Abstracts
10:00 a.m. - 10:45 a.m.
Keynote Address: Consumer Connectivity Trends – The Battle to Meet Wireless Application Demands
Wireless is no longer just about cellular technology; capability is increasingly defined by the benefits brought with integration of multiple wireless technologies such as Wi-Fi, GPS, Bluetooth, FM radio and Near-field Communication (NFC). The advent of cost-effective wireless "combo" chips is broadly driving multiple wireless standards beyond smart phones into high-volume mobile handsets and other mobile Internet devices (MIDs) with a plethora of applications waiting to be discovered. At the heart of this demand is the consumer’s need to stay connected at all times. This connectivity trend has forced semiconductor companies to focus their creativity in developing innovative chips that will enable consumers to stream data content through their smart phones, e-readers, connected digital TVs, 3-D TVs, set-top boxes, game consoles and more. How do semiconductor companies address the challenges they face when trying to anticipate consumer connectivity trends and their demand for ever increasing wireless application capabilities?
11:00 a.m. - 12:00 p.m.
Panel Discussion: The Challenges of Connecting Everywhere, All the Time
Semiconductor companies have taken advantage of emerging vertical markets while trying to address the challenges these markets produce. Not only does the number of wireless applications continue to grow, so do consumer expectations. Video streaming, fast data downloads and continuous connectivity all play a part in creating difficult road blocks when it comes to power management, bandwidth and data transfer processor speeds. Also, semiconductor companies are now having to reevaluate their approach in developing chips for the home networking sector that can meet consumer demand and profitability goals. It is no longer about having a connected TV, but includes managing your home environment through communicating directly with your appliances, PCs, gaming consoles and more through networks and smart grid technology. In addition, you can’t forget the set-top-box evolution that leads to the entertainment networking trend, adding a whole new dimension to the ‘connected home’.
This panel will address what technology is available to meet this connectivity demand and touch on challenges that must be overcome.
1:00 p.m. - 1:45 p.m.
Keynote Address: The Bandwidth Phenomenon - Managing Data Traffic Flow for Today's Consumer
Will there be sufficient network bandwidth to support the dramatic increase in mobile data usage? The ability of carriers to expand coverage and capacity with limited spectrum will be challenging in today's business environment. In addition to the on-going evolution of the cellular standards to higher data rates and efficiency, Wi-Fi will play an important role in helping to offload data traffic from overworked cellular networks. We will discuss the challenges, limitations and issues, as well as possible solutions such as combination wireless SOCs.
2:00 p.m. - 3:00 p.m.
Panel Discussion: The Race to Improve Mobile Data Transfer
Traffic management has become a major concern for mobile networks as bandwidth-intensive data transfer increases. The laws of physics can’t be broken. Networks such as 3G, HSPA, LTE and WiMAX use the same network infrastructure (fiber-optic, copper, etc.). But with ever increasing amounts of data transfer, can broadband providers ensure access to all customers all the time?
With bandwidth-intensive applications, such as peer-to-peer (P2P) file sharing, will more problems arise? The main drivers for bandwidth solutions stem from the problems providers deal with in terms of network capacity, volume and sufficient memory to continually supply consumers with 24 hour access to streaming data content.
To further complicate matters, providers have also been tasked with updating their networks regarding backhaul. A complete update to the backhaul will presumably relieve the bandwidth issue, but it takes money and time to make a noticeable improvement. Providers aren’t likely to see adequate returns quickly. How will this impact bandwidth growth and adoption? What opportunities can semiconductor companies take advantage of to lead the charge and win the race to improve mobile data transfer?
3:30 p.m. - 4:15 p.m.
Keynote Address: Infrastructure Innovation - Can the Challenge be Met?
The challenges operators and OEMs face are more than just a simple IC can resolve. Backhaul and core are struggling to keep up with the demand in data traffic and are facing the need to upgrade their networks due to massive congestion. According to Barclays, backhaul utilization rates are running at much higher levels than the 30-40 percent in the overall wireless network. This presents an opportunity for semiconductor companies to develop technology that will enable this infrastructure support for operators. Additionally, chip companies must now consider key architectural decisions that will address power management, processing locations, faster processing speeds, smaller footprints and smaller geometries, etc. Will mobile Internet devices (MIDs) suppliers chase megahertz with ever more powerful (and power hungry) chipsets at the expense of battery life or can we count on sufficient mobile solutions, such as the Internet Cloud or 3D IC chips to take us to the next level of growth?
4:30 p.m. - 5:30 p.m.
Panel Discussion: From MIDs to Base Stations – Where Mobility Infrastructure Meets Innovation
According to Jon Peddie Research, the market for eBooks, tablets, smartphones and other mobile consumer products is exploding, leading to an increase in market opportunity for multimedia and application processors. With this market expansion in multifunctional devices, the semiconductor industry is now facing the need to develop chips with different processor optimizations and advanced capabilities. In fact, the total available market (TAM) for these devices is expected to grow to over 1.3 billion by 2015 (Jon Peddie Research).
Operators are also dealing with infrastructure support challenges in trying to manage the data traffic that is increasing exponentially as more consumers move to mobile devices for personal and business-related activities. The connectivity trend has forced semiconductor companies to take a new look at how to innovate to create solutions and move into new profitable revenue streams in the communications market. To meet that objective, companies must first address the overall design, power management and architectural challenges through the development of chips that utilize existing technology while improving quality and performance. This panel will focus on the possible solutions such as 3D/TSV capabilities, 4G LTE deployment, Cloud Computing opportunities and advanced basestation ICs that can potentially meet consumer demand, relieve the data traffic bottleneck while still meeting profitability goals.
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