Amkor Technology will introduce a
next-generation, high-density package-on-package (PoP) technology at IMAPS
Device Packaging Conference (DPC)
March 9-12 in Scottsdale, Arizona. This
technology enables the top-side package
stacking interface to scale with industry
ball grid array (BGA) pitch reductions
by creating interconnect through the
mold cap of the bottom package.
Amkor has named this new interconnect
technology Through-Mold Via (TMV™),
with the following promotions planned
at DPC: a presentation at IMAPS
Global Business Council conference
(March 9) regarding the supply chain
collaborations instrumental in the
development of TMV™ and through-silicon
via technologies; an exhibit booth
(March 10-11) where samples and experts
will be available to explain this new
PoP technology; and a technical paper
(March 12) concerning the development
and qualification of TMV™ technology.
With new high-density memory
architectures emerging in handheld
multimedia applications including low-power
Double Data Rate 2 (DDR2),
the industry has been looking for a next-generation
PoP technology. Amkor’s
TMV™ technology has received strong
support during the development phase
from both IC suppliers and handset original
equipment manufacturers (OEMs). This
builds on the success (awards and market
leadership) Amkor has enjoyed through the
first generation of PoP technologies over
the past four years.
For additional information, contact:
Lee Smith
(T) 480-821-2408 ext. 5381
(E) lsmit@amkor.com
(W) www.amkor.com
Evans Analytical Group (EAG)
is a leading provider of surface
analysis, materials characterization,
microelectronic release to production
(RTP), microscopy and calibration
services. EAG offers over 30 analytical
techniques and services supported
by a fleet of 150 major instruments
across Asia, Europe and the U.S.
With the recent acquisition of Nano
Integrated Solutions Inc., EAG has
taken an important step in creating
a complete turnkey service offering.
EAG’s services include automated test
equipment (ATE) test services; test
development and engineering; certified
test training; tester time; reliability
and environmental dualification;
electrostatic discharge (ESD) and latch-up
characterization; printed circuit
board (PCB) layout and hardware
design; failure analysis; focused ion beam
(FIB) circuit modifications; electron
microscopy; materials characterization;
surface analysis; and equipment
calibration and repair services.
For additional information, contact:
Aram Sarkissian
(T) 408-524-0146
(E) aram@eaglabs.com
(W) www.eaglabs.com
ISE Labs, an ASE company, offers
customers unique access to world-class
packaging and assembly manufacturing
expertise for prototype, initial and
low-volume production. By using the
same facility for full-scale, high-volume
production, customers can streamline
their product-to-market process and
bypass the qualification process for
production parts.
ISA Labs provides the most
comprehensive set of back-end products
and services, encompassing engineering,
qualification and full-scale, high-volume
production. The company’s full offerings
include package design and assembly,
test engineering support, production test
services, test program development, test
interface and reliability test hardware,
ESD, burn-in, environmental testing,
mechanical testing and failure analysis.
For additional information, contact:
KT Soon
(T) 510-687-2482
(E) ksoon@iselabs.com
(W) www.iselabs.com
Magma Design Automation,
a provider of chip design
software, licensed its automatic
test pattern generation (ATPG)
technology to LogicVision,
a leading provider of
semiconductor built-in-self-test
(BIST) and diagnostic
solutions. The agreement
enables LogicVision to
accelerate the expansion of its
product portfolio and provide
customers with comprehensive
design-for-test (DFT)
capabilities that improve
test quality and reduce
turn-around time and
costs of nanometer ICs. A
separate agreement was also
signed that allows Magma
to distribute LogicVision
products to its strategic customers.
LogicVision will develop, market and
support ATPG and ATPG compression
solutions based on advanced technologies
developed by Magma. The companies will
ensure tight interoperability between the
advanced DFT capabilities and Magma’s
IC implementation software.
For additional information, contact:
(T) 408-453-0146
(E) info@logicvision.com
(W) www.logicvision.com
LTX-Credence, a global provider of
focused, cost-optimized ATE solutions,
added two new FX digital options for its
X-Series test platform – the FX2 and FX-HS
digital subsystems. Both options enhance
the ability of the X-Series to provide cost-optimized
test solutions for the full range of
consumer and mobility devices. FX2 doubles
the digital pin count per instrument as current
FX1 digital subsystems, resulting in a lower
cost per pin and twice the pin count. FX-HS
provides a powerful combination of hardware
and software features targeted at high-speed
inputs/outputs (I/Os) in next-generation
consumer and mobility devices.
For additional information, contact:
Mark Gallenberger
(T) 781-467-5417
(E) mark_gallenberger@ltx-credence.com
(W) www.ltx-credence.com
MASER Engineering offers semiconductor
companies board-level reliability (BLR)
tests for evaluation of solder interconnects
in their advanced, very thin BGA and chip
size packages (CSP). Recent investments
in mechanical reliability test approaches
are now paying off. Joint Electron Device
Engineering Council (JEDEC) drop tests
with qualified, approved equipment by major
mobile phone manufacturers and a new in-house
developed PCB bending test tool result
in a fast reliability assessment of advanced
packages. Linear ramp temperature cycling
for BLR tests is also available. Reliable solder
interconnects in handheld electronics are of
great importance for product quality and
customer satisfaction. MASER Engineering’s
test and analysis facilities can provide stress
analysis of products and report detailed
defect analysis of the material properties.
For additional information, contact:
Kees Revenberg
(T) 31-53-480-26-81
(E) kees.revenberg@maser.nl
(W) www.maser.nl
Founded in 1994, MVTS Technologies is
a premier provider of refurbished ATE to
the semiconductor industry. One of MVTS
Technologies’ goals is to extend ATE longevity
by providing access to “out-of-production”
equipment, spare parts, upgrades and
services. MVTS also has an unprecedented
model of partnering with OEMs such as
LTX, Credence, Teradyne and Verigy. In
2008, MVTS opened test applications
centers (TACs) in three locations, providing
services including test program development,
full product characterization and initial
production ramp. In a customer support
collaboration program with Verigy, MVTS
added a V93000 port scale radio frequency
(RF) system to its TAC floor in Carlsbad,
California, and is now offering fabless
companies a low-cost option for developing
products on this platform.
For additional information, contact:
Lisa Bruhn
(T) 760-930-8950
(W) www.mvts.com
Known as Silicon Valley’s packaging foundry,
Promex has announced newly expanded
capabilities for its quad flat no-lead (QFN)
over-molded IC assembly. All QFNs
are Reduction of Hazardous Substances
(RoHS)-compliant and assembled in JEDEC
standard or custom formats to accommodate
system-in-package (SiP), stacked die,
microelectromechanical systems (MEMS)
or thin-molded versions. Passives for SiP
are placed using in-house automated surface
mount technology (SMT) equipment. The
company has also announced it will provide
copper wire bonding and additional fine-pitch
gold wire bonding capacity. Promex is a
recognized leader in materials-centric custom
IC packaging and plastic, ceramic and over-molded
plastic IC assembly. The company
provides same day quick turns, development
prototyping, fast track product introductions
and beta manufacturing through pre-Asia
volume production.
For additional information, contact:
(T) 408-496-0222
(E) pughc@promex-ind.com
(W) www.promex-ind.com
Scanimetrics and NXP completed a successful
product qualification. Scanimetrics integrated
WiTAP™ into an NXP SiP product. Because
even automation is unable to reproduce
chips perfectly every time, Scanimetrics
has developed the WiTAP™ product to
help reduce costs by isolating defective
components during assembly. This product
demonstration qualifies Scanimetrics’
technology and shows its innovation as
compelling. This will facilitate Scanimetrics’
promotion and sale of its product to larger
markets. Scanimetrics is actively marketing
WiTAP™ applications in set-top boxes,
Bluetooth devices, Global Positioning
System (GPS), medical sensors, military
devices, multi-processors and satellites.
For additional information, contact:
Adeline Chiu
(T) 780-433-9441 ext. 306
(E) achiu@scanimetrics.com
(W) www.scanimetrics.com
Teradyne acquired Eagle Test Systems (ETS)
in November 2008 and added the ETS line to
complete its spectrum of semiconductor test
products. Teradyne now serves customers in
every segment of the market, ranging from
analog IC devices to complex system-on-chip
(SOC) devices. Teradyne’s UltraFLEX™
is used for testing complex SOC devices in
the digital, RF and mixed-signal sector; the
FLEX™ is used for testing analog application-specific IC (ASIC) devices in the power, RF
and automotive sector; and the J750 family
is used for testing low-cost consumer devices,
including microcontrollers, liquid crystal
display (LCD) and image sensors. Nextest’s
Magnum is used for testing Flash memory and
low-speed dynamic random access memory
(DRAM) probe. Teradyne’s recently added
ETS line tests analog IC devices, including
power, linear, sensors and discretes.
For additional information, contact:
Jessica Faulkner
(T) 978-370-1437
(E) jessica.faulkner@teradyne.com
(W) www.teradyne.com/std
Verigy, a premier semiconductor test
company, announced that Winbond
Electronics, a leading Flash memory supplier,
purchased multiple Verigy V5400 Flash
memory testers for its Taichung, Taiwan
facility. Winbond will use the systems for
wafer sort testing of its SpiFlash™ serial
Flash memories which feature the Serial
Peripheral Interface (SPI) and are used in
PCs, cell phones and other mobile devices.
Winbond selected the V5400 over other
Flash memory testers on the market because
it offers better cost-of-test, and the large
installed base of V5400 testers in Taiwan
will allow them to more easily serve their
customers. Winbond already uses the Verigy
V5000e engineering workstation, also part
of the V5000 series, which allows them to
transfer existing test programs to the V5400
systems for high-volume production,
generating further efficiencies.
For additional information, contact:
(T) 408-864-2900
(W) www.verigy.com
