Advantest's memory automatic test equipment (ATE) market leadership
is exemplified by its T5503 high-throughput memory test system which
delivers the industry's highest parallel test capability of up to 256 devices. Fabless
and integrated device manufacturing (IDM) customers worldwide have
adopted the T5503 to address the challenges of high-volume production
test for next-generation high-speed double data rate, third generation-synchronous
dynamic random access memory (DDR3-SDRAM). The system
enables package test of up to 256 DDR3-SDRAM devices simultaneously,
delivering significant test cost reductions in high-volume production lines.
Furthermore, its maximum test speed of 3.2 Gbps makes it an ideal solution
for high-volume production testing of performance DRAM devices.
For additional information, contact:
Greg Self
(T) 408-988-7700
(E) g.self@advantest.com
(W) www.advantest.com
Amkor Technology had great participation at the 60th Electronic
Components and Technology Conference (ECTC) held June 1-4, 2010
in Las Vegas, Nevada. Amkor's long-standing participation in this preeminent
component and packaging technology conference reached a new level under
the leadership of David McCann, senior vice president of Amkor's ball grid array
(BGA) products, who was the conference program chair this year. In addition to
exhibiting in the technology corner, Amkor had nine speakers this year
who discussed technologies including solder joint reliability and behavior of
lead-free versus tin-lead alloys; mobile processor packaging; advanced flip
chip (FC) for 40nm devices; warpage simulation methods for package-on-package
(PoP); electrical characterization of fan-out wafer-level packaging (WLP); and
copper wire bonding for fine-pitch 65nm devices.
For additional information, contact:
Lee Smith
(T) 480-821-2408 ext. 5381
(E) lee.smith@amkor.com
(W) www.amkor.com
DA-Integrated offers a comprehensive suite of expertise and services spanning
the complete IC development cycle, from design specification to volume
manufacturing. DA-Integrated has four business units that each target a specific
service offering and form a complete fabless semiconductor value chain when
combined. They are DA-Design, DA-Test, DA-Operations and DA-Supply.
DA-Integrated's latest service offering, microelectromechanical system
(MEMS) test solutions, are delivered using a combination of traditional IC
test equipment and an intelligent handler board called the DA-MEMS carrier. The
DA-MEMS carrier holds up to 200 devices and features onboard device
configuration, test execution and test data storage capability. MEMS devices
are tested on the DA-MEMS carrier while being exposed to environment
stimulus. When testing is complete, the DA-MEMS carrier interfaces with
an IC tester for test data collection and analysis. By leveraging traditional IC
test equipment, this innovative approach offers lower development cost, higher
tester capacity, scalability and lower per unit test cost.
For additional information, contact:
Stephen Crowe
(T) 613-592-2233 ext. 237
(E) scrowe@da-integrated.com
(W) www.da-integrated.com
Evans Analytical Group's (EAG) release-to-production (RTP) team provides
engineering service and support from early chip design to volume production
in the areas of test program development and product engineering; test time rental
on all major ATE platforms; reliability and environmental qualification;
electrostatic discharge (ESD) and latch-up testing; printed circuit board
(PCB) layout and hardware design; failure analysis; focused ion beam
(FIB) circuit edit and debug; electron microscopy (transmission electron
microscopy (TEM), scanning electron microscopy (SEM), dual-beam FIB/SEM); and equipment calibration and
repair services. Coupled with 30 years of experience in materials characterization and surface analysis, EAG
offers the broadest range of solutions of any commercial lab network.
EAG offers its customers a highly customizable and flexible service model. The company believes that each
customer's needs require the right combination of resources, and outsourcing cannot take a one-size-fits-all approach. Many of EAG's fabless customers rely heavily on EAG's integrated model to
support their product flow from conception to volume production, requiring full engineering support across
multiple disciplines and services. EAG's larger fabless and IDM customers are utilizing this model to
support specific projects as a compliment to their own resources. With the breadth
of engineering expertise and services and continued commitment to investment in
technology, EAG is the partner to keep.
For additional information, contact:
Aram Sarkissian
(E) aram@eaglabs.com
(W) www.eaglabs.com
LTX-Credence, a global provider of focused, cost-optimized ATE solutions,
announced that u-blox, a leading fabless semiconductor provider of embedded
positioning and wireless communication solutions for the consumer, industrial
and automotive markets, has selected the X-Series as their next-generation radio
frequency (RF) test platform. u-blox is committed to the X-Series as its principal
engineering and production test platform for all their wireless communication
solutions including RF and baseband devices. Several devices have been
released to volume production at u-blox's subcontract test partners in Asia.
For additional information, contact:
(T) 408-635-4300
(W) www.ltx-credence.com
MASER Engineering joined the Dutch Advanced Packaging Center initiative.
This new facility offers advanced package design engineering, prototype
and small series manufacturing. The focus for new designs is on MEMS and
system-in-package (SiP) products. The facility's advanced film assisted molding
capabilities open new solutions for package designs with a direct human
interface. MASER Engineering joined the Advanced Packaging Center to
support their customers with full Joint Electron Devices Engineering Council
(JEDEC)/Q100 qualification programs and analysis. In addition, the facility
also strengthens the company's assembly service of first silicon in standard outline
prototype packages. A standard outline package list is available upon request.
For additional information, contact:
Kees Revenberg
(T) 31-53-480-26-81
(E) kees.revenberg@maser.nl
(W) www.maser.nl
Presto Engineering, a pioneer of the lab-less business model for bringing
semiconductor products into volume production, and CEA-Leti announced
that they have begun a three-year collaboration to develop test and analysis
capability for three-dimensional (3-D) semiconductor devices. The project, a
common lab that will include Presto's new research and development (R&D) center
at CEA-Leti, will focus on extending the company's test, reliability and failure
analysis solutions to through-silicon vias (TSVs), the interconnects between
levels on 3-D devices. The common lab will make the ATE and debug process as
well as the product engineering platform available for third parties.
For additional information, contact:
(T) 408-434-1808
(E) info@presto-eng.com
(W) www.presto-eng.com
Siliconware Precision Industries (SPIL) entered into an equipment purchase
agreement with ChipMOS Technologies (ChipMOS Taiwan) to sell its DRAM
testers and liquid crystal display (LCD) driver assembly and test operation lines
for approximately NT$1.63 billion.
SPIL is a leading provider of
comprehensive semiconductor assembly and test services. SPIL is dedicated to meeting all
of its customers' IC packaging and testing requirements, with turnkey solutions
that range from design consultations, modeling and simulations, wafer bumping,
wafer probe and sort, package assembly, final test, burn-in to drop ship. Products
include advanced leadframe and substrate packages, which are widely used in PCs,
communications, Internet appliances, cellular phones, digital cameras, cable
modems, personal digital assistants and LCD monitors. SPIL supplies services and
support to fabless design houses, IDMs and wafer foundries globally.
For additional information, contact:
(T) 886-4-2534-1525
(E) info@spil.com.tw
(W) www.spil.com.tw
STATS ChipPAC is the first company in the industry to introduce 300mm
embedded wafer-level ball grid array (eWLB) wafer manufacturing capabilities.
STATS ChipPAC is firmly established as the leader in eWLB manufacturing
volume, capacity and yields, with current quarterly shipments in excess of 30,000
reconstituted wafers and is on track to achieve yields of 99 percent and above
by the end of 2010. By adding capacity through 300mm wafer manufacturing,
STATS ChipPAC's customers can benefit from the cost and productivity advantages
of eWLB technology on the larger 300mm reconstituted wafer format, which
provides higher efficiency and economies of scale as compared to the existing
200mm eWLB wafer format. eWLB technology has already been proven and
adopted by many major mobile handset manufacturers to meet the relentless
market demand for complex and power-efficient semiconductor devices within a
continuously shrinking package footprint.
For additional information, contact:
Lisa Lavin
(T) 208-867-9859
(E) lisa.lavin@statschippac.com
(W) www.statschippac.com
Teradyne introduced the GRADE-X Open Test eXchange (OTX) Editor,
an authoring environment for the emerging International Organization
for Standardization (ISO) 13209 OTX standard, at the CTI conference in
Stuttgart, Germany. Built on the widely used GRADE-X diagnostics platform,
the GRADE-X OTX Editor enables users to create, edit and test diagnostic
sequences that can be reused across design, manufacturing and service groups
and thereby help automotive companies improve diagnostic effectiveness and
reduce costs.
The GRADE-X OTX Editor is a powerful graphical authoring
environment that stores data in the native OTX format (a dialect of Extensible
Markup Language (XML)). The new tool offers automatic layout for OTX
documents from any source and allows for specification and implementation views
while providing protection from schema changes. It can be used as a stand-alone
tool to create and modify tests or be integrated into complete toolsets, such
as the GRADE-X Diagnostic Toolset. Teradyne has shipped multiple platforms
to automotive customers in Europe.
For additional information, contact:
(T) 978-370-2700
(W) www.teradyne.com
Verigy, a premier semiconductor test company, has shipped multiple V93000
Port Scale RF systems to a repeat customer for testing RF system-on-chip (SOC)
semiconductors used in ultra low-cost wireless communication handsets. The
global market for ultra low-cost handsets is an estimated 1.6 billion people, mostly
in emerging countries such as China and India, who have not yet purchased cellular
handsets. Demand is expected to double in size to over 200 million units per year
between 2009 and 2013, according to market research firm iSuppli.
Verigy's V93000 Port Scale RF system can test up to 48 ports with true quad-site
and high multi-site parallel efficiency at a minimal cost of test. Its cost-effective
applications range from high-throughput testing of low-integration RF transceivers
up to advanced devices containing integrated RF mixed-signal, digital, power
management and embedded or stacked memory.
For additional information, contact:
(T) 408-864-2900
(W) www.verigy.com
