austriamicrosystems released its new analog/mixed-signal high-performance process design
kit (PDK) for its 0.18μm high-voltage CMOS technology H18, jointly developed with IBM.
The new HIT-Kit v3.77 significantly improves time-to-market (TTM) for highly competitive
products in the analog-intensive, high-voltage, mixed-signal and system-on-chip (SOC) arena.
Supporting designers in creating their first-time- right complex mixed-signal designs, this
comprehensive design kit with its highly accurate simulation models and flexible pcells provides a
proven route to silicon.
The new HIT-Kit v3.77 supports the 0.18μm high-voltage CMOS process H18. It includes
high-density, silicon-qualified digital and analog library elements; complete sets of low-voltage
devices (1.8V and 5.0V); and high-voltage devices with various gate oxide thicknesses and
breakdown voltages (20V and 50V devices). Fully characterized simulation models for a large set of
simulators, extraction and verification run sets, and automatic layout device generators complete
the H18 HIT-Kit offering. Hence, product developers are enabled with a plug-and-play
toolset which facilitates first-time-right designs.
For additional information, contact:
Ron Vogel
(T) 408-345-1790
(E) ronald.vogel@austriamicrosystems.com
(W) www.austriamicrosystems.com
Fujitsu Microelectronics is offering application-specific IC (ASIC) services based on the
company's high-performance analog-to-digital converter (ADC) design. In addition to the set
of four ADCs, the ASIC platform also supports up to 50 million gates of logic, memory blocks
and high-speed serial lanes. Each ADC is capable of sampling incoming signals at 56 giga samples
per second (Gsps) and is user-selectable at one-half or one-quarter of the full speed sampling
rates. The serial TX lanes can stream out data at 11.2 gigabits per second (Gbps) off-chip to
either custom SOCs or field-programmable gate arrays (FPGAs) for further processing.
Target applications are next-generation optical networks, high-speed data acquisition
equipment, and test and measurement systems. Demonstration modules are available from
Fujitsu today.
For additional information, contact:
David Fung
(E) dfung@fma.fujitsu.com
(W) www.fujitsumicro.com
LFoundry and Tesat-Spacecom announced their collaboration in the field of advanced mixed-signal
CMOS technology for space applications. One of the world's leading global suppliers of
telecommunications sub-systems and equipment for satellites, Tesat-Spacecom will utilize the
excellent manufacturing and technology capability of LFoundry for exploring its next
generation of products for spacecom applications. The radio frequency (RF) characteristics of up to
85 GHz of LFoundry's 0.15μm process is well suited for Tesat's active RF products working at
frequencies between 1.5 GHz and 60 GHz. The recently released high-voltage options through
the laterally diffused metal-oxide semiconductor (LDMOS) technology is another benefit where
LFoundry can support Tesat-Spacecom product designs.
For additional information, contact:
(T) 49-871-6840606
(E) sales@lfoundry.com
(W) www.lfoundry.com
MagnaChip Semiconductor, a leading Asia-based designer and manufacturer of analog and
mixed-signal semiconductor products for high-volume consumer applications, announced
that it now offers high value-added 0.18μm embedded electrically erasable programmable
read-only memory (EEPROM) technology to meet the specialized application needs of
foundry customers. MagnaChip has combined cost and device performance by providing a
very competitive 0.18μm EEPROM cell size (0.99μm²). MagnaChip's EEPROM process also
achieves superior reliability characteristics, with over 30 years of data retention after 300,000 precycles
and endurance of over 300,000 cycles.
For additional information, contact:
Chankeun Park
(T) 82-2-6903-3195
(E) chankeun.park@magnachip.com
(W) www.magnachip.com
Samsung Electronics' foundry business is dedicated to supporting fabless companies and
integrated device manufacturers (IDMs) by offering full-service solutions, which encompass
design kits and proven intellectual property (IP) to full turnkey manufacturers, to achieve
market success with advanced IC designs through foundry, ASIC and customer-owned
tooling (COT) engagement. Samsung Foundry focuses on leading-edge process technology
from 90nm and below, and is currently in mass production at 45nm. Samsung Foundry is also
preparing next-generation 32nm, 28nm and beyond process technologies by leveraging its
deep expertise in advanced process technologies and design technologies. As well, the company
has a long, proven track record in high-volume manufacturing, with continued participation in
the IBM Joint Development Alliance (JDA).
For additional information, contact:
(E) foundry@samsung.com
(W) www.samsung.com/foundry
SilTerra Malaysia is rolling out a logic-based embedded non-volatile memory (NVM)
solution that will target the growing market of intelligent power management, consumer
and low-power radio frequency identification (RFID) tags. The technology, which is based on
Virage Logic's NVM IP that is capable of 10K to 100K write and erase cycles on a 0.18μm
logic process without additional mask adder, delivers enormous benefits of cost optimization
and TTM advantage to IC designers. The technology is currently in the final qualification
phase and will be in production in Q3 2010.
For additional information, contact:
(T) 60-4-403-3888
(E) info@silterra.com
(W) www.silterra.com
At its 2010 Technology Symposium in April, Taiwan Semiconductor Manufacturing
(TSMC) announced that it will skip the 22nm manufacturing process node and move directly
to 20nm technology. The 20nm node is expected to offer twice the computational performance
(frequency x density) of 28nm, but at a constant power leakage. TSMC analysis shows that 20nm
wafers will match the cost of 22nm, while creating a cost-per-die advantage. The 20nm
node will provide a superior density-to-cost ratio that will make it more economically attractive
to advanced technology designers. In addition to economics, the technical rational behind the
move is based on the effect of double patterning design methodologies required at these advanced
technology nodes.
TSMC expects to enter 20nm risk production in Q3 2012. The first 20nm process
will be a general-purpose (G) technology designed for performance-hungry applications
such as graphic processors. The process will be based on a planar transistor.
TSMC is the world's largest dedicated semiconductor foundry, providing the
industry's leading process technology and the foundry's largest portfolio of process-proven
libraries, IP, design tools and reference flows. The company's total managed capacity in 2009
exceeded 10 million 8-inch equivalent wafers, including capacity from two advanced 12-inch
GigaFabs, four 8-inch fabs, one 6-inch fab, as well as TSMC's wholly-owned subsidiaries
WaferTech and TSMC China, and its joint venture fab Systems on Silicon Manufacturing
(SSMC). TSMC is the first foundry to provide 40nm production capabilities. Its corporate
headquarters are in Hsinchu, Taiwan.
For additional information, contact:
Ferda Mehmet
(T) 415-308-7877
(E) ferda.mehmet@edelman.com
(W) www.tsmc.com
TELEFUNKEN Semiconductors' foundry business offers world-class foundry services
for RF, power management, high-voltage and high-temperature automotive applications with
advanced, broad-ranging, niche and reliable technologies. Large and small customers across
the world are served with IP-protected and sophisticated customization as well as standard,
highly cost-effective solutions. At the end of 2010, Telefunken's wafer fab will have a capacity
of 150,000 wafers (6-inch) per year, and a fully qualified 8-inch line is on its roadmap
for 2012. The company offers complete modelling, characterization, computer-aided
design (CAD) and wafer-level reliability (WLR) services. A strong team of over 100 highly
qualified, experienced and capable engineers with tremendous engineering know-how and
expertise is a major resource for customers.
For additional information, contact:
Natalie Gutsch
(T) 49-7131-67-2168
(E) natalie.gutsch@telefunkensemi.com
(W) www.telefunkensemi.com
TowerJazz expanded global capacity based on customer momentum and further increased
production in both its Israeli and U.S. manufacturing facilities.
The foundry was named 2009 Supplier of the Year by Skyworks Solutions and awarded
Best Supplier for External Foundry for the second year in a row. The company also received
an Outstanding Achievement in Energy Efficiency Award from Southern California Edison.
TowerJazz announced an agreement with the IC Design Education Center (IDEC) in
Korea to give Korean universities access to a broad range of technologies. The agreement
underscores TowerJazz's highly appreciated technology leadership and growing customer
momentum in Korea.
The foundry also rolled out its full library of patented Y-Flash NVM blocks at Asia-Pacific
Economic Cooperation (APEC) 2010 and joined the Interoperable PDK Libraries (IPL)
Alliance to achieve interoperability of PDKs for analog/mixed-signal designs.
TowerJazz announced customer engagement with Soitec to offer backside illumination
platforms for high-end image sensors, and with VectraWave for its first 40G circuit designed
using a SiGe BiCMOS process.
For additional information, contact:
Melinda Jarrell
(T) 949-435-8181
(E) melinda.jarrell@towerjazz.com
(W) www.towerjazz.com
United Microelectronics (UMC) introduced its 0.13μm high-voltage eHV130 process platform,
which features the foundry industry's smallest 0.13μm static random access memory (SRAM)
bit cell of less than 1.5um2. The smaller bit cell of the eHV130 process enables customers
to realize chip performance that is comparable or better than other high-voltage processes
currently being offered within the industry, while also maximizing chips per wafer and cost
competitiveness. The eHV130 process platform is targeted at higher resolution panel drivers
such as wide video graphics array (WVGA) (864x480), quarter high-definition (QHD)
(960x540) and other display applications that require high voltage. Several customers are
already qualified and in production using the process, with robust manufacturing support
coming from UMC's 8-inch fabs.
For additional information, contact:
(T) 886-3-578-2258
(E) sales@umc-usa.com
(W) www.umc.com
X-FAB Silicon Foundries, the leading analog/mixed-signal foundry and expert in "More than
Moore" technologies, became the first and only pure-play foundry to offer an embedded non-volatile
random access memory (NVRAM) process feature, leading to a single-chip solution.
Combining the benefits of quickly accessible static random accesss memory (SRAM) with
the non-volatile data retention of EEPROM or Flash memories, the new NVRAM capability of
the XH018 process and supporting NVRAM compiler enable customers to achieve the same
or better functionality in significantly less chip area, and to save time and effort as they design
and test.
The new compiler allows designers to create cost-effective, ready-to-use NVRAM blocks
according to their specifications, and try out various memory configurations before finalizing
their design. The new XH018 embedded NVRAM IP is an ideal design feature for fast,
safe non-volatile data storage in applications that require dynamic data storage, data availability
when the supply voltage is powered down and data protection in case of sudden power loss.
Typical applications include industrial control and automotive applications, data transfer
systems, redundant array of independent disks (RAID) data storage and security data handling.
For additional information, contact:
(T) 49-361-427-6000
(E) info@xfab.com
(W) www.xfab.com
