineering from Politecnico of Milano.
Dr. Tom Lookabaugh
Chief Technical Officer
Entropic Communications Inc.
Dr. Lookabaugh has more than 20 years experience in developing communications technology solutions for satellite, cable, telco and broadcast industries. Dr. Lookabaugh has been at the forefront of technology development related to video communication, security, telecommunications and networking technology throughout his career. Prior to Entropic, Dr. Lookabaugh held a variety of executive positions including CEO at PolyCipher, a cable industry joint venture owned by Comcast, Time Warner Cable and Cox Communications where he led development of new cryptography and security systems for the US cable industry. Prior to that, he was Associate Faculty Director for the Interdisciplinary Telecommunications Program and on the faculty of the Computer Science Department at the University of Colorado, president of the Convergent Systems division for Harmonic as well as president of the DiviCom division of C-Cube Microsystems. Lookabaugh holds a doctorate in Electrical Engineering, three master's degrees (Statistics, Engineering Management and Electrical Engineering) from Stanford University and a bachelor's degree in Engineering Physics from the Colorado School of Mines.
Mrs. Maria Marced
President
TSMC Europe
Per November 19, 2007 Mrs. Maria Marced is appointed President of TSMC Europe. Maria is responsible for driving the development, strategy and management of TSMC Europe. In 2005 Maria became Senior Vice President and General Manager of Sales and Marketing at NXP Semiconductors/Philips Semiconductors. Maria joined Philips Semiconductor in September 2003 as Senior Vice-president and General Manager of the Connected Multimedia Solutions Business Unit overseeing Philips' semiconductor solutions for Connected Consumer applications. Maria joined Philips from Intel where she developed her professional career over 19 years, reaching the top position in the Europe, Middle East and Africa region as Vice President and General Manager. Prior to Intel, Maria worked in Spain for several companies. Mrs. Marced holds a Ph.D. in Telecommunications Engineering from Universidad Politecnica de Madrid, Spain.
Mr. Gary Smith
Founder & Chief Analyst
Gary Smith EDA
The founder and Chief Analyst for Gary Smith EDA. Previously, he was the Managing Vice President and Chief Analyst of the Electronic Design Automation Service, Design & Engineering Cluster at Gartner Dataquest.
Prior to joining Gartner, Mr. Smith was a consultant in design methodology and worked in the ASIC end of the semiconductor business. While at LSI Logic, Mr. Smith became an evangelist for the RT-level design methodology. Starting in the semiconductor industry, Mr. Smith was involved in some of the first attempts at customer-designed ICs.
Mr. Smith earned his bachelor of science degree in engineering from the United States Naval Academy. He is a current member of the Design TWG for the International Semiconductor Road Map (ITRS), editorial chair of the IEEE Design Automation Technical Committee (DATC) and serves on the DAC Strategic Committee. He is also past Chair of the IEEE Electronic Design Processes conference. Mr. Smith has been quoted and published numerous times in all the Electronics Publications including EE Times, EDN, Electronic Business in addition to the Wall Street Journal and Business Week. In 2007, he received an ACM SIGDA Distinguished Service award.
Lisa Tafoya
Vice President
Global Semiconductor Alliance
Lisa Tafoya brings more than 18 years of experience in market research and marketing communications to her role with GSA. Her in-depth ability to assess industry trends, create meaningful analysis and creatively promote various research activities make her a valuable asset as the GSA's Vice President of Global Research.
In her role, Ms. Tafoya performs the strategic planning and oversees the implementation of all GSA member reports, surveys and deliverables. She oversees all data collection and analysis, as well as global publications created and distributed by the Association
Ms. Tafoya also serves as the executive editor of GSA's industry-leading journal, the GSA Forum.
In addition, Ms. Tafoya is responsible for all of GSA's numerous committees worldwide. She manages their strategic focus and oversees the committee deliverables, including GSA's Hard IP Quality Risk Assessment Tool, MS/RF Spice Model Checklists and PDK Checklists, as well as the Standard Foundry Process Qualification Guideline (now a standard under JEDEC), as well as industry events, reports and other standards activity.
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