Driving Packaging Innovation
Bob Warren, Director, Packaging Engineering and Assembly Manufacturing, Conexant Systems Inc.
Semiconductor Cost Reduction Strategies
Bob Scarborough, Chief Executive Officer, Tensoft Inc.
Regis Bescond, Corporate Controller, Amlogic
Macro-economic Trends in the Fabless Industry
Anthony Simon, Vice President, Marketing, Zoran Corporation
Semiconductor Innovation in an Investment-Constrained Economy
Steve Z. Szirom, President, InsideChips.com
Innovation through Collaboration: Guiding Principle for the 21st Century
Katrien Marent, Corporate Communications Director, Business Development, IMEC
The Benefits and Architecture of IP Test Program Re-use in an ATE Environment
Donald W. Blair, Principal Consultant, Verigy Ltd.
Design Quality Closure: Enabling Less Iteration at Every Handover in a Design
Process
Michel Tabusse, Ph.D., Chief Executive Officer, Satin IP Technologies
Semiconductor Commoditization: The $250 Billion Question
Sanjay Krishnan, Business Manager, High-Performance Analog Group, Maxim Integrated Products
Funding for Innovation in Challenging Times
Bob Strasser, Partner, Technology Practice, BDO Seidman
Part 3 of 4: Immigration: Finding the Good in the Bad Economy
Irina Plumlee, Partner, Gardere Wynne Sewell LLP
