AccelerATE Solutions is a multi-platform
test engineering service provider located
in San Jose, California. The company's
mission is to leverage its extensive
experience and contacts within the
semiconductor test arena to expedite its
customers' time-to-market. AccelerATE
provides the following services to reduce
production costs: test pattern conversion,
test interface development, test program
development, device characterization,
failure analysis (if required), test program
optimization, sample production,
deployment to volume manufacturing,
and test program conversion.
For additional information, contact:
Tom Nulsen
(T) 408-573-6066
(E) info@acceler-ate.com
(W) www.acceler-ate.com
Advantest's T2000 system-on-chip
(SOC) test platform offers the industry's
highest levels of multi-site and parallel
testing capabilities, speeding time-to-volume
economics for SOCs, including
graphics processors, radio frequency (RF)
SOC, cellular RF and digital baseband,
power management and audio/video
(A/V) devices.
Silicon Valley's fabless companies now
have a gateway to volume production
at STATS ChipPAC's facilities in Asia.
The T2000 SOC architecture features
a loadboard user space more than five
times larger than competing alternatives
and the industry's most advanced control
architecture for the fastest test times,
both at today's multi-site levels and for
future expanded site counts. The T2000
offers superior integration of high-channel
density analog, direct current
(DC) and RF instrumentation and the
lowest cost digital instruments from
50Mbps through 6Gbps.
For additional information, contact:
Greg Self
(T) 408-988-7700
(E) g.self@advantest.com
(W) www.advantest.com
Amkor Technology has had copper
wire bonding qualified with customers
since 2007 and in production since
2008. With the steep rise in gold prices
over the last year, customer conversion
to copper wire has accelerated across
Amkor's broad wirebond portfolio.
Copper wirebond production ranges
from Amkor's low-wire density small
outline (SO) family through high-wire
density plastic ball grid array (PBGA)
packages. With years of experience and
high-volume data covering multiple
factories, wafer nodes and package types,
Amkor helps customers even in high-reliability
applications take advantage of
the cost benefits copper wire provides.
For additional information, contact:
Lee Smith
(T) 480-821-2408 ext. 5381
(E) lsmit@amkor.com
(W) www.amkor.com
Evans Analytical Group's (EAG) release-to-production (RTP) team provides
engineering service and support from
chip tapeout to volume production. The
company's services include automatic
test equipment (ATE) test hardware
and software development, reliability
qualification, electrostatic discharge
(ESD) and latch-up, printed circuit
board (PCB) design, circuit edit/debug,
yield enhancement, failure analysis,
electron microscopy, and equipment
calibration and repair services.
EAG's newly added ion mill cross-section
capability enables the company
to quickly and cleanly create large-area
cross sections on a range of materials
to aid in development and failure
analysis efforts at the package or die
level, including the characterization of
through-silicon vias (TSVs), solder balls
and bumps.
For additional information, contact:
Aram Sarkissian
(E) aram@eaglabs.com
(W) www.eaglabs.com
LTX-Credence, a provider of innovative
semiconductor ATE solutions,
announced a new multi-channel, VI
instrument for the ASL test system.
The XVI greatly enhances multi-site
capability for the ASL 1000 and ASL
3000 test systems with 14 channels
per board. The XVI provides
extended power ranges,
enhanced source and measure
accuracy, and per-pin digitizer
capability. All of these features
will provide users with up
to 40 percent faster test
times compared to existing
ASL VI instrumentation.
The XVI can be purchased
as an upgrade for the over
3,000 ASL testers in the
field. Multiple domestic and
Asian-based customers have
purchased the XVI and are
already using it in volume
production applications.
For additional information, contact:
(T) 408-635-4300
(W) www.ltx-credence.com
MVTS Technologies
is a global full-service
provider of refurbished ATE to the
semiconductor industry. MVTS extends
the life of legacy ATE by providing
access to "out of production" used
equipment, spare parts and services.
With an extensive inventory and a wide
range of products, MVTS positions
itself as the ATE capacity partner to its
customers.
MVTS now exclusively owns the
rights to a selection of legacy Credence
product lines and is offering used
Credence legacy testers, refurbished and
configured to customers' specifications
with an extended warranty. MVTS also
offers used and refurbished LTX and
Teradyne test equipment, spare parts
and turnkey services as well as Verigy test application services.
For additional information, contact:
Ross Martindale
(E) rmartindale@mvts.com
(W) www.mvts.com
Presto Engineering, an ISO 9001
company, provides comprehensive
semiconductor test and analysis solutions
to integrated device manufacturer
(IDM) and fabless companies, helping
to improve the speed and predictability
of new product releases. Presto combines
unique technical expertise, extensive
industry experience and state-of-the-art
ATE, reliability, failure analysis and fault
isolation capabilities to offer a complete
product engineering solution designed to
complement the internal resources of its
customers.
Presto recently received a $2 million
investment from Masseran Gestion
in France and acquired certain capital
assets of NXP Semiconductor. As of
February, Presto opened a second product
engineering services and testing hub
in Caen, France and has established a
subsidiary, Presto Engineering EUROPE.
For additional information, contact:
Rich Curtin
(T) 408-434-1808 ext. 303
(E) richard.curtin@presto-eng.com
(W) www.presto-eng.com
Quik-Pak provides IC packaging,
advanced assembly and prototype services
for fabless semiconductor companies,
enabling faster time-to-market for new
devices within a matter of an hour or a
few days. Companies should make Quik-
Pak a standard part of their package
development and design verification
process. The company's open cavity
plastic packages (OCPP) offer an array
of endless possibilities with no minimum
quantity required. When customers need
a turn-key solution, Quik-Pak can do
it all, from wafer dicing and backgrind,
package procurement, custom BGAs and
preparation to die attach, wirebonding
(gold (Au), aluminum (Al) or copper
(Cu)), flip-chip, encapsulation, molding
and marking to deliver production-quality
prototype parts for internal
testing when time is critical. Quik-Pak
is a division of Delphon Industries. Visit
www.delphon.com to learn more.
For additional information, contact:
Julie Adams
(T) 858-521-3617
(E) jadams@icproto.com
(W) www.icproto.com
Scanimetrics will be introducing a
design kit to use its Wireless Test Access
Port (WiTAP™) non-contact test points,
available through their Web site. The kit
will allow designers to access internal
test nodes for design verification and
debug and to verify Scanimetrics' non-contact
test technology and chip-to-chip
communications for 3D packaging.
WiTAP™ enables cost savings by
increasing productivity and revenue. The
technology enables shrinking of input/output (I/O) pitch and die size while also
offering increased access to internal or
"hidden" test points in 3D packages. This
allows designers to debug at a lower cost
and more thoroughly, and to test earlier
in the process, faster than with contact-based
systems and more extensively for
the same cost. Also, with proper design
consideration, WiTAP™ can be used as
an interconnect to replace TSVs for 3D
packaging.
For additional information, contact:
Chris Sellathamby
(T) 780-433-9441 ext. 603
(E) csellathamby@scanimetrics.com
(W) www.scanimetrics.com
STATS ChipPAC has ramped first-generation
embedded wafer-level ball grid
array (eWLB) technology to high-volume
production. The eWLB technology
provides solutions for semiconductor
devices requiring a higher integration level
and a greater number of external contacts.
STATS ChipPAC has established a
robust, automated eWLB manufacturing
process that includes wafer reconstitution,
wafer-level molding, redistribution
using thin-film technology, solder ball
mount, package singulation and testing.
Incoming wafers in both 8-inch and 12-inch diameters can be supported, and
no bumping is required as the package is
essentially built on top of a reconstituted
wafer. Typical applications for eWLB are
baseband and RF products for mobile and
consumer products.
For additional information, contact:
Lisa Lavin
(T) 208-867-9859
(E) lisa.lavin@statschippac.com
(W) www.statschippac.com
Teradyne introduced a new member of its
Magnum family of memory test solutions,
the Magnum 2x™. Capable of testing over
1,280 devices in parallel, the Magnum
2x delivers an unprecedented level of
efficiency and low cost for probe and
package test. While designed for massive
parallel test applications, the Magnum
2x achieves speeds up to 800Mb/s for
full performance testing of memory
and logic devices. Teradyne has shipped
multiple Magnum 2x test systems to
major customers in the Pacific Rim. Based
on the successful Magnum 2 architecture,
the 2x continues the Teradyne legacy as
the leader in low-cost, high-throughput
testing with twice the pin count. Magnum
2x delivers the required flexibility allowing
customers to choose the configuration
that best fits their needs today and in the
future. System configurations start with
one chassis offering up to 1,280 pins; two
chassis with up to 2,560 pins; four chassis
with up to 5,120 pins; and eight chassis
with up to 10,240 pins—each with the
same small footprint as Magnum 2.
Additionally, test engineers can run their
existing Magnum 2 test programs on the
2x, resulting in significant savings of time,
resources and test costs.
For additional information, contact:
(T) 978-370-2700
(W) www.teradyne.com
Verigy, a premier semiconductor test
company, won EDN magazine's 2009
Hot 100 Product Award for its software
toolset comprising the Triage Fault
Locator™ and YieldVision™ analysis and
visualization tools, which work together
to form the company's yield learning
solution. Verigy is the only test equipment
manufacturer to win in the software
category. The yield learning solution
facilitates design for manufacturability
(DFM) by providing the accuracy
necessary in product development
labs as well as the high throughput
necessary for volume production. These
performance characteristics are critical
for both launching new products and
ongoing manufacturing monitoring.
Bridging design and test to enhance
yield management, Verigy's Triage and
YieldVision software tools capture
failure data and perform yield analysis.
This enables design-centric analysis and
visualization on Verigy's V93000 SOC
test platform by integrating on-tester,
real-time capture and analysis of electrical
failures on complex SOC devices.
For additional information, contact:
(T) 408-864-2900
(W) www.verigy.com
