Advantest's M4841 dynamic test handler enables high-throughput parallel test for very high volumes of devices and supports complex ICs and packages, including ball grid array (BGA), chip size package (CSP) and quad flat pack (QFP). Offering an unprecedented combination of 16-device parallel test and 18,500 device-per-hour throughput at 2.5 seconds test time or less, the handler sets a new industry standard and contributes significantly to lowering the cost of test. A production-ready workhorse, the M4841 is ideal for high-volume production of devices used in consumer applications and with temperature stabilization that must meet the highest standards (such as in avionics, automotive and high-speed, low-power double data rate 2 (LPDDR2) mobile devices) under a range of extreme environmental stresses. The M4841 has been adopted for cost-sensitive manufacturing around the globe.
For additional information, contact:
Greg Self
(T) 408-988-7700
(E) g.self@advantest.com
(W) www.advantest.com
Amkor Technology introduced its highly anticipated next-generation package-on-package (PoP) platform at the International Microelectronics and Packaging Society (IMAPS) Device Packaging Conference in Scottsdale, Arizona. This new PoP platform uses Amkor's proprietary through mold via (TMV™) interconnect technology to meet challenging next-generation, high-density PoP requirements. Amkor's TMV PoP technology is expected to provide a range of key benefits for new three-dimensional (3D) architectures: enabling scaling of the PoP stacked interface to 0.4mm pitch in support of emerging high-density memory architectures; allowing larger silicon area within an existing package footprint, benefiting both system architects and IC designers; supporting flip-chip, wirebond, stacked die and passive integration in the bottom package for increased integration and design flexibility; and providing reduced package warpage that enables thinner PoP stacks and improved surface mount assembly for high-density, fine-pitch applications.
For additional information, contact:
Lee Smith
(T) 480-821-5000 ext. 5318
(E) lsmit@amkor.com
(W) www.amkor.com
Evans Analytical Group's (EAG) release-to-production (RTP) group provides engineering expertise and equipment capability in the areas of test program development and product engineering; test time rental on all major automatic test equipment (ATE) platforms; reliability and environmental qualification; electrostatic discharge (ESD) and latch-up testing; printed circuit board (PCB) layout and hardware design; failure analysis; focused ion beam (FIB) circuit edit and debug; electron microscopy; and equipment calibration and repair services. EAG also has over 30 years experience in bulk materials characterization and surface analysis. Customers save valuable time and money by outsourcing all or select functions to EAG's RTP group.
For additional information, contact:
Aram Sarkissian
(T) 408-921-4870
(E) aram@eaglabs.com
(W) www.eaglabs.com
LogicVision, a leading worldwide provider of semiconductor built-in-self-test (BIST) and diagnostic solutions, signed a three-way agreement with Toppan and Syswave for turnkey design and test services. As designs continue to grow and become more complex, there is significant benefit to providing customers with a near turnkey solution. This team will integrate as well as provide back-end debug and manufacturing test support of advanced BIST solutions for complex designs. In this three-way arrangement, Toppan will integrate and verify LogicVision's BIST intellectual property (IP) into customer designs, while Syswave will provide support in using these BIST capabilities during debug and manufacturing test. This business collaboration will provide added value to each of the three companies' mutual customers by providing a one-stop integrated strategy for device development and test.
For additional information, contact:
(T) 408-453-0146
(E) info@logicvision.com
(W) www.logicvision.com
LTX-Credence, a global provider of focused, cost-optimized ATE solutions, and Spirox, LTX-Credence's long-term value-added partner in Taiwan and China, integrated their local organizations in these regions. The integration establishes a solid support infrastructure, enabling the companies to provide local customers with the highest caliber of products, delivery, service and support. Spirox has a long history of providing sales and support services for Credence products in Taiwan and China. Since the completion of the merger of LTX and Credence in late August 2008, LTX-Credence and Spirox have been working closely to streamline their field operations organization to enhance support for customers in the region. With these activities now complete, Spirox significantly extends the support capabilities for LTX-Credence customers, offering integrated, best practice solutions; advanced technology; and continuous support. The depth and breadth of Spirox's support compliments the installed base of LTX-Credence test systems, currently the largest in the Asia-Pacific region.
For additional information, contact:
(T) 408-635-4300
(W) www.ltx-credence.com
MVTS' business focus is on the support, refurbishment and sale of out-of-production legacy ATE. Systems are custom-configured like new. MVTS' offerings include refurbished legacy equipment from LTX, Credence and Teradyne. This multi-platform product offering enables creative solutions such as trading in one type of equipment toward the purchase of another. MVTS designs and sells test system controller upgrades and other enhancement products for these testers. ATE end users can find spare parts and original equipment manufacturer (OEM)-designed tester upgrades at MVTS. MVTS also offers a complete range of services predominately for LTX and Credence legacy testers, including calibration, module repairs, installation of upgrades, training, field service, tester rentals and applications support. Ongoing support for these legacy testers is available globally, ensuring access to testers, upgrades and other support for many years to come.
For additional information, contact:
Lisa Bruhn
(T) 760-795-2516
(E) lisa.bruhn@mvts.com
(W) www.mvts.com
Presto Engineering provides Design Success Analysis™-comprehensive semiconductor test and analysis solutions that help improve the speed and predictability of new product releases. The company is now ISO 9001 certified, delivering reliability testing services such as pre-conditioning, ESD, latch-up, highly accelerated stress test (HAST), high-temperature operation life (HTOL), thermal cycling test (TCT) and high-temperature storage (HTS). Other services include test engineering services and ATE; unique design expertise in connecting ATE to failure analysis equipment; in-silicon electrical failure analysis (emission and laser-based power, hotspot/leakage and interconnect characterization, internal timing measurement and FIB circuit edit); and unique capabilities in backside (silicon-side) utilization, aiming all techniques to 45nm process technology.
For additional information, contact:
Richard Curtin
(T) 408-434-1808 ext. 303
(E) richard.curtin@presto-eng.com
(W) www.presto-eng.com
Scanimetrics' UltraI/O™ technology provides a high-speed, low-power data communication solution that is smaller than conventional communications systems and requires less power and fewer input/output (I/O) pads. Developed to solve chip interface bottlenecks, UltraI/O has increased data transfer rates and reduced I/O power consumption and chip surface area when compared with current technologies. The UltraI/O interconnection can be tested even in a multi-chip module (MCM) by Scanimetrics' WiTAP™ probing system. It is generally difficult or unfeasible to verify interconnect structures (e.g., through-silicon via (TSV)) in MCM designs. UltraI/O™ has various applications, including microprocessors, portable memory, system-in-package (SiP) and MCMs.
For additional information, contact:
Adeline Chiu
(T) 780-433-9441 ext. 306
(E) achiu@scanimetrics.com
(W) www.scanimetrics.com
STATS ChipPAC received Intel's prestigious Supplier Continuous Quality Improvement (SCQI) award recognizing world-class, outstanding performance in 2008. This award is Intel's highest honor for its suppliers, acknowledging extraordinary commitment to quality and exceptional performance in providing full turnkey packaging and test services deemed essential to Intel's success. STATS ChipPAC is among an elite group of 14 suppliers to receive the SCQI award for 2008. The SCQI award is part of Intel's Supplier Continuous Quality Improvement program, which encourages Intel's key suppliers to strive for excellence and continuous improvement. To qualify for SCQI status, suppliers must score at least 95 percent on a report card that assesses performance and ability to meet cost, quality, availability, delivery, technology and responsiveness goals. Suppliers must also manage and deliver on a challenging improvement plan and a quality/business systems assessment.
For additional information, contact:
(T) 65-6824-7777
(W) www.statschippac.com
Teradyne announced that Unisem Group, a global provider of semiconductor assembly and test services for many of the world's most successful electronics companies, purchased a Teradyne® FLEX™ test system with BBAC™ and DC75 instrumentation to test baseband and network devices for wireless and optical modems. The system will support Unisem's fabless customers throughout Europe. Teradyne's FLEX test family, approaching 2,000 test systems shipped, advances test technologies in an architecture designed for high-efficiency, multi-site test. The FLEX family readily adapts to new test requirements. With a universal slot architecture and high-density instrument design, test engineers can dynamically match system configurations to changing production requirements on the test floor.
For additional information, contact:
(T) 978-370-2700
(W) www.teradyne.com
Verigy, a premier semiconductor test company, announced that Spreadtrum Communications, one of China's leading wireless baseband chipset providers, selected the V93000 system for production testing of its China Multimedia Mobile Broadcasting (CMMB) mobile digital television decoder/demodulator semiconductors. As the leading demodulator IC provider in the CMMB market, which is expected to grow substantially in China over the next several years, Spreadtrum selected the V93000 for its high-accuracy analog-to-digital converter (ADC) test and fast IC quiescent current (IDDQ) measurement capabilities. The V93000 meets the accuracy and performance requirements of testing Spreadtrum's highly integrated, high-quality CMMB demodulator and audio/video decoder designs. The flexibility and scalability of the V93000 will make it easy for Spreadtrum to add support for future design requirements. Verigy's large installed base of V93000s also provides the supply chain flexibility needed to handle market fluctuations.
For additional information, contact:
(T) 408-864-2900
(W) www.verigy.com
