Venture Capital

• GSA is updating its annual Investment Directory for distribution to fabless, supplier & IDM semiconductor companies. This directory provides a detailed profile on individual Venture Capital firms and Investment Banks to help semiconductor companies identify the services provided by these firms.

Foundry

• GSA is updating its annual Foundry Resource Guide for distribution to fabless & IDM semiconductor companies. This report provides detailed profiles to help semiconductor companies identify the services provided by the industry's wafer foundries.

Wafer Fabrication & Back-End Pricing

• This survey is intended to create a quarterly benchmark for the fabless and IDM sectors, depicting average wafer, mask set, assembly, test and wafer bump prices by company type, region, etc. The data is collected confidentially and tabulated in aggregate by Grant Thornton LLP using a weighted industry average approach. In exchange for completing the Survey online, you will receive complimentary access to the Wafer Fabrication and Back-End Pricing Reports ($3,000 annual value), analyzing the average wafer, mask set, assembly, test and wafer bump costs for each quarter in which you participate.

GSA Interest Group Survey

• GSA's Interest Groups are driving industry solutions in EDA/Design, IP, Wafer Manufacturing, Packaging and Test. Help us by giving your feedback in these areas.

Outsourcing

• GSA publishes an annual Outsourcing Directory, which is a compilation of detailed corporate profiles of companies that outsource a percentage of their manufacturing operations. Fabless companies and IDMs that outsource are eligible to be profiled in this directory. Don’t miss this free opportunity to have your company listed in the directory, regardless of GSA membership. Included in the Fabless and IDM Surveys.

Semiconductor End Markets

• It is well known that the semiconductor industry changes rapidly; therefore, GSA surveys its database of companies regularly to ensure all information is updated and correct. This year, we are sending an abbreviated survey to capture your company’s detailed end market information. By completing the survey, it will guarantee your company is listed correctly in our database, which, in turn, will help us serve you better.

2010 GSA Memory Conference Report

• “Bridging Memory and Logic ICs for Better System Performance”
  

  The GSA Memory Conference, held in Taipei on March 16, 2010, ended with great success. The 2010 GSA Memory Conference Report records the key perspectives and insights from the distinguished speakers and the companies they represented at this conference. It also brings together impartial views and comments from the Industrial Economics and Knowledge Center (IEK), the industrial research arm of the Industrial Technology Research Institute (ITRI), a long-term associate to GSA.

Energy Harvesting for Self Powered Wearable Health Monitoring System

• LOGIN
  Qadeer A Khan, Sarvesh J Bang
  Oregon State University

  PDF, 422 KB

Equity Research: Chip/Computer/Cellphone Data March 2009 -- Weak End Markets, Clean Supply Chain

• David Wong, CFA, PhD, Senior Analyst Amit Chanda, Associate Analyst Brian Cutlip, Associate Analyst
  Wachovia

  PDF, 1.79 MB

Medical Applications Guide

• LOGIN
  Texas Instruments

  Contains information on: -Consumer and Portable Medical -Diagnostic. Patient Monitoring and Therapy -Medical Imaging -Medical Instruments -Connectivity Solutions for Medical -Resources

  PDF, 7.22 MB

Global Semiconductor Funding, IPO and M&A Update

• To provide the industry with timely data on semiconductor investment activity in the private and public sector, GSA releases a monthly two-page update and a downloadable, sort-able Excel spreadsheet of all semiconductor funding, initial public offering (IPO), and merger and acquisition (M&A) activity.

Equity Research: Chip/Computer/Cellphone Data

• David Wong, CFA, PhD, Senior Analyst Amit Chanda, Associate Analyst Brian Cutlip, Associate Analyst
  Wachovia

  Industry report on semiconductors, cell phones and computer hardware.

  PDF, 1.87 MB

Global Semiconductor Financial Tracker

• GSA's quarterly Global Semiconductor Financial Report is a comprehensive report, which includes detailed trend analysis, regional breakdowns, etc. on financial data. This report is complimentary to GSA members. Non-members may purchase it at the GSA Store.

IC Foundry Almanac

• The IC Foundry Almanac puts essential information at your fingertips, including foundry-segment analysis, five-year forecasts, wafer-pricing trends from outsourcing semiconductor suppliers and supplier-profile data. Use the Foundry Almanac to make corporate decisions, support the outsourcing business model in presentations and meetings, and gain a better understanding of the foundry market's status.

Understanding Fabless IC Technology

• Authors: Jeorge S. Hurtarte, Evert A. Wolsheimer, Lisa M. Tafoya

  Understanding Fabless IC Technology focuses on the differences between the IDM and fabless business model and provides the reader with an overview of how to conduct business in the outsourced semiconductor industry environment as well as discusses technical, cultural and global issues. It also discusses key business topics such as negotiating with outside fabrication companies, choosing the right electronic design tools, protection of intellectual property and business plans, and maintaining quality control.

Semiconductor Primer 2008: An Overview Of The Semiconductor Industry

• David Wong, Ph.D., CFA, Senior Analyst Lindsey Matherne, Associate Analyst Brian Cutlip, Associate Analyst Amit Chanda, Associate Analyst
  Wachovia

  PDF, 2 MB

India Semiconductor Market Research Reports

• The India Semiconductor Association (ISA) is the trade body representing the Indian semiconductor driven industry. ISA is committed to building global awareness for the Indian semiconductor-driven industry and supporting its growth through focused activities. ISA has played a prominent role in supporting the Government of India in the Semiconductor Policy.

Consumer Electronics Boom: How Semiconductor and Consumer Electronics Companies can Improve Cost, Time-to-Market and Product Quality

• GSA, CEA and KPMG

  This report explores how semiconductor companies and consumer electronics original equipment manufacturers (OEMs) can better partner to improve time-to-market and product quality. It also provides valuable insight to both CE and IC OEMs in developing new consumer products, where time-to-market, product differentiation, quality and product profitability are tantamount.

Lead-Free Resources

• GSA provides you resources including presentations, reports and links to additional sites with helpful information such as defining RoHS, WEEE, lead facts, and more.

Building a Better Supply Chain: Successful Collaboration in the Fabless Semiconductor Industry

• Industry Directions and GSA

  A collaborative effort between industry analyst firm Industry Directions, Inc. and GSA, the study demonstrates that while fabless companies are adept at operating in the outsourced model and recognize the importance of the supply chain and how it helps drive competitive advantage, there is significant opportunity for improvement.

GSA Semiconductor Market Report: An Essential Data Resource for Outsourcing Companies

• The Semiconductor Market Report, last updated in May 2007, is an essential historical data resource that encompasses the entire fabless ecosystem. There is no single source or publication of this caliber with the more than 550 pages of easy-to-read charts, graphs and written analysis.

To DFM (Design for Manufacture) or not DFM?

• Wes Hansford
  MOSIS

  This article discusses packaging options available for prototyping silicon ICs

  PDF, 1277.091 MB

• Wes Hansford
  MOSIS

  This article discusses whether design for manufacture and optimizing yield should be the most important criteria in designing ICs.

  PDF, 763.586 MB

The Sure Path to 40nm Success

• Virage Logic
  Virage Logic

  PDF, 144 KB

Can MIPI and MDDI Really Co-Exist?

• Ashraf K. Takla, Mixel & Timothy Saxe, QuickLogic

  Since MIPI and MDDI standards both target interfaces to cameras and displays on mobile devices, are two separate standards really needed?

  PDF, 4.55 MB

Current Economic Downturn Monitor

• Throughout the current economic downturn, GSA is providing the industry with the latest data, resources and analysis supporting the GSA Hypothesis. We encourage you to download the articles and presentations for the most comprehensive analysis.

Managing in a Downturn

• KPMG

  PDF, 1.035 MB

The Promises and Pitfalls of Open Mobile Platforms

• Keith Higgins, Vice President of Marketing
  Aricent, Inc.

  This article covers the relative strengths of open source mobile technology, the barriers, and how the entire mobile community needs to adopt a holistic approach to allow the open source mobile revolution to realize its greatest potential.

  PDF, 118 KB

Proposed Clarification of Credit-Derivative Scope Exception

• KPMG

  PDF, 178 KB

EITF Deliberates the Scope of Statement 160

• KPMG

  PDF, 598 KB

Changes in Impairment Accounting for Some Financial Instruments

• KPMG

  PDF, 192 KB

HHNEC Introduction

• HHNEC Marketing
  HHNEC

  THis is the latest version of company introduction that we provided to all our potential customers

  PDF, 4814.515 MB

GSA & IET International Semiconductor Forum
Munich, Germany
June 3, 2009

• Redefining Mobility: Overcoming the Industry's Next Challenge LOGIN
  Steve Mollenkopf, Executive Vice President & President
  QUALCOMM CDMA Technologies

  PDF, 9 MB

• Are ASIC's Really on the Decline? The ASIC Model: Future Directions LOGIN
  Tatsuo Noguchi, Technology Executive, Semiconductor Technology Laboratories
  TOSHIBA Corporation

  The presentation highlighted the ASIC model applicability for CE companies, the future of the ASIC model globally, ASIC model impact on Europe and the role fabless companies play in the chip development process

  PDF

• Portable Device Power Management: Evolution from Discretes to Configurable System Power Management Platform IC’s LOGIN
  Mark Jacob, Director of Marketing, Audio & Power Management Business Unit
  Dialog Semiconductor

  PDF

• IC Design: Rethink Everything for Recovery Readiness! LOGIN
  Dr. Aart de Geus, Chairman & CEO
  Synopsys, Inc.

  Dr. de Geus presents his perspective on what’s driving the current economic and technological realities for companies doing IC design, what looming challenges are waiting just down the road and what solutions will be necessary to equip them to be recovery ready.

  PDF

• Global Economic Outlook LOGIN
  Julian Callow, Chief European Economist
  Barclays Capital

  The presentation highlights global macroeconomic factors that will contribute to eventual worldwide recovery, and it will identify how semiconductor technology can play a large role in overall macroeconomic growth and stability – from energy savings and harvesting, to green environmental technology, to enabling “smart” medical and automotive applications and beyond. This keynote draws a picture of what is required to reach economic stability and how the semiconductor industry can help achieve this.

  PDF

The Semiconductor Review, June 2009 Update

• LOGIN
  Caris & Company

  PDF, 1.62 MB

IP Conference Taiwan
Hsinchu, Taiwan
May 7, 2009

• Strategizing for a healthy IP ecosystem
  Strategies for Managing Development Costs & Risks at Advanced Technology Nodes
  Brani Buric, Executive Vice President
  Virage Logic Corporation

  PDF, 2.002 MB

• Strategizing for a healthy IP ecosystem
  IP Litigation During Economic Hard Times: Are You Ready?
  Paul M. Saraceni, Esq., Chief IP Officer
  RPX Corporation

  PDF, 783 KB

• Strategizing for a healthy IP ecosystem
  Future Prospective of Programmable Logic Non-Volatile Memory
  Charles Hsu, President
  eMemory Technology Inc.

  PDF, 1.016 MB

• Strategizing for a healthy IP ecosystem
  CPU System-Level Optimization For Cost Reduction to Fight Down-turn
  Frankwell Lin, President
  Andes Technology Corporation

  PDF, 1.418 MB

ITAC and GSA Conference
Bromont, Canada
April 15, 2009

• Commercialization of MEMS Technology: Current Trends
  Louis Ross, President and Chief Executive Officer
  Virtus Advanced Sensors

  The crux of my talk will include factors behind the trend to invest in and expediate the commercialization of mass produced MEMS devices, with emphasis on the explosion of growth in regard to consumer electronics applications. Also, I will discuss some of the success stories to be featured in an upcoming book to be published by Wiley this summer which I am acting as a co-editor/author ("The MEMS/NEMS Marketplace; AMN-Series Vol. 9"). This book includes submissions by senior executives from companies like Denso, Sumitomo Precision, ST Micro, from leading academics, and case studies of success stories such as TI's DLP technology.

  PDF, 2.76 MB

• Living Star Trek Technologies: Advanced Microelectronics at Work and Play
  Moderator: Peter Middleton, Principal Analyst
  Gartner, Inc.

  Panel
  Brian Doody, Chief Executive Officer, DALSA Corporation;
  Paul Kempf, Vice President, Silicon, Research In Motion;
  Gerry Remers, President and Chief Operation Officer, Christie Digital Systems Canada, Inc.;
  Robert Tong, Vice President, Medical Products Group, ON Semiconductor
  

  This panel of senior industry executives share their thoughts on the technologies that have the potential to change our lives just like: iPods; cell phones; satellite TV; and virtual communities.

  PDF, 4.926 MB

• Small World Large Impact: A WIN Perspective on the Potential of Nanotechnology
  Dr. Arthur Carty, Executive Director
  Waterloo Institute for Nanotechnology

  The science and engineering of materials, devices and systems with size features in the range of atoms and molecules (0.1-100 nm) has seen spectacular growth, with global funding reaching $US 18.2 B in 2008, up 15% from 07. Using the unique properties of nanoscale materials- high surface atom/bulk atom ratios and the emergence of quantum effects- together with access to new tools and methods for seeing, manipulating and creating new forms of matter and devices, research is accelerating in the areas of: Nanomaterials for energy storage and conversion, OLEDS for flexible, transparent display technologies, Nano-fluidics, MEMS, NEMS, Lab-on-a-chip devices for biodiagnosis, Nanosystems for targeted drug delivery and Quantum nanophotonics. But what applications are likely to impact our day-to-day lives?

  PDF, 6.168 MB

• Semiconductor Industry Will Innovate its Way Out of the Downturn
  Lisa Tafoya, Vice President of Global Research
  Global Semiconductor Alliance

  The semiconductor industry has a rich tradition of managing through dramatic and unforgiving cycles, ranging from years of extraordinary growth, to steep declines. After several unprecedented years of contiguous growth, the industry is now facing a downturn stunning even industry veterans. Semiconductor companies will not go unscathed in this current environment. Start-ups needing additional rounds of funding and do not yet have a product and are not cash-flow positive are the most vulnerable. However, in general, the industry is in a much stronger position to weather this downturn than it was in 2001. The presentation will provide data and analysis supporting the hypothesis that the semiconductor industry will innovate its way out of the downturn, and how great companies will be prepared for next-generation opportunities.

  PDF, 4.35 MB

• Solar Power: Not Free but Affordable & Renewable
  Dr. Johanna Schmidtke, Analyst
  Lux Research

  Solar power promises affordable clean energy, helped by technological innovations and government subsidies. However, it is not yet cost-competitive, and concerns about continued growth have mounted in the difficult economy. Semiconductor manufacturing and design techniques have provided a valuable start, but can they adapt to overcome solar’s financial challenges?

  PDF, 1.471 MB

• IDC Semiconductor Update: Semiconductor Industry Downturn Prolonged by Economic Reality
  Flint Pulskamp, Program Manager Wireless Semiconductors
  IDC

  At what point can we expect to reach the bottom of this current downturn? How does this downturn compare to 1996, 1998 and 2001?

  PDF, 908 KB

Emerging Opportunities Luncheon
Santa Clara Convention Center
April 7, 2009

• Keynote Address:
  Broadband Media’s Impact on the Set Top Box
  Jim Denney, Vice President of Product Marketing
  TiVo, Inc.

  Broadband distribution of content is becoming a larger force in today’s consumer entertainment choices. Mr. Denney will discuss some of the adoption trends as well as the impacts of this proliferation on consumer devices going forward.

  PDF, 1.1 MB

• Keynote Address:
  Smart Phone Evolution, Integration and Semiconductor Opportunities
  Paul Kempf, Vice President, Silicon
  Research In Motion

  The relentless pace of integration that is taking place at the low-end of the cell phone market is now moving to higher tiers with the growth of smart phone popularity. Despite enabling technology, the dream of a single chip phone will remain impractical at the high-end due to diverse functional requirements that depend on power and performance optimization to provide a positive user experience. Appropriate application of technology and efficient system architecture will play a significant role in the delivery of successful products. This talk will explore semiconductor opportunities in this challenging high-growth environment.

  PDF, 950 KB

CSIA's IC China Market 2009
Shanghai, China
February 25, 2009

• Outlook of Global Semiconductor Industry - Challenges During Global Economic Downturn
  Dr. Jeremy Wang, Asia Pacific Executive Director
  Global Semiconductor Alliance

  PDF, 4.065 MB

The Semiconductor Industry Slowdown – What Can We Do About It ?

• LOGIN
  Jayalakshmi Janakiraman, Research Analyst Semiconductors
  Frost & Sullivan

  PDF

GSA Semiconductor Leaders Forum TAIWAN
Ambassador Hotel Hsinchu, Taiwan R.O.C.
November 5, 2008

• Keynote Address
  How Asia is Changing the Analog IC Business LOGIN
  David Bell, President, Chief Executive Officer and Director, Intersil Corporation
  Intersil Corporation

  PDF, 942 KB

• An Increasingly Wireless and Portable World LOGIN
  J.C. Lee, Group President and Chief Executive Officer, UTAC
  UTAC

  PDF, 1.1 MB

• Pico Projector: A New Era of Mobile Projection LOGIN
  Jordan Wu, President and Chief Executive Officer, Himax Technologies, Inc.
  Himax Technologies, Inc.

  PDF, 6.08 MB

CSIA-ICCAD Annual Conference
Beijing, China
October 28, 2008

• Keynote Address
  State of the Semiconductor Industry: Fostering Collaboration, Integration & Innovation LOGIN
  Jodi Shelton, Executive Director, GSA
  GSA

  PDF, 5 MB

GSA Suppliers Expo & Conference
Santa Slara, CA
October 2, 2008

• GSA Annual Briefing LOGIN GSA

  PDF, 1.6 MB

• Global: Markets, Perspectives, Technology
  Cellular Chipset – Connectivity Integration: Holy Grail or Hail Mary? LOGIN
  Joep van Beurden, Chief Executive Officer, CSR
  CSR

  Mr. van Beurden’s keynote presentation represented the C-level global aspect of a company such as CSR that has enjoyed many diverse and successful business models. van Beurden highlighted CSR’s global markets and perspectives and how they impact technical and business markets.

  PDF, 10.31 MB

CASPA/GSA Summer Symposium
Santa Clara, CA
July 19, 2008

• State of Industry and GSA's Role in Fostering Collaboration, Integration & Innovation LOGIN
  Vivian Pangburn, Vice President Global Marketing, GSA
  GSA

  PDF, 1.29 MB

• Regional Perspectives on China LOGIN
  Mark Ding, President, SEMI China
  SEMI China

  PDF, 722 KB

• Panel Discussion
  Consolidation Accelerating, Where Are The Opportunities For Asian Suppliers? LOGIN
  Moderator - Mario Morales, Vice President, Global Semiconductor Research, IDC
  IDC

  PDF, 2.27 MB

IDC Semiconductor Market Update
June 1, 2008

• Consolidation Accelerating: What Will It Mean for Semiconductor Suppliers in Asia? LOGIN
  Mario Morales

  PDF, 3.04 MB

IET & GSA International Semiconductor Forum
London, United Kingdom
May 15, 2008

• Panel Discussion
  Quality Control Best Practice LOGIN
  Moderator: Vincent Tong, Vice President, Worldwide Quality and Reliability Engineering
  Xilinx, Inc.

  PDF, 421 KB

• Keynote
  Heterogeneous Integration in Semiconductor Technology and Business in Asia LOGIN
  Dr. Nicky Lu, Chairman, GSA Asia Pacific Leadership Council; Chairman, President and Chief Executive Officer
  Etron Technology, Inc.

  PDF, 2.25 MB

• Panel Discussion
  Leveraging Markets Outside Europe LOGIN
  Moderator: David Moorhouse, Senior Product Marketing Manager
  Artimi

  PDF, 142 KB

• Panel Discussion
  GPS - What's Your Global Position? LOGIN
  Moderator: Lew Boore, Vice President Marketing
  NemeriX

  PDF

• Keynote
  Let Wireless Lead the Way LOGIN
  Brian Markwalter, Vice President, Technology and Standards
  Consumer Electronics Association (CEA)

  PDF, 1.05 MB

• Mobile TV LOGIN
  Simon Atkinson, Chief Executive Officer
  Mirics Semiconductor

  PDF, 756 KB

• The Next Generation of Intelligent Networks LOGIN
  Syed Ali, President, Chief Executive Officer and Chairman, Cavium Networks
  Cavium Networks

  PDF, 2.79 MB

• Panel Discussion
  Growing a Company and Managing the Cost LOGIN
  Moderator: David Baillie, Chief Executive Officer, CamSemi
  CamSemi

  PDF, 432 KB

• Dynamic Innovation LOGIN
  Gordon Fairley, ASIC and Foundry Marketing Manager, IBM Microelectronics
  IBM Microelectronics

  PDF, 642 KB

• Reflections on an Evolving Industry LOGIN
  Steve Wainwright, General Manager EMEA, Vice President Sales and Marketing, Freescale Semiconductor S.A.
  Freescale Semiconductor S.A.

  PDF, 1.05 MB

• Keynote
  Embracing an Alliance Strategy for the Semiconductor Industry: Ending the Cycle of 'Profitless Prosperity' LOGIN
  Ajit Manocha, Executive Vice President of World Wide Operations, Spansion Inc.
  Spansion Inc.

  PDF, 665 KB

• Keynote
  Collaboration in the Semiconductor Industry LOGIN
  Eric Mayer, Vice President, Production Partner Management
  Infineon Technologies AG

  PDF, 1.48 MB

• Panel Discussion
  Operations in a Virtual World LOGIN
  Moderator: Jack Harding, Chairman, President and Chief Executive Officer, eSilicon Corporation
  eSilicon Corporation

  PDF, 543 KB

ITAC and GSA Conference
Bromont, Canada
April 29, 2008

• Panel Discussion
  Opportunities in Mobile Convergence LOGIN
  Moderator: Jodi Shelton, Executive Director, GSA
  GSA

  PDF, 3 MB

• The Future of 3D Graphics LOGIN
  David Kirk, Chief Scientist
  NVIDIA

  PDF

• The Consumerization of Microelectronics LOGIN
  Brian Markwalter, Vice President, Technology & Standards, Consumer Electronics Association
  Consumer Electronics Association

  PDF, 729 KB

• The Mobile Internet: The Potential of the Handheld to Bring Internet to the Masses LOGIN
  Wilson Kwan, Director of Handheld Systems Architecture, AMD
  AMD

  PDF, 3.05 MB

Israel Executive Forum
Tel Aviv, Israel
April 14, 2008

• Innovation LOGIN
  Dov Moran, Founder, Chief Executive Officer and Chairman, modu Ltd.
  modo Ltd.

  PDF, 8.66 MB

• Winning in Today’s New Semiconductor Landscape LOGIN
  Wim Roelandts, Chairman, Xilinx Inc.
  Xilinx, Inc.

  PDF, 2.69 MB

• State of the Industry and GSA's Role in Fostering Collaboration, Integration & Innovation LOGIN
  Dwight Decker, GSA Chairman of the Board
  GSA

  PDF, 500 KB

• State of the Industry and GSA's Role in Fostering Collaboration, Integration & Innovation LOGIN
  Jodi Shelton, Executive Director, GSA
  GSA

  PDF, 575 KB

• Panel Discussion
  Beyond the Horizon – Industry experts share their vision about the future of the semiconductor industry LOGIN
  Moderator: Shlomo Gradman, Publisher
  TAPEOUT

  PDF, 5.7 MB

SEMICON China 2008
Shanghai, China
March 18, 2008

• Tracking Trends in Wireless LOGIN
  Dr. Sanjay Jha, COO, Qualcomm and President, Qualcomm CDMA Technologies
  Qualcomm CDMA Technologies

  PDF, 2 MB

GSA Panel Discussion for CES
Las Vegas, NV
January 9, 2008

• STUDY: Improving Time-to-Market through Better Alignment with Semiconductor Suppliers LOGIN KPMG LLP

  PDF, 339 KB

• Consumer Electronics Innovation
  Improving Time-to-Market through Better Alignment with Semiconductor Suppliers LOGIN
  Moderator: Ron Steger
  KPMG LLP

  PDF

FSA Semiconductor Leaders Forum
Taipei, Taiwan
November 7, 2007

• Pursuit of the Innovative Edge: A Wireless Semiconductor Perspective LOGIN
  Dr. Craig Barratt, President and Chief Executive Officer, Atheros Communications, Inc.
  Atheros Communications, Inc.

  PDF, 1.26 MB

CFO Roundtable
October 10, 2007

• CFO Roundtable Discussion Point Notes LOGIN

  PDF

• Managing Complexity in Your International Accounting Structure LOGIN
  Christie Simons, Lead Client Service Partner
  Deloitte

  PDF, 186 KB

• Managing Section 404 Costs LOGIN
  Scott Angel, Lead Audit Partner
  Deloitte

  PDF, 176 KB

FSA Suppliers Expo & Conference
Santa Clara, California, US
September 12, 2007

• FSA Annual Briefing LOGIN
  Jodi Shelton, Executive Director, FSA
  FSA

  PDF, 2 MB

• Innovation & Profitablility: Beyond the Chip LOGIN
  Dr. Claudine Simson, EVP, CTO, LSI Coporation
  LSI Corporation

  Dr. Simson addressed how businesses must be both innovative and cost efficient to achieve continued success. She highlighted how companies continue to innovate, the multiple ways that companies evolve to innovate through mergers and acquisitions and diversification of the business and/or consolidation of their businesses.

  PDF, 2 MB

• Panel Discussion: Divination and Wizarding Skills for Consumer Electronics Suppliers LOGIN
  Moderator: Brian Markwalter, Vice President, Technology & Standards, Consumer Electronics Association
  Consumer Electronics Association

  The 2007 Suppliers Expo morning panel discussion focused on how consumer electronics are driving the entire supply chain from consumer to OEM to semiconductor. The panel identified the challenges faced by fabless and OEM companies given the intensity of the consumer electronics market. They also explored how the demands of consumers have a profound effect and impact on all parts of the supply chain.

  PDF, 2.5 MB

• Panel Discussion: Building A Better Supply Chain... Successful Collaboration in an Outsourced Industry LOGIN
  Moderator: Bill Brandel, Principal, Industry Directions Inc.
  Industry Directions Inc.

  The 2007 Suppliers Expo aftrenoon panel highlighted the collaboration between FSA and Industry Directions (IDI) on a study of the impact of outsourced operations in design, manufacturing, logistics and other related operations in the outsourced industry.

  PDF, 185 KB

IET & FSA International Semiconductor Forum
Paris, France
May 15, 2007

• Keynote Address: Winning The Supply Chain Challenges in a Fabless Model LOGIN
  Ron Torten, CEO, NemeriX
  NemeriX

  PDF, 616 KB

• Panel Discussion: Business Opportunities within the Automotive Market LOGIN
  Moderated by: Michael Williams, Research Vice President, Semiconductor (Automotive & Telematics), Gartner Dataquest
  Gartner Dataquest

  PDF, 1.53 MB

• Business Theme: New Technologies/New Markets
  Identifying New Technology and Business Opportunities LOGIN
  Dr. Mika Karilahti, Director New Technology Sourcing NTS, Nokia Corporation
  Nokia Corporation

  PDF, 587 KB

• Business Theme: Supply Chain Management
  Panel Discussion: What Executives Can Do to Improve Time-To-Money LOGIN
  Moderated by: Robert Jelski, Global Sector Head Electronics, Semiconductor & Advanced Technologies, 3i
  3i

  PDF

• Business Theme: Service Provider's View of the Consumer Markets
  Terminal Service Evolution for Consumes Market LOGIN
  Guido Arnone, Director Terminals Technology, Vodafone Group Services GmbH
  Vodafone Group Services GmbH

  PDF, 775 KB

• Keynote Address: Consumer Electronics and the Semiconductor Industry: Perspectives for a Paradigm Shift LOGIN
  John Yu, COO, Chipnuts
  Chipnuts

  PDF, 3.58 MB

• Business Theme: Consumer Market's Impact on Semiconductors
  Are Consumers Driving the Commoditisation of the Semiconductor Industry? LOGIN
  Jerome Ramel, Analyst, Exane BNP Paribas
  Exane BNP Paribas

  PDF, 105 KB

• Consumer Electronics and the Semiconductor Industry LOGIN
  Keri Waters, Director of Strategic Marketing, Micronas
  Micronas

  PDF, 1.08 MB

• Technical Theme: Advanced Node Adoption
  Technology Aware Design LOGIN
  Bart Dierickx, Director of Technology Aware Design Program, IMEC
  IMEC

  PDF, 1.06 MB

• Keynote Address: The Changing Semiconductor Landscape Requires Special Focus on Multi-Company Alliances LOGIN
  Jan Willis, Senior Vice President of Industry Alliances, Cadence Design Systems, Inc.
  Cadence Design Systems, Inc.

  PDF, 13.3 MB

• Business Theme: The Changing Semiconductor Landscape
  IDMs in a Consolidating Industry LOGIN
  Jean-Philippe Dauvin, Group Vice President, Knowlege and Education, STMicroelectronics
  STMicroelectronics

  PDF, 795 KB

• Keynote Address LOGIN
  Wim Roelandts, President, CEO and Chairman, Xilinx, Inc.
  Xilinx, Inc.

  PDF, 27.3 MB

• Smartphones and Beyond: Industry Wide Mega-Issues and Mega-Opportunities in the Post-Convergence World LOGIN
  David Wood, Executive Vice President Research, Symbian
  Symbian

  PDF, 387 KB

FSA Distinguished Speaker Series Luncheon
February 28, 2007

• Evolution of the Fabless IC Business Model LOGIN

  PDF

Supply Chain Issues In The High-Technology Semiconductor Industry

• Sanjiv Chopra
  Oracle Corporation

  Results of the supply chain survey conducted by Oracle & Global Semiconductor Alliance (GSA) Sanjiv Chopra, Oracle Corporation

  PDF

Sofics hebistors:Latch-up Immune on-chip ESD protection for High Voltage processes and applications

• Bart Keppens
  Sofics BVBA

  While High Voltage interfaces are broadly used in many IC applications like motor control, power management and conversion, LCD panel drivers and automotive systems, many IC designers still lack a low leakage, costeffective and latch-up immune ESD protection clamp. This white paper introduces a newly developed protection device and compares it with the traditional approaches, based on measurements on TSMC 0.35um 15V and TSMC 0.25um 40V technology. Within an area of 35.000um², the novel hebistor device with holding voltage above 40V achieves more than 4kV HBM, 200V MM while the leakage and capacitance stay well below typical requirements (<10nA and <250fF). Hebistors form a family of high voltage ESD/EOS/IEC protection clamps which are branded under the Sofics PowerQubic portfolio.

  PDF, 486.959 MB

Increasing Computing Platform Efficiency Through Innovative Memory Architecture

• Inphi Corporation

  PDF, 1.45 MB

The Last Mile: Outsourcing Semiconductor Manufacturing Operations

• LOGIN
  Jim Lindstrom, CFO & Kalar Rajendiran, Senior Director of Marketing
  eSilicon Corporation

  This article will discuss and explain the reasons why semiconductor companies should outsource chip physical design and manufacturing operations.

  PDF

Embedded Non-Volatile Memory Tech and Their Applications

• LOGIN
  Linh Hong, Director, Marketing
  Kilopass

  With complexity of SOCs growing and time to market cycles shortening, designers need to have an arsenal of tricks to deliver highly differentiated products to market quickly. The arsenal may include SystemC, EDA tools to achieve a faster timing closure, and IP from high speed I/Os to memories. The most pervasive memory IPs are SRAM and ROM. Less pervasive memory IPs include non-volatile memory (NVM) technologies such as embedded Flash, electrical fuses, multi-time programmable (MTP) NVM, and one-time programmable (OTP) NVM. Though these embedded NVM technologies are not as main stream as their ROM sibling, they are gaining in popularity due to various added benefits including cost reduction, improved performance, enabling secure storage, and configurability. In this paper you will learn about all the embedded NVM technologies and the applications that benefit most from using embedded NVM.

  PDF, 526 KB

Energy Harvesting for Self Powered Wearable Health Monitoring System

• Qadeer A Khan, Sarvesh J Bang
  Oregon State University

  PDF, 427 KB

New Application Areas Driving Higher Dynamic Range Converters

• Michael Connolly
  Silicon & Software Systems(S3)

  With the advent of higher broadband speeds in the fixed line and wireless systems, the need for higher performing data converters has become apparent. In this article, we discuss the different standards that are pushing this trend and how single tone testing, in some cases, does not accurately determine the performance in communication systems. This is particularly true in systems that employ multi-tone signalling or OFDM (orthogonal frequency division multiplexing), in which the available bandwidth is split into a large number of sub-channels, which then allows data to be transmitted over many sub-carriers, thereby enabling higher data rates.

  PDF, 231.2 MB

Pipeline vs. Sigma Delta ADC for Communications Applications

• Noel O'Riordan
  Silicon & Software Systems(S3)

  The Analog-to-Digital Converter (ADC) is a key component in digital communications receive channels, and the correct choice of ADC is critical for optimizing system design. In this white paper, we discuss what design factors drive the selection of the ADC, how to specify the ADC and when to choose between a Pipeline ADC and a Sigma-Delta (??) ADC.

  PDF, 362.513 MB

GSA Leaders Say Semiconductor Industry Will Innovate Its Way Out of the Current Downturn

• Jodi Shelton, Executive Director
  Global Semiconductor Alliance

  PDF, 941 KB

High-Volume nano FPGA's - Going Where no FPGA Has Gone Before

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  Actel, Inc.

  PDF, 426 KB

Exploiting Core’s Law: Get “More than Moore” productivity from your ASIC and SOC Design Teams

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  Tensilica

  PDF, 705 KB

Strengthening Freedom in Asia: A Twenty-First Century Agenda For the U.S.-Taiwan Partnership

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  The Taiwan Policy Working Group

  The Taiwan Policy Working Group was first convened in January 2007 to discuss the status of U.S.-Taiwan political, military, and economic relations. This is a report covering a broad spectrum of these issues in the U.S.–Taiwan relationship.

  PDF, 109 KB

ASIC Documentation

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  Scott Meltzer

  A white paper about ASIC documentation and controlling costs.

  PDF

The Emergence of Intelligent Operations Management (IOM)

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  Bob Parker

  Manufacturing organizations in the electronics value chain are seeking to harvest value from the information they have and to harmonize processes and utilize the expertise of their trading partners. The information technology required to support these efforts demands a new kind of application with a modern architecture. For value chain management, this will be the IOM platform.

  PDF, 339 KB

Accelerating Console-Quality Games to the Handset

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  Brian Carlson, Strategic Marketing Manager, Wireless Terminals Business Unit
  Texas Instruments

  PDF, 3.29 MB

Overview of Labor Contract Law in China

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  MWE China Law Offices

  PDF, 225 KB

Low Power Design: Approach and Techniques for Power Estimation, Reduction and Verification

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  Michael Carrell, Dave Allen
  Atrenta

  PDF, 378 KB

RoHS Common Pitfalls

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  Bijan Dastmalchi, Symphony Consulting, Inc. and Richard Vermeij, Arena Solutions

  PDF

Offshoring in the Semiconductor Industry: A Historical Perspective

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  Clair Brown and Greg Linden
  UC Berkeley

  PDF, 244 KB

Managing Access Control Through SAS Zoning

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  Heng Liao, Tim Symons and Rachelle Trent
  PMC-Sierra

  PDF, 428 KB

Best Practices in the Fabless Industry

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  PDF, 250 KB

Semiconductor Investments in India

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  Karthik Ramaswarny
  VinChip Systems

  PDF

Addressing Design Challenges at 130-Nanometer and Below: The Silicon Readiness Approach

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  Aurangzeb Khan
  Cadence Design Systems

  PDF

"Glue-ware" Essential for Streamlined SOC Execution at Emerging Fabless IC Companies

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  Kumar Rakesh and Brian Henderson
  Technology Connexions

  PDF, 154 KB

1T-SRAM-Q: Quad-Density Technology Reins in Spiralling Memory Requirements

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  Mark-Eric Jones
  MoSys

  PDF, 223 KB

Is the IDM Model Doomed...

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  Tushar Dhayagude, et al
  Kellogg Graduate School of Management, Northwestern University

  Emergence of the fabless-foundry model in the semiconductor industry.

  PDF, 429 KB

Measuring IC and ASIC Design Productivity

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  Numetrics Management Systems

  PDF, 193 KB

Complimentary Law Consultation

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  Gardere Wynne Sewell LLP

  GSA is pleased to offer you a complimentary resource focused on basic legal questions affecting the semiconductor industry. The law firm Gardere Wynne Sewell LLP, which works with the Board of Directors of GSA, has agreed to provide a free consultation to GSA members in the following areas.

FABLS Stock Index

• GSA reintroduced the FABLS Stock Index (FABLS) (originally created in 1998) and introduced the Mini Fabless Stock Index (mFABLS) to support the organization's hypothesis that fabless stocks are viable for long-term investing – especially during an economic downturn. The FABLS Index includes public fabless companies that meet or exceed a market capitalization criterion of $500 million, and a new Mini FABLS (mFABLS) includes public fabless companies with market capitalization between $100 million and $500 million.

Corporate Governance

• GSA has created a Corporate Governance section to provide tools and ongoing, timely information on a variety of issues including ESO expensing and Corporate Governance.

Semiconductor End Markets

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  GSA offers its online End Markets Tool to members so fabless, IDM and supplier companies, venture capitalists, industry analysts, or anyone else who has an interest, are able to easily and quickly identify market saturation levels – helping to analyze growth potential within the different markets and seeing which companies are competing in what areas.