GSA Member Login | March 17, 2010
Wafer Manufacturing
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Wafer Manufacturing

The ability to design and successfully fabricate smaller, faster, more energy-efficient chips is represents the current drive in the semiconductor industry. Despite all of the phenomenal advances in process technology, the road to advanced nodes still has significant challenging obstacles to address. The Wafer Manufacturing Portal provides the latest information, data and resources related to these challenges of this imperative segment of the semiconductor supply chain. Both pure-play foundries and internal wafer fabrication facilities are facing the following challenges today:

  • The increasing capital needed to build and maintain fabs
  • Reducing time-to-market
  • Providing accurate and complete PDKs
  • Coordinating introductions of libraries, IP blocks and EDA flows with their respective developers and vendors
  • Coordinating test, assembly & packaging technology
  • Developing cost-effective process technologies, suitable also for analog & mixed-signal integration
  • Ramping-up manufacturing capacity and yield quickly
  • Providing high-quality products on schedule
  • Continuing manufacturing of proven processes

GSA is committed to addressing these and other manufacturing issues, plus driving industry solutions to enable the industry to continue innovating and improving the world.

Get Involved/Working Groups

Visit the Manufacturing Perspectives tab of this portal to join the current blog. For more information, please contact Lisa Tafoya, GSA Vice President of Global Research, at 972.866.7579 ext. 116 or via email at ltafoya@gsaglobal.org.

Tools

Surveys     Reports     Articles    Presentations    Whitepapers

Market Intelligence

SURVEYS

Foundry

  • GSA is updating its annual Foundry Resource Guide for distribution to fabless & IDM semiconductor companies. This report provides detailed profiles to help semiconductor companies identify the services provided by the industry's wafer foundries.

Wafer Fabrication & Back-End Pricing

  • This survey is intended to create a quarterly benchmark for the fabless and IDM sectors, depicting average wafer, mask set, assembly, test and wafer bump prices by company type, region, etc. The data is collected confidentially and tabulated in aggregate by Grant Thornton LLP using a weighted industry average approach. In exchange for completing the Survey online, you will receive complimentary access to the Wafer Fabrication and Back-End Pricing Reports ($3,000 annual value), analyzing the average wafer, mask set, assembly, test and wafer bump costs for each quarter in which you participate.

GSA Interest Group Survey

  • GSA's Interest Groups are driving industry solutions in EDA/Design, IP, Wafer Manufacturing, Packaging and Test. Help us by giving your feedback in these areas.

Outsourcing

  • GSA publishes an annual Outsourcing Directory, which is a compilation of detailed corporate profiles of companies that outsource a percentage of their manufacturing operations. Fabless companies and IDMs that outsource are eligible to be profiled in this directory. Don’t miss this free opportunity to have your company listed in the directory, regardless of GSA membership. Included in the Fabless and IDM Surveys.

Semiconductor End Markets

  • It is well known that the semiconductor industry changes rapidly; therefore, GSA surveys its database of companies regularly to ensure all information is updated and correct. This year, we are sending an abbreviated survey to capture your company’s detailed end market information. By completing the survey, it will guarantee your company is listed correctly in our database, which, in turn, will help us serve you better.

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REPORTS

Global Semiconductor Funding, IPO and M&A Update

  • To provide the industry with timely data on semiconductor investment activity in the private and public sector, GSA releases a monthly two-page update and a downloadable, sort-able Excel spreadsheet of all semiconductor funding, initial public offering (IPO), and merger and acquisition (M&A) activity.

Global Semiconductor Financial Tracker

  • GSA's quarterly Global Semiconductor Financial Report is a comprehensive report, which includes detailed trend analysis, regional breakdowns, etc. on financial data. This report is complimentary to GSA members. Non-members may purchase it at the GSA Store.

IC Foundry Almanac

  • The IC Foundry Almanac puts essential information at your fingertips, including foundry-segment analysis, five-year forecasts, wafer-pricing trends from outsourcing semiconductor suppliers and supplier-profile data. Use the Foundry Almanac to make corporate decisions, support the outsourcing business model in presentations and meetings, and gain a better understanding of the foundry market's status.

Wafer Fabrication & Back-End Pricing Report

  • LOGIN
    Grant Thornton

    The Wafer Fabrication Pricing Report is designed to gauge the average prices paid per wafer for fabless semiconductor companies and integrated device manufacturers (IDMs). The data was collected confidentially and tabulated in aggregate by Grant Thornton LLP using a weighted industry average approach.

Understanding Fabless IC Technology

  • Authors: Jeorge S. Hurtarte, Evert A. Wolsheimer, Lisa M. Tafoya

    Understanding Fabless IC Technology focuses on the differences between the IDM and fabless business model and provides the reader with an overview of how to conduct business in the outsourced semiconductor industry environment as well as discusses technical, cultural and global issues. It also discusses key business topics such as negotiating with outside fabrication companies, choosing the right electronic design tools, protection of intellectual property and business plans, and maintaining quality control.

India Semiconductor Market Research Reports

  • The India Semiconductor Association (ISA) is the trade body representing the Indian semiconductor driven industry. ISA is committed to building global awareness for the Indian semiconductor-driven industry and supporting its growth through focused activities. ISA has played a prominent role in supporting the Government of India in the Semiconductor Policy.

Understanding the Needs & Perceptions of SOI Technology: Silicon-on-Insulator Survey Analysis

  • Given the critical low-power and high-performance needs in the semiconductor industry today, Silicon-on-Insulator (SOI) technology may become an enabler to companies attempting to meet these requirements, especially at more advanced nodes. GSA hosted the survey to better understand the needs and perceptions of SOI from users within the industry.

Lead-Free Resources

  • GSA provides you resources including presentations, reports and links to additional sites with helpful information such as defining RoHS, WEEE, lead facts, and more.

Building a Better Supply Chain: Successful Collaboration in the Fabless Semiconductor Industry

  • Industry Directions and GSA

    A collaborative effort between industry analyst firm Industry Directions, Inc. and GSA, the study demonstrates that while fabless companies are adept at operating in the outsourced model and recognize the importance of the supply chain and how it helps drive competitive advantage, there is significant opportunity for improvement.

GSA Semiconductor Market Report: An Essential Data Resource for Outsourcing Companies

  • The Semiconductor Market Report, last updated in May 2007, is an essential historical data resource that encompasses the entire fabless ecosystem. There is no single source or publication of this caliber with the more than 550 pages of easy-to-read charts, graphs and written analysis.

Foundry Process Qualifications Guidelines

  • LOGIN

    The guideline was a joint effort of GSA and the JEDEC. It went through numerous reviews and two formal JEDEC ballots. In 2002, FSA, now GSA, and JEDEC announced the release of the Foundry Process Qualification Guideline, which is used by numerous foundries and fabless companies today.

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ARTICLES

To DFM (Design for Manufacture) or not DFM?

  • Wes Hansford
    MOSIS

    This article discusses whether design for manufacture and optimizing yield should be the most important criteria in designing ICs.

    PDF, 763.586 MB

Can MIPI and MDDI Really Co-Exist?

  • Ashraf K. Takla, Mixel & Timothy Saxe, QuickLogic

    Since MIPI and MDDI standards both target interfaces to cameras and displays on mobile devices, are two separate standards really needed?

    PDF, 4.55 MB

Current Economic Downturn Monitor

  • Throughout the current economic downturn, GSA is providing the industry with the latest data, resources and analysis supporting the GSA Hypothesis. We encourage you to download the articles and presentations for the most comprehensive analysis.

Moving Beyond IEEE 1149.1

  • Steve Scheiber, Contributing Technical Editor
    Test & Measurement World

    PDF, 170 KB

Lithography for dummies (well, us EDA guys)

  • EDN

    PDF

Gain Freedom Through a Value Chain Producer

  • Kalar Rajendiran
    eSilicon Corporation

    PDF, 173.915 MB

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PRESENTATIONS

IP Conference Taiwan
Hsinchu, Taiwan
May 7, 2009

ITAC and GSA Conference
Waterloo, Ontario, CANADA
April 15, 2009

  • Solar Power: Not Free but Affordable & Renewable
    Dr. Johanna Schmidtke, Analyst
    Lux Research

    Solar power promises affordable clean energy, helped by technological innovations and government subsidies. However, it is not yet cost-competitive, and concerns about continued growth have mounted in the difficult economy. Semiconductor manufacturing and design techniques have provided a valuable start, but can they adapt to overcome solar’s financial challenges?

    PDF, 1.471 MB

  • Semiconductor Industry Will Innovate its Way Out of the Downturn
    Lisa Tafoya, Vice President of Global Research
    Global Semiconductor Alliance

    The semiconductor industry has a rich tradition of managing through dramatic and unforgiving cycles, ranging from years of extraordinary growth, to steep declines. After several unprecedented years of contiguous growth, the industry is now facing a downturn stunning even industry veterans. Semiconductor companies will not go unscathed in this current environment. Start-ups needing additional rounds of funding and do not yet have a product and are not cash-flow positive are the most vulnerable. However, in general, the industry is in a much stronger position to weather this downturn than it was in 2001. The presentation will provide data and analysis supporting the hypothesis that the semiconductor industry will innovate its way out of the downturn, and how great companies will be prepared for next-generation opportunities.

    PDF, 4.35 MB

  • Small World Large Impact: A WIN Perspective on the Potential of Nanotechnology
    Dr. Arthur Carty, Executive Director
    Waterloo Institute for Nanotechnology

    The science and engineering of materials, devices and systems with size features in the range of atoms and molecules (0.1-100 nm) has seen spectacular growth, with global funding reaching $US 18.2 B in 2008, up 15% from 07. Using the unique properties of nanoscale materials- high surface atom/bulk atom ratios and the emergence of quantum effects- together with access to new tools and methods for seeing, manipulating and creating new forms of matter and devices, research is accelerating in the areas of: Nanomaterials for energy storage and conversion, OLEDS for flexible, transparent display technologies, Nano-fluidics, MEMS, NEMS, Lab-on-a-chip devices for biodiagnosis, Nanosystems for targeted drug delivery and Quantum nanophotonics. But what applications are likely to impact our day-to-day lives?

    PDF, 6.168 MB

GSA Suppliers Expo & Conference
Santa Slara, CA
October 2, 2008

  • GSA Annual Briefing LOGIN GSA

    PDF, 1.6 MB

IET & GSA International Semiconductor Forum
London, United Kingdom
May 14, 2008

  • Panel Discussion
    Process Choices For Analogue and RF Circuits in Mixed Signal Systems LOGIN
    Moderator: Peter Frith, Chief Technical Officer, Wolfson Microelectronics plc
    Wolfson Microelectronics plc

    PDF

Integrated MEMS/CMOS Devices

  • Raafat R. Mansour
    University of Waterloo

    This presentation will delve into the motivation for Integrating RF MEMS with CMOS, existing Post-CMOS MEMS Post-processing Techniques, describe the proposed post-CMOS MEMS fabrication process, provide examples of RF MEMS Devices Integrated in CMOS Chips like Varactors, Tunable Filters and Impedance Tuners and review the Integrated MEMS/CMOS Nano Instrumentations.

    PDF, 2.174 MB

FSA Suppliers Expo & Conference
Santa Clara, California, US
September 12, 2007

  • Panel Discussion: Building A Better Supply Chain... Successful Collaboration in an Outsourced Industry LOGIN
    Moderator: Bill Brandel, Principal, Industry Directions Inc.
    Industry Directions Inc.

    The 2007 Suppliers Expo aftrenoon panel highlighted the collaboration between FSA and Industry Directions (IDI) on a study of the impact of outsourced operations in design, manufacturing, logistics and other related operations in the outsourced industry.

    PDF, 185 KB

  • Panel Discussion: Divination and Wizarding Skills for Consumer Electronics Suppliers LOGIN
    Moderator: Brian Markwalter, Vice President, Technology & Standards, Consumer Electronics Association
    Consumer Electronics Association

    The 2007 Suppliers Expo morning panel discussion focused on how consumer electronics are driving the entire supply chain from consumer to OEM to semiconductor. The panel identified the challenges faced by fabless and OEM companies given the intensity of the consumer electronics market. They also explored how the demands of consumers have a profound effect and impact on all parts of the supply chain.

    PDF, 2.5 MB

  • FSA Annual Briefing LOGIN
    Jodi Shelton, Executive Director, FSA
    FSA

    PDF, 2 MB

IET & FSA International Semiconductor Forum
Paris, France
May 15, 2007

  • Business Theme: Supply Chain Management
    Panel Discussion: What Executives Can Do to Improve Time-To-Money LOGIN
    Moderated by: Robert Jelski, Global Sector Head Electronics, Semiconductor & Advanced Technologies, 3i
    3i

    PDF

FSA International Collaboration Series: Low-Power Design
March 31, 2007

  • Low Power Design from Design Foundry Perspective LOGIN
    Nianfeng Li, Corporate Vice President, Design Methodology, Verisilicon Inc.
    Verisilicon Inc.

    PDF

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WHITEPAPERS

The Last Mile: Outsourcing Semiconductor Manufacturing Operations

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    Jim Lindstrom, CFO & Kalar Rajendiran, Senior Director of Marketing
    eSilicon Corporation

    This article will discuss and explain the reasons why semiconductor companies should outsource chip physical design and manufacturing operations.

    PDF

The Emergence of Intelligent Operations Management (IOM)

  • LOGIN
    Bob Parker

    Manufacturing organizations in the electronics value chain are seeking to harvest value from the information they have and to harmonize processes and utilize the expertise of their trading partners. The information technology required to support these efforts demands a new kind of application with a modern architecture. For value chain management, this will be the IOM platform.

    PDF, 339 KB

Offshoring in the Semiconductor Industry: A Historical Perspective

  • LOGIN
    Clair Brown and Greg Linden
    UC Berkeley

    PDF, 244 KB

EMC on Chip-Level - A New Challenge?

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    Bernd Deutschmann
    austriamicrosystems AG

    PDF, 370 KB

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Working Groups

Get Involved! Join the GSA Blog and submit your ideas for Wafer Manufacturing topics to Nicole Bowman.

 

GSA Ecosystem Company Index

GSA is pleased to bring you the GSA Ecosystem Company Index. In an effort to provide the industry with timely information, the GSA Ecosystem Company Indexes provide the supply chain with a listing of companies.

Only Wafer Manufacturing companies are listed on this page. Go to the main GSA Ecosystem Company Index page for the full list.

As a complimentary feature on the GSA site, we encourage all semiconductor supply chain professionals to add their listing. Go to the Company Index Form to create or update your existing record.

Capital Ideas
3931 Jefferson Ave
Woodside , CA 94062
USA
www.capital-ideas.com

CVInc
850 S. Greenville, Suite 108
Richardson , TX 75081
United States
www.covinc.com

E.K.S.S. Microelectronics Ltd.
P.O.B 373
Timrat , Israel 36576
Israel
www.ekss.co.il

eBeam Initiative
4040 Moorpark Avenue #250
San Jose , CA 95117
USA
www.ebeam.org

EMC3D TSV Consortium
655 W. Reserve Drive
Kalispell , Montana 59901
USA
www.emc3d.org

Key ASIC
3900 Freedom Circle Suite 101
Santa Clara , CA 95054
USA
www.keyasic.com

Landshut Silicon Foundry GmbH LFOUNDRY
Jenaer Straße 1
Landshut , Bavaria 84032
GERMANY
www.lfoundry.com

NeST
4511 Singer Court
STE 201
Chantilly , VA 20151
USA
www.nestsoftware.com

Neugen, Inc.
13640 SW Wrightwood Court
Tigard , Oregon 97224
USA
http://www.neugen.com

Process Relations GmbH
Emil-Figge-Str. 76 - 80
Dortmund , NRW 44227
Germany
www.process-relations.com

Success Recruitment Group
11 The Enterprise Centre
Coxbridge Business Park
Farnham , Surrey GU10 5EH
United Kingdom
http://www.successrecruitmentgroup.com/

TSMC
2585 Junction Ave
San Jose , CA 95134
USA
www.tsmc.com

UbiMOS Technologies Inc.
3907 North First Street
San Jose , CA 95134
USA
www.ubimos.com

UMC
No. 3, Li-Hsin 2nd Road
Hsinchu , Taiwan 000
Taiwan
www.umc.com

X-FAB Semiconductor Foundries
Haarbergstr. 67
Erfurt , Thuringia 99097
Germany
www.xfab.com

GSA Wafer Manufacturing Blog

Friday, January 30, 2009

Welcome to the GSA Wafer Manufacturing Blog

Blog to come.
IC Foundry Almanac, 2010 Edition