The Future of Embedded Flash
Lee Cleveland, Vice President, Engineering, Kilopass
A Flexible, Field-programmable ROM Replacement
Jim Lipman, Director, Marketing, Sidense
Todd Humes, Vice President, Product Engineering, Sidense
How to Choose the Right DRAM for an Application
Pat Lasserre, Director, Strategic Marketing, Integrated Silicon Solution Inc. (ISSI)
3D IC Architecture and Business Model for High-density Memories
Sang-Yun Lee, Chief Executive Officer, BeSang Inc.
Dieter K. Schroder, Professor, Electrical Engineering, Arizona State University
Identifying Optimal Non-volatile Semiconductor Memory for Use in RAID Systems
Barry Hoberman, Business Development, Crocus Technology
Steve Cliadakis, Business Development, Crocus Technology & Silicon Impact
High-performance, Non-volatile Memories: And the Winner is…
Douglas Mitchell, Vice President, Sales and Marketing, Everspin Technologies
Overcoming DRAM Scaling Challenges: Floating-body Memory Technologies, a
Leading Contender for High-density and Embedded Memory Applications
Dr. Pierre C. Fazan, Chairman and Chief Technology Officer, Innovative Silicon S.A.
An End-to-end Yield Optimization Solution
Dr. Yervant Zorian, Vice President and Chief Scientist, Virage Logic Corporation
15th Annual GSA Awards Dinner Celebration
Alisa Curry, Event Management Specialist, GSA
Part 4 of 4: You Twit Face!
Protecting your IP in the World of YouTube, Twitter and Facebook: A Practical
Protection Guide for the IP Owner
Jason R. Fulmer, Associate, Intellectual Property, Gardere Wynne Sewell
Kay Lyn Schwartz, Partner, Intellectual Property, Gardere Wynne Sewell
