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Featured Speakers

Joel Hartmann

Joël Hartmann
STMicroelectronics

Dr. Chenming Hu

Dr. Chenming Hu
University of California, Berkeley

Subramanian Iyer

Subramanian S. Iyer
IBM

Subramani Kengeri

Subramani Kengeri
GLOBALFOUNDRIES

Nick Yu

Nick Yu
Qualcomm

Program

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Time Item  
8:00 a.m. Registration/Networking Breakfast  
9:00 a.m. Opening Remarks  
9:00 a.m. Keynote Address: Keeping Moore's Law Alive

Dr. Subramanian S. Iyer, IBM Fellow and Chief Technologist, Microelectronics Division, IBM

Dr. Subramanian S. Iyer
9:30 a.m. Keynote Address: Advancements in CMOS Technologies

Subramani Kengeri, Head of Advanced Technology Architecture, Office of the CTO, GLOBALFOUNDRIES

Presentation not currently available.

Subramani Kengeri
10:00 a.m.

Panel Discussion: Extending the Life of CMOS

Presentation not available.

Moderator: Dr. Roawen Chen, Vice President, Manufacturing Operation, Marvell Semiconductor, Inc.

Panelists:

Dr. Roawen Chen
 
  • Jim Aralis, Chief Technology Officer and Vice President, R&D, Microsemi
Jim Aralis
  Paul Boudre
 
  • Shung Chieh, Vice President, Technology Development, Aptina Imaging
Shung Chieh
 
  • Matt Crowley, Vice President, Hardware Development, Tabula
Matt Crowley
  Pushkar Ranade
11:00 a.m.
Networking Break
Sponsored by True Circuits
True Circuits
11:15 a.m. Keynote Address: The Case for SOI Technology

Joël Hartmann, Corporate Vice President, Front-End Manufacturing & Process R&D, Digital Sector, STMicroelectronics

Joël Hartmann
11:45 a.m. Keynote Address: The Revolutionary Scope of Multi-Gate Transistors

Dr. Chenming Hu, TSMC Distinguished Chair Professor of Microelectronics, University of California, Berkeley

Dr. Chenming Hu
12:15 a.m. Lunch  
12:45 p.m. Keynote Address: The Multidimensional Landscape

Nick Yu, Vice President, Engineering, Qualcomm

Nick Yu
1:15 p.m.

Panel Discussion: 3D Packaged IC Ecosystemz

Presentation not available.

Moderator: Mark Brillhart, Vice President, Technology and Quality, Cisco Systems, Inc.

Panelists:

Mark Brillhart
 
  • Raman Achutharaman, Corporate Vice President, Strategy & Marketing, Silicon Systems Group, Applied Materials
Raman Achutharaman
 
  • Liam Madden, Corporate Vice President, FPGA Development and Silicon Technology, Xilinx
Liam Madden
 
  • David McCann, Senior Director, Packaging R&D, GLOBALFOUNDRIES
David McCann
 
  • Stephen Pateras, Senior Director, Marketing, Silicon Test Division, Mentor Graphics
Stephen Pateras
 
  • Rich Rice, Senior Vice President, Sales & Engineering, ASE
Rich Rice
2:15 p.m. 3D IC Working Group Meeting  

 

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