Global Semi Leaders Spotlight European Expertise at Munich Conference
GLOBAL SEMI LEADERS SPOTLIGHT EUROPEAN EXPERTISE AT MUNICH CONFERENCE
Event Highlights MEMS, Analog/Mixed-Signal, Wireless, Emerging Semiconductor
Business Models and Packaging Trends
SAN JOSE, Calif. (May 19, 2009) – The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, and the Institution of Engineering and Technology (IET), the largest professional engineering society in Europe, will feature focused panels on European expertise in analog/mixed-signal, MEMS and the emerging company business model June 2-3, 2009 in Munich.
In conjunction with the Forum, the event will host an exhibition highlighting semiconductor industry suppliers showcasing their latest products and services, and promoting the expansion of global business partnerships. Global semiconductor leaders will come together for a networking VIP dinner on June 2, 2009 including the GSA Board of Directors and GSA EMEA Leadership Council as well as other international VIPs.
The program features more than 20 global semiconductor presenters and is focused on leveraging and maximizing European expertise in analog/mixed-signal, wireless and MEMS applications, as well as addressing the markets for ASICs and module packaging trends. The Forum concludes with Dr. Aart de Geus, chairman and chief executive officer, Synopsys, Inc. presenting on “Preparing for Recovery.”
Dynamic panel discussions:
Analog/mixed-signal: Maria Marced, president, TSMC Europe, will moderate this panel focused on the major challenges in the overall infrastructure and support for analog/mixed-signal designs, including the need for more high-quality A/MS third-party IP options and analog design automation tools, as well as how semiconductor companies can avoid unnecessary risk.
MEMS: Benedetto Vigna, group vice president and general manager of MEMS & Sensors, Transceivers & Healthcare Division, STMicroelectronics, will moderate the panel highlighting a broad overview of MEMS, trends, key statistics and activities driving global commercialization of MEMS. Multiple perspectives will be presented on diverse applications and usage in various sectors, such as medical and healthcare as well as automotive, cell phone and consumer electronics applications.
Town hall discussion: Moderated by Lip-Bu Tan, president and chief executive officer of Cadence Designs Systems, the discussion will emphasize the future of the emerging company semiconductor business model and will spotlight its impact on sourcing innovation, featuring views from CEO line-up David Baillie, CamSemi, Joep van Beurden, CSR Plc., Stan Boland, Icera Inc, Simon Atkinson, Mirics Semiconductor and Tudor Brown, president, ARM.
GSA and the IET thank this year’s sponsors for their continued support of this annual event, including Platinum Plus Sponsor eSilicon and Platinum Sponsors MIPS, Tanner EDA and TSMC. Additional supporting organizations include NMI and media sponsors Electronics World and E&T.
About GSA:
The Global Semiconductor Alliance (GSA) mission is to accelerate the growth and increase the return on invested capital of the global semiconductor industry by fostering a more effective fabless ecosystem through collaboration, integration and innovation. It addresses the challenges within the supply chain including IP, EDA/design, wafer manufacturing, test and packaging to enable industry-wide solutions. Providing a platform for meaningful global collaboration, the Alliance identifies and articulates market opportunities, encourages and supports entrepreneurship, and provides members with comprehensive and unique market intelligence. Members include companies throughout the supply chain representing 25 countries across the globe. www.gsaglobal.org
About IET:
The Institution of Engineering and Technology is the largest professional engineering society in Europe and reflects the interdisciplinary, global and inclusive nature of engineering and technology. With a worldwide membership of more than 150,000, the Institution aims to lead in the advancement of engineering and technology by facilitating the exchange of knowledge and ideas at a local and global level and promoting best practice, ensuring that its members are thoroughly equipped to meet the needs of today's rapidly changing technological world. Membership comprises of individuals from a diverse range of technical backgrounds including IT, communications technology, electronics, electrical, power engineering, software, control, informatics and manufacturing and range from students to leading figures in industry, research and development and education. The IET was formed in 2006 by the Institution of Electrical Engineers and the Institution of Incorporated Engineers. www.theiet.org
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