GSA News

GSA AND THE IET COLLABORATE TO HOST THE SIXTH ANNUAL GSA & IET INTERNATIONAL SEMICONDUCTOR FORUM
Global Semi Leaders Converge to Focus on European Expertise in MEMS, Analog/Mixed-Signal, Wireless and Packaging Trends

SAN JOSE, Calif. (April 20, 2009) – The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, and the Institution of Engineering and Technology (IET), the largest professional engineering society in Europe, announce the sixth annual GSA & IET International Semiconductor Forum, to be held on June 2 -3, 2009 at the Hotel Bayerischer Hof in Munich, Germany.

The 2009 program features more than 20 global semiconductor leaders and is focused on leveraging and maximizing European expertise in analog/mixed-signal, wireless and MEMS applications, as well as addressing the markets for ASICs and multi-die packaging trends.  A town hall discussion moderated by Lip-Bu Tan, president and CEO of Cadence Designs Systems, will focus on the future of the emerging company semiconductor business model and will spotlight its impact on sourcing innovation, featuring views from Joep van Beurden, CEO of CSR.  The Forum concludes with a timely presentation on preparing for the recovery.

The 2009 Forum brings visionary keynotes, speakers and panelists who will present their views on trends, emerging applications and challenges in these technology segments. This event features four of GSA’s prestigious directors as keynote presenters.  In conjunction with the Forum, the event will host an exhibition highlighting semiconductor industry suppliers showcasing their latest products and services, and promoting the expansion of global business partnerships. Global semiconductor leaders will come together for the VIP dinner on June 2, 2009 including the GSA Board of Directors and GSA EMEA Leadership Council.

Dynamic keynote addresses:

• An economist will present views on the duration on the global economic downturn, highlight the macroeconomic factors that will contribute to eventual worldwide recovery, and identify how semiconductor technology can play a large role in overall growth and stability.

• Steve Mollenkopf, Executive Vice President and President, QUALCOMM CDMA Technologies, will present his keynote on "Redefining Mobility: Overcoming the Industry's Next Challenge," highlighting emerging wireless trends and new opportunities in the traditional hand-set market. He will also explore the technological challenges affecting the future of wireless applications.

• Dr. Aart de Geus, CEO of Synopsys, Inc. will speak to “IC Design: Rethink Everything for Recovery Readiness!,” highlighting what is driving the current economic and technological realities for companies engaging in IC design.  He will further discuss what looming challenges are waiting just down the road and what solutions will be necessary to equip them to be recovery ready.

For more information and to register, please visit: http://www.gsaietsemiconductorforum.com

Registration

Early bird registration for the Forum will continue through April 30, 2009 at €485 for GSA and IET members and €615 for non-members.

Sponsors and supporting organizations

GSA and the IET thank this year’s sponsors for their continued support of this annual event, including Platinum Plus Sponsor eSilicon and Platinum Sponsors MIPS and TSMC.  Additional supporting organizations include NMI and media sponsors Electronics World and E&T.

About GSA:
The Global Semiconductor Alliance (GSA) mission is to accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective fabless ecosystem through collaboration, integration and innovation. It addresses the challenges within the supply chain including IP, EDA/design, wafer manufacturing, test and packaging to enable industry-wide solutions. Providing a platform for meaningful global collaboration, the Alliance identifies and articulates market opportunities, encourages and supports entrepreneurship, and provides members with comprehensive and unique market intelligence. Members include companies throughout the supply chain representing 25 countries across the globe. www.gsaglobal.org

About IET:
The Institution of Engineering and Technology is the largest professional engineering society in Europe and reflects the interdisciplinary, global and inclusive nature of engineering and technology. With a worldwide membership of more than 150,000, the Institution aims to lead in the advancement of engineering and technology by facilitating the exchange of knowledge and ideas at a local and global level and promoting best practice, ensuring that its members are thoroughly equipped to meet the needs of today's rapidly changing technological world. Membership comprises of individuals from a diverse range of technical backgrounds including IT, communications technology, electronics, electrical, power engineering, software, control, informatics and manufacturing and range from students to leading figures in industry, research and development and education. The IET was formed in 2006 by the Institution of Electrical Engineers and the Institution of Incorporated Engineers. www.theiet.org

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