AccelerATE Solutions is a multi-platform
test engineering service provider located
in San Jose, California. The company's
mission is to leverage its extensive
experience and contacts within the
semiconductor test arena to expedite its
customers' time-to-market. AccelerATE
provides the following services to reduce
production costs: test pattern conversion,
test interface development, test program
development, device characterization,
failure analysis (if required), test program
optimization, sample production,
deployment to volume manufacturing,
and test program conversion.
For additional information, contact:
Tom Nulsen
(T) 408-573-6066
(E) info@acceler-ate.com
(W) www.acceler-ate.com
Advantest's new T5385 memory test
system for dynamic random access
memory (DRAM) wafer test delivers an
unrivalled 768-device under test (DUT)
parallel test capacity and 533Mbps
capability for increased throughput
and lowered cost of test. Ideal for high-volume
wafer fabs, the new tester is also
equipped with a flexible pin configuration
that supports diverse DRAM devices,
allowing tester pin resources to be
optimally allocated for efficiency, reduced
touchdowns and improved throughput.
Achieving improved efficiency per device
while scaling even higher in parallelism,
the T5385 also delivers known good die
(KGD) for consumer devices to greatly
improve yields for low-power double data
rate two (LPDDR2) and DDR3 multi-die
and stacked devices. Enabled by hardware
and software advances, the T5385 offers a
high-speed memory repair analysis (MRA)
system for DRAM and Flash memory
wafer test that greatly reduces test time.
For additional information, contact:
Greg Self
(T) 408-988-7700
(E) g.self@advantest.com
(W) www.advantest.com
Amkor Technology has introduced
an automated multi-site wireless local
area network (WLAN) system tester
capable of testing WLAN 802.11 (a/b/g/n), Worldwide Interoperability for
Microwave Access (WiMAX) 802.16,
ZigBee, Bluetooth and Global Positioning
System (GPS). This tester integrates an
off-the-shelf one-box tester (OBT) for
wireless standard conformance testing
with power supplies, multimeter and PC
control via any standard PC interface.
The multi-site wireless enhanced system
test (M-WeST) module can dock to
any standard automatic test equipment
(ATE) test handler for up to quad-site
testing. Automated parallel testing
reduces the cost of system-level testing
and product time-to-market.
Additional benefits of the M-WeST
module include a zero footprint, fitting
conveniently under standard pick-and-place
handlers; unique radio frequency
(RF) shielding which provides isolation
between sites, ensuring more accurate
test results; and extendibility to other RF
system-level test such as general packet
radio service/Enhanced Data for Global
System for Mobile Communications
(GSM) Evolution (GPRS/EDGE) or
3G/3.9G cellular.
For additional information, contact:
Mark M. Berry
(T) 480-821-5000 ext. 5449
(E) mark.berry@amkor.com
(W) www.amkor.com
Evans Analytical Group's (EAG) release-to-production (RTP) team provides
engineering service and support from
chip tapeout to volume production in the
areas of ATE test hardware and software
development, reliability qualification,
electrostatic discharge (ESD) and latch-up,
printed circuit board (PCB) design,
circuit edit/debug, yield enhancement,
failure analysis, electron microscopy,
and equipment calibration and repair
services.
EAG offers a wide range of ATE test
systems for rent, and full engineering
and production test capability through
its newly constructed ISO certified test floor in Santa Clara,
California and expanded production
test capability in San Diego,
California. EAG's newly
added fault isolation/laser
timing probe system, which
can be docked to any ATE
platform, can be used to do
backside probing of any net
in the chip while receiving
stimulus from several 1,000+
pin count testers.
For additional information, contact:
Aram Sarkissian
(E) aram@eaglabs.com
(W) www.eaglabs.com
ISE Labs has recently added
the ability to characterize
and run production on
memory parts such as
DDR3 with speeds up
to 3.6Gbps. The Verigy
High-Speed Memory
(HSM) system's flexibility
gives ISE the ability to debug,
shmoo and find failing segments much
faster than older systems. ISE can also
provide turnkey test solutions such as
engineering expertise, handlers, probers
and load board design. This integration
will help start-ups as well as larger
memory customers bring their product
to market.
For additional information, contact:
James Yu
(T) 510-687-2508
(E) jyu@iselabs.com
(W) www.iselabs.com
LTX-Credence, a pioneer of
semiconductor ATE solutions,
announced a new system architecture
that drives production floor efficiency to a new level. An integrated multi-system
architecture (IMA) supports the
assembly of optimized test system arrays
using compact, low-cost test systems
as fundamental building blocks. This
new test paradigm allows customers to
maximize production floor flexibility and
utilization, resulting in lower cost of test
and reduced capital spending.
Allowing the ultimate in flexibility,
IMA tester arrays eliminate the need to
purchase expensive, physically large, high
pin count systems. With the purchase of
an IMA controller, customers have the
ability to gang multiple low-cost systems
into a tester array that enables massive
multi-site testing. Further, IMA tester
arrays can be rapidly reconfigured into
individual testers to address the volatile
dynamics of semiconductor production.
For additional information, contact:
(T) 408-635-4300
(W) www.ltx-credence.com
Melexis NV, a leading supplier of mixed-signal
semiconductors to the automotive
and industrial markets, selected Pintail
Technologies' TestScape database system
to provide real-time statistical process
control (SPC) monitoring for over 300
testers located in three countries. The
initial goal of the system will be to further
improve the quality and yield of testing at
both probe and final test.
Pintail Technologies is a semiconductor
test improvement and yield learning
company that provides breakthrough
software to reduce the cost of test and
increase production output and quality
through existing test equipment and
programs. Pintail has created the first test
improvement solutions to combine real-time,
on-line, adaptive test with powerful
Web-based database applications.
For additional information, contact:
Taylor Scanlon
(T) 972-464-5919
(E) taylor.scanlon@pintail.com
(W) www.pintailtechnologies.com
Quik-Pak, a division of Delphon
Industries, has recently expanded its
offerings to meet the ever-changing needs
of the semiconductor and electronics
industry. Traditionally, Quik-Pak has
been known as a leader in IC prototype
packaging services. The company has now
expanded those services to include more
advanced IC assembly options, including
flip chip, radiation detector array
processing and laser micromachining.
Quik-Pak also provides wafer preparation
services, including backgrinding, dicing
and bumping. These added services
address customers' needs for a full
turnkey solution that supports wafer-level
processing, the latest packaging
technologies and advanced assembly
services. The new offerings, coupled with
Quik-Pak's current services, will enable
companies to better meet the demands of
its customers and facilitate faster time-to-market
for new products.
For additional information, contact:
(T) 858-674-4676
(E) moreinfo@icproto.com
(W) www.icproto.com
RoodMicrotec is the first independent test
house in Europe to offer fully automated
monitored burn-in service. The process
can handle high-volume burn-in as
well as safe launch activities. In-site
measurements during the burn-in stress
phase allow for fast turnaround times and
build an early warning system, particularly
during the ramp-up of new products. Safe
launch has been replacing volume burn-in
100 percent. The ramp-up management
runs highly demanding tests on a limited
number of devices (e.g., 100,000 devices),
and further cost-intensive production
burn-in can be waived.
For additional information, contact:
Thorsten Bucksch
(T) 49-9081-804 ext. 130
(E) thorsten.bucksch@rood.de
(W) www.roodmicrotec.com
Scanimetrics' Wireless Test Access Port
(WiTAP™) non-contact test technology
will increase chip productivity by up
to 30 percent by reducing the size of
customers' chips, improving product
yield and reducing yield ramp-up time.
This is achieved by replacing test-only
input/output (I/O) cells with WiTAP™
cells which are much smaller and can be
placed anywhere within the core of the
chip. WiTAP™ cells can also be integrated
into standard I/O cells, eliminating yield
loss due to probe damage. In addition,
WiTAP™ decreases time-to-market by
reducing chip validation time as a result
of enabling increased test coverage.
For additional information, contact:
Adeline Chiu
(T) 780-433-9441 ext. 306
(E) achiu@scanimetrics.com
(W) www.scanimetrics.com
STATS ChipPAC has expanded capacity for
full turnkey wafer-level packaging in its
Singapore operation. STATS ChipPAC's
wafer-level packaging solutions include
a wide range of technologies for wafer
repassivation, redistribution and intuitive
power designer (IPD) layers combined
with the electronic industry's preferred
lead-free Sn-Ag-Cu (SAC) alloys in
both fine- and large-pitch applications.
Additionally, a complete turnkey process
flow is available with flexible back-end
assembly capability, supporting high-volume
wafer sort, automatic optical
inspection and back-end processing of
bare die into tape and reel or waffle pack.
For additional information, contact:
Lisa Lavin
(T) 208-867-9859
(E) lisa.lavin@statschippac.com
(W) www.statschippac.com
Verigy, a premier semiconductor test
company, announced that ISE Labs, the
largest semiconductor test engineering
service provider in the Silicon Valley,
has expanded its test capabilities with
the addition of Verigy's V93000 high-speed
memory (HSM) system. ISE Labs
is the first test house in Silicon Valley to
offer a high-speed memory test system
for characterization of DDR3 and quad
data rate (QDR) memory devices up
to 3.6Gbps and above. These devices
are typically found in consumer and
commercial applications such as high-performance
servers and gaming PCs.
The Verigy V93000 provides a scalable
platform architecture for testing systems-on-chip (SOCs), systems-in-package
(SIPs) and high-speed memory devices.
The V93000 HSM Series is installed at
memory manufacturers, design houses
and validation labs worldwide. The
scalability and flexibility of the V93000
HSM platform allows it to fulfill the
industry's most demanding performance
and cost challenges for engineering and
design characterization as well as for high-volume
production of high-speed memory
devices, which are used in tomorrow's
memory-hungry computer and consumer
electronics applications.
For additional information, contact:
(T) 408-864-2900
(W) www.verigy.com
