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Featured Speakers

Joel Hartmann

Joël Hartmann

Dr. Chenming Hu

Dr. Chenming Hu
University of California, Berkeley

Subramanian Iyer

Subramanian S. Iyer

Subramani Kengeri

Subramani Kengeri

Nick Yu

Nick Yu


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Time Item  
8:00 a.m. Registration/Networking Breakfast  
9:00 a.m. Opening Remarks  
9:00 a.m. Keynote Address: Keeping Moore's Law Alive

Dr. Subramanian S. Iyer, IBM Fellow and Chief Technologist, Microelectronics Division, IBM

Dr. Subramanian S. Iyer
9:30 a.m. Keynote Address: Advancements in CMOS Technologies

Subramani Kengeri, Head of Advanced Technology Architecture, Office of the CTO, GLOBALFOUNDRIES

Presentation not currently available.

Subramani Kengeri
10:00 a.m.

Panel Discussion: Extending the Life of CMOS

Presentation not available.

Moderator: Dr. Roawen Chen, Vice President, Manufacturing Operation, Marvell Semiconductor, Inc.


Dr. Roawen Chen
  • Jim Aralis, Chief Technology Officer and Vice President, R&D, Microsemi
Jim Aralis
  Paul Boudre
  • Shung Chieh, Vice President, Technology Development, Aptina Imaging
Shung Chieh
  • Matt Crowley, Vice President, Hardware Development, Tabula
Matt Crowley
  Pushkar Ranade
11:00 a.m.
Networking Break
Sponsored by True Circuits
True Circuits
11:15 a.m. Keynote Address: The Case for SOI Technology

Joël Hartmann, Corporate Vice President, Front-End Manufacturing & Process R&D, Digital Sector, STMicroelectronics

Joël Hartmann
11:45 a.m. Keynote Address: The Revolutionary Scope of Multi-Gate Transistors

Dr. Chenming Hu, TSMC Distinguished Chair Professor of Microelectronics, University of California, Berkeley

Dr. Chenming Hu
12:15 a.m. Lunch  
12:45 p.m. Keynote Address: The Multidimensional Landscape

Nick Yu, Vice President, Engineering, Qualcomm

Nick Yu
1:15 p.m.

Panel Discussion: 3D Packaged IC Ecosystemz

Presentation not available.

Moderator: Mark Brillhart, Vice President, Technology and Quality, Cisco Systems, Inc.


Mark Brillhart
  • Raman Achutharaman, Corporate Vice President, Strategy & Marketing, Silicon Systems Group, Applied Materials
Raman Achutharaman
  • Liam Madden, Corporate Vice President, FPGA Development and Silicon Technology, Xilinx
Liam Madden
  • David McCann, Senior Director, Packaging R&D, GLOBALFOUNDRIES
David McCann
  • Stephen Pateras, Senior Director, Marketing, Silicon Test Division, Mentor Graphics
Stephen Pateras
  • Rich Rice, Senior Vice President, Sales & Engineering, ASE
Rich Rice
2:15 p.m. 3D IC Working Group Meeting  


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