GSA and SEMATECH thank 2012 GSA/SEMATECH Memory Conference sponsors. Without their support, this event would not be possible.
More information is available at 4-d-s.com
A world-class technology company, Advantest is the leading producer of automatic test equipment (ATE) for the semiconductor industry and a premier manufacturer of measuring instruments used in the design and production of electronic instruments and systems. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also focuses on R&D for emerging markets that benefit from advancements in nanotech and terahertz technologies, and has recently introduced multi-vision metrology scanning electron microscopes essential to photomask manufacturing, and 3D imaging analysis tools to the pharmaceutical and transportation industries. Founded in Tokyo in 1954, Advantest established its first subsidiary in 1982, in the USA, and now has subsidiaries worldwide.
More information is available at advantest.co.jp
Amkor Technology, Inc. is one of the world's largest providers of advanced semiconductor assembly and test services. Founded in 1968, Amkor has become a strategic manufacturing partner for hundreds of the world's leading semiconductor companies and electronics OEMs, providing a broad range of advanced package design, assembly and test solutions.
Amkor's operational base encompasses more than 5 million square feet of manufacturing facilities, product development centers, and sales & support offices in Asia, Europe and the United States. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. Our design center offers best-in-class thermal, electrical and mechanical modeling and characterization, design automation, and support of DFM (design for manufacturing) and customer DFC (design for cost). Amkor's test engineering services span the scope of test program development to full product characterization for the packaging of RF, mixed signal, logic and memory devices.
The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor's packaging formats include wafer level, chip scale, ball grid array, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®) technology, and wafer level fan-out (WLFO). 3D configurations such as Package-on-Package (PoP), stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation. Furthermore, Amkor continues to improve mature package technologies with the application of new materials and processes. Amkor's recently introduced pin-gate molded PBGA pushes wire bonding down to 28nm while providing superior quality, reliability, and performance at even higher yields and reduced cost.
More information is available at amkor.com
Etron Technology, Inc. is a world-class fabless IC design and product company specializing in buffer memory and system-on-chips. The company offers cutting-edge Known-Good-Die-Memory (KGDM) and Consumer Electronic DRAM (CEDRAM), including DDRI DRAM, DDRII DRAM, SDR DRAM, and Low-Power SDRAM. Its system-on-chip products include USB 3.0 host controllers and webcam controllers.
Etron focuses on premium-quality products and advanced technology development. Its products are widely used in network communications, optical disc drives, hard disk drives, digital TV and panels, digital set-top boxes, video graphics cards, portable devices and automotive electronics. The company has fostered long-term, stable, and cooperative relationships with many leading international companies.
Etron is following the industry trend of "Heterogeneous Integration," successfully developing and combining memory and SoC for various applications. Etron continues to provide exceptional products and service, helping customers create significant value, a win-win situation for all parties.
For more information please visit the company's website: www.etron.com.
Dainippon Screen, established in 1943, is a leading supplier of flat panel display and semiconductor equipment. Screen is currently involved in manufacturing production equipment in a variety of fields, including FPDs, semiconductors, printed circuit boards, and printing and prepress equipment such as thermal CtP recorders and on-demand printing systems.
More information is available at http://www.screen.co.jp
Macronix is the largest and the most advanced supplier of ROM products worldwide. As one of the top world-class suppliers of nonvolatile memory semiconductors, Macronix currently produce a wide range of ROM and NOR Flash products and solutions across various densities in embedded, consumer, and enterprise applications. Established in 1989 in the Science Park, Hsinchu, Taiwan, Macronix is dedicated to developing top-notch home-grown technologies and improving its manufacturing capability to offer its customers high quality products and services.
For more information, please visit mxic.com.
Founded in 1990, Rambus is one of the world's premier technology licensing companies. As a company of inventors, Rambus focuses on the development of technologies that enrich the end-user experience of electronic systems. Its breakthrough innovations and solutions help industry-leading companies bring superior products to market. Rambus licenses both its world-class patent portfolio, as well as its family of leadership and industry-standard solutions. Rambus has offices in California, North Carolina, Ohio, India, Germany, Japan, Korea, and Taiwan.
For more information, visit rambus.com.
From industry leading memories to advanced enterprise solutions, the Semiconductor & Storage Products Company seeks global leadership across its product areas: discrete products, logic LSIs, analog and imaging ICs, memories and storage products.
In semiconductors the emphasis is on four key business fields: memories, logic LSIs, analog and imaging ICs, and discrete products. Toshiba invented NAND Flash memory and leads the industry with its cutting-edge technology, supporting advances in digital products. The company is expanding production capacity for power devices, foreseeing demand for energy-saving digital products. In July 2011, the company integrated Toshiba’s storage products businesses in hard disk drives (HDD) and solid state drives (SSD). As the only company supplying HDD, SSD and NAND Flash memory solutions, and by combining high capacity SSD and high performance HDD, Toshiba is ready to respond to global needs in data storage and cloud-computing.
For more information, visit toshiba.com.
TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry industry's largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company's total managed capacity in 2006 exceeded seven million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GigaFabs, four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC. TSMC is the first foundry to provide 65nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan.
For more information, visit tsmc.com.