Actel (NASDAQ: ACTL) will combine the power and flexibility of its SmartFusion intelligent mixed-signal field-programmable gate arrays (FPGAs) with Trinamic's industry-leading driver ICs for stepper motors and brushless direct current (BLDC) motors. Small motors are used in applications ranging from printers and appliances to advanced medical diagnostic equipment.

Advanced Micro Devices (AMD) (NYSE: AMD) announced a remote graphics option for information technology (IT) managers seeking to replace existing desktop workstations with energy-efficient thin-client solutions. The ATI FirePro RG220 graphics card delivers a wide-ranging compute experience from the datacenter without compromise, and is designed to help IT managers reduce local power and cooling costs per user while limiting the amount of physical hardware at users' desks.

Analogix Semiconductor launched an updated DisplayPort transmitter and receiver pair, supporting the Video Electronics Standards Association (VESA) DisplayPort 1.2 5.4 Gbit/s high-bit-rate 2 features. Compared with DisplayPort 1.1a, DisplayPort 1.2 supports higher bandwidth, greater color depths and improved electromagnetic interference (EMI) performance with lower cost. Analogix is also shipping in volume its ANX7150, a zero-power High-Definition Multimedia Interface (HDMI) transmitter utilizing breakthrough CoolHDT technology to capture power that is normally wasted on a HDMI link. ANX7150 targets portable multimedia devices such as MP4 players, mobile phones, digital cameras and digital camcorders.

Brite Semiconductor, HiSilicon Technologies and Open-Silicon completed a 65nm wireless network system-on-chip (SOC) design with a TSMC foundry process. The SOC achieved first-pass silicon success and taped out within a short schedule requirement (four months from physical design start to tapeout) to meet business conditions.

Broadcom (NASDAQ: BRCM) released highly integrated whole-home connected cable platforms that address European requirements for Web-based software applications, connectivity, energy efficiency and security support. These cable platforms enable the deployment of a whole-home connected, energy-efficient and secure entertainment experience.

CamSemi opened a new application design center and business development office in Shenzhen, China that will be instrumental in growing the company's customer base and sales of its highly cost-efficient off-line power management ICs within China. The new offices in the Shenzhen Academy of Aerospace Technology—within one of the city's most important electronics districts—will allow the company's engineering team to work even more closely with an increasing number of customers and distributors on major designs.

CHiL Semiconductor announced a breakthrough in high-efficiency computing voltage regulator (VR) solutions for central processing unit (CPU), graphics processing unit (GPU) and double data rate (DDR) applications. Now configured to optimize efficiency from the lowest idle state to the highest operating state of today's high-performance server, graphics and desktop solutions, CHiL's next-generation true-digital power algorithms have increased efficiency up to 15 percent, especially at low loads.

Dialog Semiconductor (FWB: DLG) signed a licensing agreement to use NXP's ultra low-power embedded digital audio signal processor (DASP) technology, CoolFlux DSP, and accompanying firmware, including NXP Software's LifeVibes voice speech enhancement engine. The move by Dialog is the next step in a strategic initiative to develop and deliver market-leading standalone and integrated power management and audio ICs with highly differentiated feature sets.

Binatone has chosen DSP Group's (NASDAQ: DSPG) XpandR chipset for its multimedia cordless home phone powered by Android. The Motorola phone will be available in the U.S. in Q3 2010. DSP Group's XpandR chipset, the world's only SOC solution supporting both Wi-Fi and Digital Enhanced Cordless Telecommunications (DECT) 6.0, powers cordless communications and a full spectrum of multimedia applications for the home phone.

Panyu Cable deployed Entropic Communications' (NASDAQ: ENTR) Broadband Access Ethernet-over-Coax (EoC) solution. The EoC solution delivers high-performance, scalable "last kilometer" connectivity, bringing video-on-demand and data access applications to thousands of Panyu Cable subscribers living in multiple dwelling units (MDUs) throughout southern China.

Exar (NASDAQ: EXAR) released its next-generation, single-chip RS-232/RS-485/RS-422 serial transceiver, the SP336. In addition to supporting industry interface standards, the device has 1/8 unit load capability (up to 256 transceivers on the serial communication bus), full- or half-duplex configuration capability, and diagnostic loop-back function.

In January 2010, Fresco Microchip announced that they shipped over one million receivers for the global hybrid television market. Just two months later, Fresco has already shipped over five million units. The company's TV tuner technology offers unprecedented picture quality and lower system costs, delivering value through innovation. Fresco's shipments have increased five-fold, and they anticipate growth to continue with confirmed March shipments exceeding three million units. Seven of the top nine tuner manufacturers, who account for nearly 70 percent of all tuners sold today, are in production or designing products with Fresco inside.

Gennum (TSX: GND) announced a new generation of video optical module products optimized to provide maximum value and performance in intra-studio and networking applications. Gennum's third-generation (3G) offering builds upon its performance-leading portfolio of video optical module products that enable broadcast and network equipment manufacturers to easily add optical serial digital interfaces (SDIs) to their equipment.

GigOptix (OTCBB: GGOX) announced its Sunset Rescue Program, a service that provides replacements for obsolete application-specific ICs (ASICs) and FPGAs utilizing a proven methodology owned by GigOptix through its acquisition of ChipX in November 2009. The Sunset Rescue Program's proven, low-risk methodology insures that the replacement ASIC is a drop-in replacement and will meet the original component specifications and operate reliably in the customer's system regardless of the original component's process and geometry.

Holtek (TSE: 6202) unveiled a new addition to its range of remote control microcontroller (MCU) series devices, the HT48RA0-5. With an internal program memory capacity of 1Kx14 and data memory capacity of 32 bytes, the 17 input/output (I/O) lines of the device can drive and scan keypads up to 72 keys.

AVM, Germany's leading manufacturer of broadband network equipment, selected Ikanos Communications' (NASDAQ: IKAN) Fusiv Vx180 communications processor for integration into its most advanced family of multimedia home gateways.

Infineon Technologies AG (FSE: IFX) is the world's foremost supplier of chips for automotive electronics, according to the most recent study published by Strategy Analytics. The U.S.-based market researcher reports that Infineon captured a 9 percent share of the global market with sales totaling $1.3 billion in 2009.

Integrated Device Technology (IDT) (NASDAQ: IDTI) surpassed one million shipments of its PanelPort devices. The IDT PanelPort family of DisplayPort-compatible receivers and timing controllers (TCONs) for flat-panel displays offers original equipment manufacturers (OEMs) increased digital signal integrity by significantly reducing EMI on monitor or display device interfaces by utilizing IDT spread spectrum clocking technology.

Avnet Electronics Marketing Americas and Jennic signed a distribution agreement under which Avnet will distribute Jennic's complete line of wireless MCUs, Federal Communications Commission (FCC)-approved modules and development kits throughout the Americas.

LSI (NYSE: LSI) released its portfolio of asymmetric multi-core silicon solutions and software for use in enterprise and

datacenter networking applications. The portfolio allows networking OEMs to use LSI advanced communications, media, content and security and link communication processors to build enterprise networks that deliver increased levels of intelligence, control and security.

Marvell (NASDAQ: MRVL) introduced a new Gigabit Ethernet switch platform designed for small- and medium-sized enterprises (SME) and businesses (SMB). Based on the Marvell Prestera family of packet processors and Marvell Alaska family of gigabit transceivers, the Prestera 98DX3130 Ethernet switch and Alaska 88E1545 Gigabit Ethernet transceiver ICs are designed to make gigabit-level performance more affordable by driving down network Ethernet switch power consumption as much as 70 percent while significantly reducing systems cost.

Mindspeed Technologies' (NASDAQ: MSPD) Comcerto 100 Series broadband gateway packet processor has enabled Teldat to develop an advanced residential gateway for fiber-to-the-home (FTTH) networks. The iRouter gateway delivers triple-play services to and throughout the home while simultaneously supporting remotely managed, value-added applications from carriers and third-party providers.

MoSys (NASDAQ: MOSY) acquired MagnaLynxm, a developer of high-speed, low-power serial chip-to-chip communications technology. The acquisition is expected to add innovative, low-power serializer/deserializer (SerDes) intellectual property (IP), technology and expertise to the expanding MoSys family of product offerings; expand MoSys' serial chip-to-chip communications technology and expertise; and strengthen MoSys' SerDes capabilities by adding another very experienced, high-caliber analog and mixed-signal development team.

NetLogic Microsystems (NASDAQ: NETL) and TSMC announced an extension of their long-standing collaboration to include TSMC's NEXSYS 28nm high-performance semiconductor process node for NetLogic Microsystems' next-generation knowledge-based processors, multicore processors and 10/40/100 Gigabit Ethernet physical layer (PHY) solutions.

ON Semiconductor (NASDAQ: ONNN) expanded its worldwide network of solutions engineering centers (SECs) with the opening of a new SEC facility in China. Located within the company's existing Shanghai campus, the new SEC will drive new automotive product initiatives and expand the company's local service capabilities by providing on-site technical expertise.

Plessey Semiconductors plans to release a number of innovative semiconductor products, including a range of amplifiers, demodulators, synthesisers and high-speed pre-scalers. These products have been designed primarily for the defense and space markets, but are also used in the general communications, automotive and industrial control market segments. The types of end products that will use these components include television systems, fibre optic communications, closed-circuit (CC) TV and data communication systems.

PMC-Sierra (NASDAQ: PMCS) introduced a complete reference design for its HyPHY chipset that supports standards-based transport of Ethernet-based services over the optical transport network (OTN). ITU-T G.709 version 3 (10/2009) specifies direct mapping of Gigabit Ethernet to the OTN layer by defining a new container for the smallest optical data unit (ODU), ODU0 (1.238 Gbit/s), ensuring complete timing transparency and bandwidth efficiency of Ethernet-based client signals.

Qualcomm's (NASDAQ: QCOM) ecosystem of independent software vendors (ISVs) around the company's Gobi 3G/fourth-generation (4G) connectivity platform is continuing to expand. More than 100 ISVs are now developing a wide variety of software for the enterprise, including applications that deliver enhanced data protection and security for Gobi-equipped notebooks, real-time cost control for employees' data usage, location-based services and more.

RF Micro Devices (NASDAQ: RFMD) released the industry's first 1.2 GHz broadband transmission products, enabling enhanced, bandwidth-driven services for cable TV operators and their subscribers. The new products provide options for cable operators to upgrade their network infrastructure to 1.2 GHz, enhancing their network performance and providing bandwidth for growing broadcast and narrowcast services such as HDTV and emerging three-dimensional (3-D) HDTV.

Ridgetop Group signed a distribution agreement with U.K.-based EADS Test Engineering Services that extends sales and technology support for Ridgetop's electronic prognostic products and technology solutions throughout the U.K. and Europe.

Samsung Electronics (KSE: 005930) introduced its latest heat dissipation packaging technology solution for display driver ICs (DDIs) in high-end TV applications. Samsung's new ultra low-temperature chip-on-film (u-LTCOF) packaging solution enhances heat dissipation in high-performance, high-resolution TVs by minimizing the contact thermal resistance between the DDI package and the display panel chassis.

SiGe Semiconductor has shipped 500 million units since it began shipping radio frequency (RF) power amplifiers (PAs) and front-ends in 2003. The company pioneers the evolution of RF solutions, which it manufactures primarily using silicon germanium BiCMOS technologies using a fabless operations model.

Teradici released the Teradici PCoIP Management Console, a tool that enables administrators to manage an entire enterprise deployment of PC-over-IP devices from a single screen.

Trident Microsystems' (NASDAQ: TRID) cable set-top box (STB) chipset, the CX24482, is the industry's first solution to offer universal Digital Transport Adapter (uDTA) support, which is required in Comcast's next-generation digital transport adapters.

VIA Technologies (TSE: 2388) announced the VIA Nano E-Series processor, bringing native 64 bit software support, virtualization capabilities and extended longevity support to embedded markets. Forthcoming operating systems such as Windows Embedded Standard 7 will be able to leverage a 64 bit software ecosystem that provides up to double the amount of data a CPU can process per clock cycle. This translates into greater ease in manipulating large data sets and an overall performance boost compared to non-native x64 architectures.

Vitesse Semiconductor (OTC: VTSS.PK) introduced the second generation of its award-winning EcoEthernet technology, with power-saving features exceeding the IEEE's 802.3az energy-efficient Ethernet standards. EcoEthernet 2.0 delivers the industry's richest energy-efficient feature set and minimizes power in the network by optimizing performance for all link speeds.

Wolfson Microelectronics (LSE: WLF) will introduce a new family of digital silicon microelectromechanical systems (MEMS) microphones. Already in demand by many of the world's leading consumer electronics manufacturers, Wolfson's digital MEMS microphones combine low-power consumption, excellent audio capture, superior signal-to-noise (SNR) ratio, enhanced sensitivity tolerance and a miniature low-profile package, making them ideal for portable applications, including mobile phones, portable computers, portable media players, digital still cameras and portable navigation devices.

Xilinx (NASDAQ: XLNX) introduced the architecture for a new extensible processing platform that will deliver unrivaled levels of system performance, flexibility and integration to developers of a wide variety of embedded systems. The ARM Cortex-A9 MPCore processor-based platform enables system architects and embedded software developers to apply a combination of serial and parallel processing to address the challenging system requirements presented by the global demand for embedded systems to perform increasingly complex functions.

Internet-connected HD flat-panel televisions using Zoran's (NASDAQ: ZRAN) SupraHD 675 HDTV processors started shipping to Europe and Australia this quarter. Additional SupraHD 675 HDTV platforms optimized for Brazil, China and Japan will be available next quarter for qualified manufacturers developing Internet-connected HD digital television products for these high-growth regional markets as connected televisions enter mainstream consumer retail channels.