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PROGRAM

Time Program Item  
8:30 a.m. Registration  
9:00 a.m. Welcome Remarks

Jodi Shelton, President, GSA

 Jodi Shelton
9:10 a.m. Featured Speaker: Market Trends Shaping the Memory Industry

Sharon Holt, Senior Vice President & General Manager, Semiconductor Business Group, Rambus Inc.

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 Sharon Holt
9:50 a.m. Keynote Address: The Challenges and Opportunities Facing the Global Flash Memory Industry

Yoram Cedar, Executive Vice President, Mobile Business Unit & Corporate Engineering, SanDisk Corporation

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 Yoram Cedar
10:30 a.m.
Break
Sponsored by Cadence		 Cadence
11:00 a.m. Keynote Address: Rewriting the IT Power Equation

Jim Elliot, Vice President of Memory Marketing & Product Planning, Samsung Semiconductor Inc.

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Jim Elliot
11:30 a.m. Feature Presentation: Cost, Architecture, and Applications for 3D Integration

Yuan Xie, Associate Professor, Pennsylvania State University

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 Yuan Xie
12:00 p.m. VIP Lunch with Keynote Presentation: New Trends and Perspectives on the Integrated Design Society

Dr. Nicky Lu, Chairman & Chief Executive Officer, Etron Technology, Inc.; GSA Board Chairman

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 Dr. Nicky Lu
1:30 p.m. Keynote Address: 3D IC Design Challenges

Wally Rhines, Chairman & Chief Executive Officer, Mentor Graphics Corporation

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 Wally Rhines
2:10 p.m.

3D Ecosystem Panel

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Moderator: Matt Nowak, Senior Director, Engineering - QCT Technology Development, QUALCOMM

Panelists:

 Matt Nowak
 
  • Bill Chen, Senior Technical Advisor, ASE Group
 Bill Chen
 
  • Kyowon Jin, Vice President, Product Planning, Worldwide Marketing & Sales Division, Hynix Semiconductor
  
 
  • Paul Kempf, Vice President, Silicon, Research In Motion (RIM)
 Paul Kempf
 
  • Suk Lee, Director, Design Infrastructure Marketing Division, Design Technology Platform, TSMC NA
 Suk Lee
 
  • Dave Noice, Fellow, Cadence Design Systems, Inc.
 Dave Noice
3:20 p.m. Break  
3:50 p.m.

Global Collaboration Panel

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Moderator: Herb Reiter, 3D TSV Consultant, GSA

Panelists:

Herb Reiter
 
  • James Amano, Director, International Standards Program, SEMI
 James Amano
 
  • Dr. Sitaram Arkalgud, Director, Interconnect/3D IC, SEMATECH
 Dr. Sitatam Arkalgud
 
  • Dr. John Lau, ITRI Fellow, Industrial Technology Research Institute (ITRI)
 Dr. John Lau
  Dr. Pol Marchal
4:50 p.m. Closing Remarks  
5:00 p.m. Adjourn & Cocktail Reception  

 
Sponsors
Networking Reception Sponsor
Rambus
Platinum Sponsors
GlobalFoundries
TSMC
Gold Sponsor
Advantest
Etron Technology, Inc.
Macronix International Co., Ltd.
Samsung
Press Sponsor
Chip Design Magazine
ADVERTISEMENTS
TSMC
Chip Design Magazine
   
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