Actel's (NASDAQ: ACTL) radiation-tolerant RTAX digital signal processor (DSP) field-programmable gate arrays (FPGAs) have completed qualification in accordance with the military and aerospace industry standard MILSTD-883 Class B specification. This qualification expands Actel's support of high-speed signal processing applications for space payloads and exemplifies its ongoing innovation and commitment to serve designers of spaceflight systems.

Advanced Analogic Technologies (NASDAQ: AATI) introduced the AAT282X active matrix thin-film transistor (TFT) liquid crystal display (LCD) direct current/direct current (DC/DC) converter family which includes a white light-emitting diode (WLED) driver and VCOM buffer to enable the delivery of a fully integrated power solution for portable backlit displays. Key target applications include automotive displays, digital photo frames, netbooks, e-readers and handheld global positioning system (GPS) navigation devices.

Altera (NASDAQ: ALTR) enhanced its Arria II GX FPGA variant with 6.375 Gbps transceivers and up to 1.25 Gbps low-voltage differential signaling (LVDS) support, while broadening the reach of the family with the addition of the new Arria II GZ FPGA variant. As a result, the 40 nm Arria II family provides the lowest power 6 Gbps transceiver solutions shipping today, featuring up to 50 percent lower static power over competitive devices.

The newest member of the Broadcom (NASDAQ: BRCM) Intensi-fi product family revolutionizes how users can experience multimedia content in their homes. The BCM4331 Wi-Fi solution achieves 450 Mbps data rates in client devices and over 600 Mbps throughput (Transmission Control Protocol/Internet Protocol (TCP/IP)) in 3x3 access point (AP)/router configurations.

Skelmir has ported their CEE-J virtual machine (VM) to Cavium Networks' (NASDAQ: CAVM) ECONA CNS3XXX processors for the support of Open Services Gateway Initiative (OSGi) and other Java applications. The ECONA CNS3XXX family of ARM-based energy-efficient processors offers single and dual ARM11 MPCore processors, a rich set of integrated hardware accelerators and a range of inputs/outputs (I/Os) for glueless voice, video and data connectivity.

CHiL Semiconductor announced a breakthrough in high-efficiency computing voltage regulator (VR) solutions for central processing unit (CPU), graphics processing unit (GPU) and double data rate (DDR) applications. Now configured to optimize efficiency from the lowest idle state to the highest operating state of today's high-performance server, graphics and desktop solutions, CHiL's next-generation true-digital power algorithms have increased efficiency up to 15 percent, especially at low loads.

Cortina Systems introduced CS4340, the industry's smallest quad 10 GB electronic dispersion compensation (EDC) device. The Cortina CS4340 is a programmable four-port small form-factor pluggable physical layer (SFP + PHY) with integrated EDC and is available in a small 15 mm x 15 mm ball grid array (BGA) package that optimizes system design options.

Fujitsu Limited selected Cypress Semiconductor's (NASDAQ: CY) TrueTouch solution to implement the touchscreen in the world's first separable handset from NTT DOCOMO, the DOCOMO PRIME series F-04B mobile phone. The new phone leverages Cypress' CY8CTMG200 controller to power the robust multi-touch interface with a slim 9.8 mm form factor that can operate separately from the keyboard.

Dialog Semiconductor (FWB: DLG) signed a licensing agreement to use NXP's ultra low-power embedded digital audio signal processor technology, CoolFlux DSP, and accompanying firmware, including NXP Software's LifeVibes voice speech enhancement engine. The move by Dialog is the next step in a strategic initiative to develop and deliver market-leading standalone and integrated power management and audio ICs with highly differentiated feature sets. Integration of the NXP DSP allows multiple audio decoding algorithms to be supported, including the facilitation of advanced speech processing algorithms.

Discera announced the official opening of its China Applications Center in the Shenzhen International Chamber of Commerce Tower on Fuhua 3rd Road, Futian District. As the heart of the company's permanent investment plan in China, the new office features engineers, equipment and researchers to support sophisticated chip and module integration, high-definition (HD) and 3-D video technology, and radio frequency (RF) and smart grid design.

To enhance the growth of the universal docking station market, ASUS has chosen to integrate DisplayLink's Universal Serial Bus (USB) virtual graphics processor, the DL-165, into the ASUS USB universal docking station.

Exar (NASDAQ: EXAR) introduced the DX 1700 series of Peripheral Component Interconnect (PCI) Express-based cards for the emerging unified storage and network infrastructure. The DX 1700 series is comprised of four cards and offers customers the industry's most power-efficient encryption and compression solutions addressing the small office/home office (SOHO) to enterprise markets.

Fresco Microchip was recently recognized as the fastest growing fabless semiconductor company in the industry. In June, Fresco announced that it has ramped from initial production to more than 15 million chips for the hybrid television market in less than three quarters. Eight of the top 10 TV tuner manufacturers are now in production or have active designs using Fresco inside, including LG Innotek, Panasonic Electronic Devices, NuTune and most recently Sanyo Tuner. According to industry experts, the company will be a top supplier of hybrid television receivers in Europe this year.

Gennum (TSX: GND) announced that its serial digital interface (SDI) solutions have been selected by Panasonic for use in industry-leading professional quality 3-D video equipment. With 3-D TV growth outpacing that of HDTV, demand for 3-D programming and content is on the rise.

NETGEAR selected Gigle Networks' GGL301 HomePlug AV/Institute of Electrical and Electronics Engineers (IEEE) 1901 solution with Xtendnet intelligent switching technology to give its XAV101V2 powerline adapters best-in-class network coverage and reliability in the home.

GigOptix (OTCBB: GGOX) made additional shipments of its LX8900, a 100 GB thin-film polymer-on-silicon (TFPS) modulator, to a number of customers including SA Photonics, an engineering company focused on photonics-based solutions for military applications.

Icera announced that its Livanto chipset and adaptive wireless technology is at the heart of Vodafone's latest mobile broadband USB stick, the Vodafone K3805-Z. Offering a high-speed mobile broadband connection with theoretical peak downlink rates of up to 14.4 Mbps High-Speed Packet Access (HSPA) in optimal conditions, the Vodafone K3805-Z is the world's first USB modem to incorporate Icera's IceClear interference-aware technology.

Digital China Holdings Limited will distribute Impinj's Speedway family of radio frequency identification (RFID) reader and antenna products throughout China. The new relationship ensures that Chinese RFID solution providers now have easy access to the world's leading ultra-high frequency (UHF) Gen 2 technology for a wide variety of applications and markets.

Infineon Technologies AG (FSE: IFX) introduced an enhanced family of three wireless control receivers offering the highest available sensitivity and low-power consumption. The TDA5240, TDA5235 and TDA5225 devices provide multi-band support for worldwide coverage and are well-suited for use in various automotive applications, including remote keyless entry (RKE) systems, tire pressure monitoring systems (TPMS), remote start, control, status and alarm functions.

Innovasic Semiconductor unveiled its new RapID Platform connectivity solution for EtherNet/IP adapters. Innovasic's RapID Platform provides quick and easy EtherNet/IP connectivity, and engineers can download the entire platform free of charge for evaluation. A one-time license fee applies only if the platform is used in production.

International Rectifier (NYSE: IRF) introduced a family of hexagonal field-effect transistor (HEXFET) power metal-oxide semiconductor field-effect transistors (MOSFETs) featuring ultra-low on-state resistance (RDS(on)) in an industry-standard small-outline transistor (SOT)-23 package for applications including battery charge and discharge switches, system and load switches, light load motor drives and telecom equipment. Utilizing IR's latest mid-voltage silicon technology, the new SOT-23 MOSFET devices deliver a strong improvement in current handling by minimizing Rds(on) by as much as 90 percent to offer customers optimized performance and price for a given application.

AdaptivEnergy partnered with Jennic to offer alternative energy solutions for active RFID tag applications that can offset associated costs and risks inherent with battery-powered devices. Jennic's asset tracking platform uses IEEE802.15.4 technology to provide a robust active RFID solution with low-power requirements, allowing for tags with extended battery life or tags powered solely by harvested energy.

LSI (NYSE: LSI) and Seagate announced the delivery of a complex integrated read channel technology for Seagate's latest hard disk drive (HDD) products. Together, the companies have enabled the industry's first HDDs with low-density parity check (LDPC) read channel in 65 nm process system-on-chip (SoC) technology.

MediaTek (TSE: 2454) joined the Open Handset Alliance. Sharing the same commitment and vision for richer mobile living, the Open Handset Alliance is a partnership of more than 71 global mobile industry leaders aimed to accelerate innovation and offer consumers a richer and connected mobile experience.

Mellanox Technologies' (NASDAQ: MLNX) ConnectX-2 InfiniBand adapters and IS5000 InfiniBand switches have demonstrated world-record Message Passing Interface (MPI) performance for node-to-node communications. Recent cluster benchmarking performed at Mellanox's performance optimizations lab highlights Mellanox InfiniBand's achievement of nearly 90 million messages per second for MPI message rate for node-to-node communications, more than three times better than other comparable InfiniBand solutions.

Microsemi (NASDAQ: MSCC) unveiled a compact, cost-effective four-port power-over-Ethernet (PoE) midspan designed to power a wide range of network devices in low-density applications. Microsemi's new PowerDsine PD-3504G midspan is fully compliant with IEEE 802.3af specifications to safely power wireless local area network (WLAN) APs, IP security cameras, voice over IP phones, access control systems and other devices over existing standard Ethernet cabling.

Nanoradio launched NRX600/605, the Eco-Fi family of products. Nanoradio is now able to significantly strengthen its customers' products and further enrich the user experiences of embedded consumer electronics powered by the new solution. The product family, which is supporting 802.11 b/g/n standards, gives outstanding power and area savings, unwiring new economically and ecologically innovative customer products.

Nordic Semiconductor ASA (OSE: NOD) released nRFready R/C Racing, a complete reference design for advanced remote controlled racing toys that enables toy manufacturers to bring previously impossible game-play features to mass-market toys by using Nordic's low-cost 2.4 GHz wireless solutions.

Octasic announced the industry's most efficient multi-core DSP device for basestation PHY and Media Access Control (MAC), the OCT2224W. Delivering three times more power efficiency than any other DSP on the market today, the OCT2224W device provides the best performance-to-power ratio in the industry.

ParkerVision (NASDAQ: PRKR) entered into an agreement with its confidential baseband partner to supply RF chipsets that incorporate ParkerVision's d2p technology. The chipsets will be used with baseband processors sold to a leading mobile handset original equipment manufacturer (OEM) who is a significant customer of ParkerVision's baseband partner.

PMC-Sierra (NASDAQ: PMCS) announced the SRCv family of 6 Gbps Serial Attached Small Computer System Interface (SCSI) Redundant Array of Independent Disks (RAID)-on-chip (RoC) controllers, including the industry's first 24-port RoC, which enables the highest levels of server performance and connectivity, along with an eight-port RoC targeted at the volume x86 server market.

Qualcomm (NASDAQ: QCOM) and Medical Platform Asia signed a formal agreement to provide medical devices with integrated 3G wireless modules for people in need of health services. The project is being implemented through Qualcomm's Wireless Reach initiative and will allow 300 remote local residents to send critical health information to doctors through a 3G wireless network. Information such a resident's blood pressure, weight and distance walked can be easily and immediately shared with participating physicians.

RF Micro Devices (NASDAQ: RFMD) announced the RF5616, a highly integrated 4.9 GHz to 5.8 GHz (industrial, scientific and medical (ISM) band) 3 mm x 3 mm power amplifier designed to significantly reduce customers' total solution size and cost. The RF5616 is targeted for high-performance mobile PC and embedded applications including APs, gateways, digital subscriber line (DSL) routers, Wireless High-Definition Interface (WHDI) and WLAN for wireless video distribution networks.

Sigma Designs (NASDAQ: SIGM) announced the first low-cost Microsoft Mediaroom-compatible set-top box (STB) platform based on Sigma's SMP8652 media processor SoC. SMP8652-based STB designs have completed integration with Mediaroom client software and are anticipated to begin deployment with leading carriers in 2H 2010.

Samsung Electronics is leveraging one of Skyworks Solutions' (NASDAQ: SWKS) power amplifier modules for the GT-B3710, a high-speed 4G USB modem that is the world's first Long-Term Evolution (LTE)-commercialized device. Small and efficient, the SKY77706 LTE power amplifier (PA) module is designed for multiple handset and data card applications, and allows consumers to enjoy the benefits of high-speed data services such as advanced Web TV broadcasting, online gaming and Web conferencing.

Toshiba America Electronic Components (TSE: 6502) and its parent company Toshiba launched a 128 GB embedded NAND Flash memory module, the highest capacity yet achieved in the industry. The module is fully compliant with the latest embedded-MultiMediaCard (e-MMC) standard, and is designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and digital video cameras.

Ubicom introduced its IP8100 family of network processors. The processors are targeted towards next-generation solutions for consumer, SOHO and small/medium business (SMB) applications for both retail and service provider deployments.

VIA Technologies (TSE: 2388) released device development kits for the VIA AMOS-5000 series, facilitating a more rational design infrastructure for a broad range of application-specific and fan-less Em-ITX-based devices. VIA AMOS-5000 series development kits combine application-specific VIA EM-I/O expansion modules with specially designed extendable aluminum chassis kits.

WiSpry is working with IBM to develop micro-electromechanical systems (MEMS) process technology and manufacture its tunable RF product roadmap. This development includes WiSpry's current generation of tunable impedance matching products, slated for production with a major Tier-1 OEM this fall, as well as future generations of highly integrated products for the entire mobile terminal front-end.

Xelerated sampled its HX family of network processor units (NPUs), which are now available to system vendors and service providers. Based on Xelerated's unique and deterministic dataflow architecture, the HX family of NPUs can process 100 Gbitps of Ethernet traffic at wirespeed for any packet size.

ChipSiP Technology and Zoran (NASDAQ: ZRAN) collaborated to produce a new slim package solution for the compact digital camera market that includes both multi-memory and an image processor. This new packaging solution helps designers save space on digital camera design boards and shorten the interconnection distance between electric components, significantly improving performance.