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Business Wire is the leading source for press releases, photos, multimedia and regulatory filings from companies and groups throughout the world. Click here to view the latest semiconductor news from Business Wire. GSA Board Announces Two New Additions San Jose, Calif. (January 26, 2010) The Global Semiconductor Alliance (GSA) today announces the additions of Loic Lietar, corporate vice president of STMicroelectronics, and Jason Wang, president of United Microelectronics Corporation (UMC-USA) to its board of directors. GSA’s board is comprised of 22 industry executives who are representative of the global regions in which GSA holds active memberships. GSA Announces Silicon Series Line-Up San Jose, Calif. (January 25, 2010) The Global Semiconductor Alliance (GSA) announces a series of four luncheons focused on emerging applications and markets in 2010. The first Silicon Series Luncheon takes place at the Santa Clara Convention Center on February 10 in Santa Clara, Calif. The event theme is “New Markets, New Economics” and will focus on emerging markets, applications and technologies that are at the forefront of advancement for the semi industry. The GSA mission is to provide thought leadership and insight into the areas of growth for our member base and chip companies across the globe, in addition to providing a platform for global collaboration to address supply-chain challenges and inefficiencies. Global Semiconductor Alliance Announces Its 2009 Award Recipients San Jose, Calif. (December 14, 2009) The Global Semiconductor Alliance (GSA) announces the recipients of its 2009 awards , which are presented each year to outstanding semiconductor companies across the globe that have demonstrated excellence through their success, vision and strategy in the industry. The 2009 awards were presented at the GSA Awards Dinner Celebration , held on Thursday, Dec. 10, 2009, in Santa Clara, Calif. San Jose, Calif. (November 10, 2009) GSA Affirms Role as the Most Influential Voice of the Global Semiconductor Industry 2009 GSA Award Nominees Announced San Jose, Calif. (November 3, 2009) The Global Semiconductor Alliance (GSA) announces the nominees for awards to be presented at the GSA Awards Dinner Celebration on Thursday, Dec. 10, 2009, at the Santa Clara Convention Center in Santa Clara, Calif. Dr. Aart de Geus to Receive GSA's Dr. Morris Chang Exemplary Leadership Award San Jose, Calif. (October 13, 2009) The Global Semiconductor Alliance (GSA) announces industry veteran Dr. Aart de Geus as the recipient of the Dr. Morris Chang Exemplary Leadership Award, to be presented at the GSA Awards Dinner Celebration on Thursday, Dec. 10, 2009, at the Santa Clara Convention Center in Santa Clara, Calif. Global Semiconductor Alliance Announces Semiconductor Leaders Forum Taiwan 2009 Taipei, Taiwan (October 13, 2009) The Global Semiconductor Alliance (GSA) announces the program for its sixth annual Semiconductor Leaders Forum Taiwan, which will be held on Wednesday, Nov. 11, 2009, at the Ambassador Hotel Hsinchu, Taiwan. The theme of this year’s event focuses on “Clustering Collaboration” and will include keynote addresses from Joep van Beurden, chief executive officer of CSR, as well as Lars Jensen, director, Strategy and Business Development, Nokia Corporation.
GSA Awards Dinner Celebration to Recognize Excellence in Semiconductor Industry San Jose, Calif. (September 29, 2009) The Global Semiconductor Alliance (GSA) announces the 2009 GSA Awards Dinner Celebration, to be held Thursday, Dec. 10, 2009, at the Santa Clara Convention Center in Santa Clara, Calif. The annual event, now in its 15th year, recognizes semiconductor companies that have demonstrated excellence through their success, vision, strategy and future opportunities in the industry. Global Semiconductor Alliances Announces Sixteenth Annual Expo & Conference San Jose, Calif. (September 28, 2009) The Global Semiconductor Alliance (GSA) is hosting the 2009 GSA Emerging Opportunities Expo & Conference on Thursday, Oct. 1, 2009, at the Santa Clara Convention Center in Santa Clara, Calif. The event brings together global semiconductor industry professionals to generate, foster and strengthen business partnerships.
GSA Hosts IC Series Lunches in Taiwan San Jose, Calif. (September 22, 2009) The Global Semiconductor Alliance (GSA) today announces the GSA IC (International Collaboration) Series taking place in Hsinchu, Taiwan on September 29, 2009. Focused on the evolution of collaboration models for the semiconductor value chain, GSA, in collaboration with SAP and TSIA, brings together a team of experts to speak on how information technology can assist semiconductor companies to continuously grow, succeed and compete with the changing industry. Global Semiconductor Alliance Creates Supply Chain Connections at Expo San Jose, Calif. (September 21, 2009) The Global Semiconductor Alliance (GSA) is addressing emerging applications at the 16th annual GSA Emerging Opportunities Expo & Conference, held on October 1, 2009, at the Santa Clara Convention Center in Santa Clara, Calif. The conference focuses on the new avenues of growth in the semiconductor industry that utilize existing technologies in new markets. San Jose, Calif. (September 3, 2009) Jodi Shelton will preside over the Nasdaq closing bell. This is the second time in three years the honor has been extended to Shelton. She is a significant contributor and considered the highest ranking female executive involved in the semiconductor industry. Shelton represents more than 500 companies in 25 countries and tirelessly advocates on the important issues impacting the semiconductor ecosystem. Her efforts are known around the globe. Global Semiconductor Alliance Addresses Critical Emerging Applications at Annual Expo & Conference San Jose, Calif. (September 1, 2009) The Global Semiconductor Alliance (GSA) is addressing emerging applications at the 16th annual GSA Emerging Opportunities Expo & Conference, held on October 1, 2009, at the Santa Clara Convention Center in Santa Clara, Calif. The conference features seven industry analysts addressing the growth and total available market opportunities for semiconductors for global innovation, energy harvesting, , medical applications, cloud computing, mobile gaming, smart grids and home networking. Accompanying this opportunity analysis, seven semiconductor keynotes will address how they are taking advantage of these markets and making these mainstream industry segments. GSA Appoints Industry Veteran as IP Interest Group Chairman San Jose, Calif. (August 31, 2009) Global Semiconductor Alliance (GSA), the platform for global collaboration, and IPextreme, the company bringing famous IP (intellectual property) to system-on-chip designers worldwide, announce the appointment of Warren Savage, president and chief executive officer of IPextreme, to serve as the GSA IP Interest Group Chairman. GSA Appoints Leading European Executive to its Europe-Middle East-Africa Council San Jose, CA (August 11, 2009) Global Semiconductor Alliance (GSA), the platform for global collaboration has appointed Maria Marced, president, TSMC Europe, to serve on the EMEA Council. She was chosen for the Council for her drive, leadership and vision that will expand the Alliance’s reach globally. GSA EMEA Council Welcomes New Member San Jose, CA (August 11, 2009) Global Semiconductor Alliance (GSA), the platform for global collaboration, announces its most recent addition to the Europe, Middle East, Africa (EMEA) leadership council, Tudor Brown, president, ARM. Global Semiconductor Alliance Announces Sixteenth Annual Expo and Conference San Jose, Calif. (August 3, 2009) The Global Semiconductor Alliance (GSA) announces the sixteenth annual GSA Emerging Opportunities Expo & Conference, being held on October 1, 2009, at the Santa Clara Convention Center in Santa Clara, Calif. The conference will feature seven keynotes by industry executives addressing emerging opportunities in the semiconductor ecosystem. San Jose, Calif. (May 28, 2009) Global Semiconductor Alliance (GSA), the platform for global collaboration, announces its most recent addition to the board of directors, Neil Kim, Senior Vice President of Operations and Central Engineering at Broadcom Corporation. Global Semi Leaders Spotlight European Expertise at Munich Conference San Jose, Calif. (May 19, 2009) SAN JOSE, Calif. (May 19, 2009) – The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, and the Institution of Engineering and Technology (IET), the largest professional engineering society in Europe, will feature focused panels on European expertise in analog/mixed-signal, MEMS and the emerging company business model June 2-3, 2009 in Munich. San Jose, Calif. (April 21, 2009) The Global Semiconductor Alliance (GSA) announces the IP Conference Taiwan taking place in Hsinchu, Taiwan on May 7, 2009. Intellectual Property (IP) is considered by some as a corporate asset that can be leveraged to increase growth and create revenue generating opportunities for organizations, worldwide. The GSA, the platform for global semiconductor collaboration, has organized this conference to educate the industry on the ways they can utilize IP to positively impact their bottom-line. October 1, 2009 GSA Expo - IC Foundry Almanac 2010 Edition - M&A Strategies Report - Current Economin Monitor - Global Semiconductor Financials - Awards Dinner Celebration September 10, 2009 Complimentary Registration to Emerging Opportunities Expo & Conference • GSA Company Listing • New IP Reports • Receive Your Free Subscription to GSA Forum • Highlight Your Company in the Dec 2009 GSA Forum • August Global Semiconductor Funding, IPO & M&A Update • MS/RF PCM/Process Checklist • MOS-AK/GSA Workshop August 7, 2009 Nominate Your Company for GSA Award • Pivotal Topics Explored at Emerging Opportunities Expo & Conference • GSA Company Listings • Publish an Article in GSA Forum • MS/RF PCM/Process Checklist Sub-Working Group Meeting • New IP Reports July 9, 2009 June Global Semiconductor Funding, IPO & M&A Update • Enjoy the benefits of GSA Membership • New IP Reports Available! • GSA Company Listings – Now available on Ecosystem Portals • Q2 09 Wafer & Back-End Pricing Survey Findings Show a Quarterly Increase in Wafer Pricing • Highlight Your Company in the GSA Forum • Q1 09 Global Semiconductor Financial Tracker • MS/RF PCM/Process Checklist Sub-Working Group Meeting • Social Media: Facebook, LinkedIn and Twitter June 4, 2009 GSA Interest Groups, Working Groups and Sub-Working Groups are now on LinkedIn! • GSA Company Listings – Now available on Ecosystem Portals • Advertise with GSA • Publish an Article in GSA Forum • MS/RF PCM/Process Checklist Sub-Working Group Meeting • May 2009 Global Semiconductor Funding, IPO and M&A Update Now Available! • Explore Our Ecosystem EDA Portal May 7, 2009 GSA & IET International Semiconductor Forum – June 2-3, 2009 • Explore Our Ecosystem EDA Portal • GSA Emerging Opportunities Luncheon – Presentations Now Available • ITAC and GSA Conference Presentations Available • Receive Wafer & Back-End Pricing Data at No Cost • Publish an Article in GSA Forum • Global Semiconductor Financial Tracker • MS/RF PCM/Process Checklist Sub-Working Group Meeting • MOS-AK/GSA Workshop at ESSDERC/ESSCIRC April 2, 2009 GSA Emerging Opportunities Luncheon – April 7th! • ITAC and GSA Conference – April 14th-15th! • NEW! GSA Ecosystem Company Index • NEW! GSA Market Intelligence Download Form • Access Q1 2009 Wafer & Back-End Pricing Results • Highlight your Company in the June GSA Forum • Global Semiconductor Funding, IPO and M&A Update • MS/RF PCM/Process Checklist Sub-Working Group Meeting • Modeling Working Group: Developing a Common Language within the Compact Model Ecosystem Netronome launches NFP-32xx Network Flow Processor. March 18, 2010 Packet processor augments licensed IXP family for 40G, 100G networks. RF control for LED-lighting systems requires a variety of network types March 18, 2010 The marriage of RF control and lighting makes perfect sense. What's the best way to make that happen? Recognizing technology’s inflections March 18, 2010 Voices: Pierre-Yves Lesaicherre, senior vice president and general manager for NXP Semiconductors’ microcontrollers and logic business lines, discusses the microcontroller market. Calypto to power-management experts: Have it your way March 18, 2010 Calypto Design Systems has for some time now successfully leveraged its core technology—sequential analysis of synchronous logic circuits—into a full suite of tools to reduce power consumption. Analyzing your RTL (register-transfer-level) logic, the Calypto tools identify opportunities to apply fine-grained clock gating and fine-grained use of sleep modes in memory instances. Smart power-meter-IC family offers alternative to current transformers March 18, 2010 Utility power meters often must rely on a current transformer for polyphase applications. Current transformers have drawbacks, however. They are relatively expensive and require additional copper wiring. 100-mm graphene wafers target next-generation electronics March 18, 2010 Researchers at the EOC (Electro-Optics Center) at Pennsylvania State University’s Materials Research Institute have produced 100-mm-diameter graphene wafers. One-step graphene doping could enable graphene CMOS transistors March 18, 2010 Researchers at the Georgia Institute of Technology have claimed a one-step process that produces both N- and P-type doping of large-area graphene surfaces and that could facilitate the use of the material for future electronic devices. Bar code enables traceability for individual LEDs March 18, 2010 Some automotive and consumer-electronics customers require traceability down to the component level, and, for that reason, Philips Lumileds has implemented complete forward and backward traceability for its Luxeon power-LED product line. PLX delivers differentiation through evolution March 18, 2010 PLX Technology recently announced its third generation of NAS (network-attached-storage) devices and the first it developed under the PLX umbrella. March 18, 2010 When integrating LCDs into your design, you need to consider not only the cost of the LCD itself but also the costs of related hardware, software development, RTOS, and mechanical components. Tear-down: inside a 7W LED light bulb March 18, 2010 A 5000K version of a 7W LED bulb served as the sacrificial lamb to see what’s inside. Circuit-protection strategies for improving LED reliability and lifetime March 18, 2010 Excess heat and short-circuit failures drive the need for circuit protection in LED-based lighting. To combat these failures, temperature-sensitive protection devices team up with overvoltage protection to help ensure LED performance and reliability. March 18, 2010 The LED-technology sector continues to be a growing industry. But its complex design requires integration of several potentially problematic components. Battery simulator has variable ESR response March 18, 2010 This active circuit represents many battery types. System or technology dictates ADC choice March 18, 2010 How do you decide which ADC technology to use in your applications before you do a thorough system evaluation? What happens after “I’m sorry”: the world of product engineering March 18, 2010 Product engineering needs a new relationship with design and with the EDA industry. Analogies give engineers insight March 18, 2010 Insight based on fundamentals is the key to innovative multidisciplinary problem-solving. Active heat removal cools electronics hot spots March 18, 2010 A new approach to thermal management involves embedding functions deep inside an electronic component at the source of the heat using thermoelectric devices. Rectangular-waveform generator produces 25 and 75% duty cycles March 18, 2010 Use two ICs to produce both waveforms. Polyphase filters reduce saturation March 18, 2010 Polyphase techniques allow you to create large filters in smaller implementations in midrange FPGAs. Create LED-lighting patterns without a controller March 18, 2010 Create hundreds of patterns with a few timers and logic gates. Control stepper motors in both directions March 18, 2010 Logic signals turn motors on and off and change direction. The Black and Decker GH1000 Type 2 string trimmer March 18, 2010 A peek inside a Black and Decker string trimmer to determine why the string won't spin provides a good reason to look at its overall design. March 18, 2010 Tales From The Cube: One manufacturing engineer has trouble with a contract manufacturer's inability to correctly install LEDs.
Technical Editor Paul Rako looks at analog technology in power supplies, interface, the signal path, and life in general. AWR gives a free year of Microwave Office to every graduating engineer March 15, 2010 One of the exciting things that happened yesterday at the Electrical and Computer Engineering Department Heads Association conference in Clearwater... MontaVista’s Alexander Kaliadin on the instant shutdown of a Linux OS March 15, 2010 I had a great interview with the architects of MontaVista Software's 1-second boot-time real-time Linux. After the interview went to press it occur... Analog film - the attempt to save Polaroid film March 15, 2010 Well, I know analog guru Jim Williams was disturbed that he would not be able to get Polaroid film for his oscilloscope camera. Jim is an analog gu... $400 1.3GHz vector network analyzer, and a couple of tiny oscilloscopes March 12, 2010 My buddy Phil Stittner came to the last analog breakfast with a network analyzer he made from a kit. The kit is based on this nice article by Prof.... ADC noise article and all about delta-sigma converters March 8, 2010 Dave Van Ess, an apps engineer over at Cypress Semiconductor has a nice article about ADC noise over at Electronic Design. Now me, being an analog ... Electric vehicles still a long way off, other than scooters and motorcycles March 5, 2010 I see that GM canceled the Cadillac Converj electric vehicle. More concerning to electric vehicle enthusiasts is that GM also canceled the engine p... Toyota learns the tyranny of software complexity March 1, 2010 As a former auto engineer, I feel sorry for Toyota, I really do. To me it seems like their primary error was just believing their stuff has to be s... Bloom Energy, fuel cells or fool’s cells? March 1, 2010 By now everybody and their mother must have heard about Bloom Energy and their ceramic fuel cell gizmo. I heard about it last week as I hammered do... RadioFest ham radio event in Monterey CA February 26, 2010 The ARRL (American radio relay league) Santa Clara Valley Section Convention is March 20 and 21, 2010 in Monterey, California. This is at the old F... More fluorescent light misery, but LEDs could be just as bad February 25, 2010 I have four fluorescent light can fixtures in the ceiling of my porch here at the Domicile of the Future. Three of the fixtures are dead. The first... Henry Ott EMC seminar near San Francisco April 28-30, 2010 February 23, 2010 Apparently I am not the only person that admires signal integrity guru Henry Ott. His great book, Electromagnetic Compatibility Engineering just wo... New UV lamp kills germs like MRSA February 18, 2010 I was delighted to see a physicist come up with a far-UV light that kills bacteria with much more effectiveness that regular UV lights. Infections ... Dealing with ground nodes in simulators February 18, 2010 I am a big fan of Henry Ott, who points out we should not even use the term ground plane. He asks where is ground in a satellite? He prefers the te... Silicon-on-sapphire RF switch from Peregrine February 17, 2010 Peregrine Semiconductor has just released the PE42440 SP4T (single-pole four-throw) RF switch. They intend these parts for wireless base stations a... Echelon white paper about RF network interference February 12, 2010 I got a press release from the delightful; Kate Reed over at Atom PR about Echelon helping implement the smart grid, where electric and gas meters ... Maxim supervisor chip runs on 125nA February 10, 2010 I thought it was a big deal when we got op-amps and comparators to run off of 1 microampere of current, so I was stunned when my buddy Eric Sc... National Instruments executes on its simulate-to-test strategy February 9, 2010 Seeing a company with an exciting top-level strategy is a wonderful thing. National Instruments has a brilliant strategy that is focusing on helpin... Five major engineering screw-ups February 8, 2010 Cracked magazine has a cute article about 5 major engineering screw-ups (profane language). Rather than force you to check out the article I will l... Make your network analyzer like a Ridley or Venable isolated type February 4, 2010 Ridley (made by AP Instruments) and Venable make network analyzers that have isolated inputs and outputs so you can use them to make power supply s... dc-dc converter with 10kV isolation and ADI iCouplers in hybrid cars February 3, 2010 RECOM over in Germany has made a dc-dc converter in a DIP-24 footprint that has 10k-volts isolation. They give credit to the new transformer they h... Guy Dagan on heatsink planarity February 2, 2010 Guy Dagan over at Cool Innovations saw my blog about using pressure-sensing film to evaluate your heatsink. This really struck a chord with him sin... The ISSCC analog aficionado party, resurrected, this weekend. February 1, 2010 Analogical Triangulistos, in conjunction with the Back Office Boffins, brings you the resurrection of the ISSCC (integrated solid state circuits co... Smart electric meters are smart at ripping us off. Goodbye electric cars. January 29, 2010 The NY Times has a nice article about consumers revolting against smart electric meters. Add me to the list. The simple facts: My November gas a... Spice files for CMOS IC design January 28, 2010 R. Jacob Baker has published two sets of SPICE examples from CMOS design textbooks on line. Take a look at this swell matrix of Spice examples spre...
austriamicrosystems’ new single/dual white LED flash driver improves picture quality in mobile phones and digital still cameras Unterpremstaetten, Austria (March 10, 2010) AS3645 provides 25 per cent higher output current then existing equivalents for improved picture and video quality Unterpremstaetten, Austria, March 10, 2010 – austriamicrosystems (SIX: AMS), a leading global designer and manufacturer of high performance analog ICs today announced the AS3645 LED flash driver. This inductive, ultra small, high-efficiency single/dual LED flash driver offers 25 per cent higher output current than existing equivalents. The higher flash power enhances picture and video quality especially in low light environments at same system size. The AS3645 inductive flash driver drives up to 1000 mA and can be used in single LED flash or double LED flash environments. The high-side current source works with up to 2x500 mA with two LEDs in serial configuration and up to 720 mA with one LED. When driving two LEDs in series, LEDs draw identical currents and provide output light matching and thermal dissipation. The AS3645 auto detects whether to employ single or dual LED mode and enables direct one-button flashlight mode. A number of safety features protect against circuit damage and improve test time, including programmable current limiting, auto test (LED open/short detection), overvoltage and undervoltage, overtemperature and automatic flash timeout timer for thermal LED protection during flash. These features suit the needs of a camera phone flash, especially in smart phones and feature-phones. For other devices with cameras, including digital still cameras, camcorders and PDAs, the AS3645 flashlight driver is a perfect solution. Its high efficiency 2 MHz fixed frequency DC-DC boost converter with soft start allows small inductors and enables easy integration into noise sensitive RF systems. The high power LED flash current source can operate in flash, torch and assist (video) light mode. An additional current source drives an optional indicator LED. Control can be implemented through either the parallel interface mode to allow simple integration, or the I2C interface to allow more sophisticated control of all settings like currents and timings. The interface is selected by a dedicated pin (I2C/EN). The AS3645 is available in a tiny WL-CSP package (3x4 balls 0.5 mm pitch, 2x1.6 mm) and has an operating temperature range of -30° to +85°C (ambient). Price & Availability Available in volume now, the price for the AS3645 is under $0.90 in 1000 piece quantities. Technical Support A demonstration board for the AS3645 inductive flash driver is available. Contact austriamicrosystems for price. In addition, the data sheet includes an applications section showing multiple modes of operation and interface. For further information on this innovative LED flash driver IC or to request samples, please visit www.austriamicrosystems.com/LED-flash-driver/AS3645 . About austriamicrosystems austriamicrosystems is a leading designer and manufacturer of high performance analog ICs, combining more than 27 years of analog design capabilities and system know-how with its own state-of-the-art manufacturing and test facilities. austriamicrosystems leverages its expertise in low power and high accuracy to provide industry-leading customized and standard analog products. Operating worldwide with more than 1,000 employees, austriamicrosystems focuses on the areas of power management, sensors & sensor interfaces and mobile infotainment in its markets Communications, Industry & Medical and Automotive, complemented by its Full Service Foundry activities. austriamicrosystems is listed on the SIX Swiss Exchange in Zurich (ticker symbol: AMS). For more information, please visit www.austriamicrosystems.com DOLPHIN Integration introduces EMBLEM-MATH: a library of mathematical equations to build complex behavioral models Grenoble, France (March 1, 2010) In 2010, Dolphin Integration puts the emphasis on launching a range of libraries of engineering models (EM) to ease the design of logic, analog and mixed-signal circuit and multi-domain system models. The Electro Mechanical Behavioral Library of Engineering Models EMBLEM-MATH is the first one of the lineage and it is comprised of mathematical equations for functions which allow building complex behavioral models with a netlist approach for composing them at the ViC and the SoC level. Korea’s Leading Fabless Semiconductor Company Selects Sonics for Mobile Digital Multimedia Product Milpitas, Calif. (February 23, 2010) Sonics, Inc.®, a premier supplier of intelligent on-chip communications solutions, said today that its SonicsMX product has been selected by Core Logic as part of the company’s chip design for a multimedia product with HD video. Core Logic expects to ship its design by end of Q4 2010. MoSys Executive Speaks at Ethernet Summit; Michael Miller to Present: Breaking the 2 GigaAccess Barrier Sunnyvale, Calif. (February 23, 2010) Michael Miller, VP of Technology Innovation and System Applications at MoSys (NASDAQ: MOSY), a leading provider of differentiated, high-density memory and high-speed interface (I/O) intellectual property (IP), will be speaking at Ethernet Technology Conference. His presentation, “Breaking the 2 GigaAccess Barrier” is part of a tutorial review and panel discussion on 10 Gigabit Ethernet as a Mainstream Technology. This tutorial will review where 10GbE is today and where it is heading. It will focus on emerging technical solutions, methods for monitoring and managing 10 Gb Ethernet networks, and device deployment and testing. MoSys will also exhibit at the expo in Booth 18. Exhibits are open Wednesday, February 24 from 12-2 p.m. and 5-7 p.m. and Thursday, February 25 from 12-2 p.m. Dolphin Integration widens their catalog with libraries targeting both Low Power and High Speed Meylan, France (February 22, 2010) In 2010, the Virtual Component Provider focuses their product offering on both their long-established know-how on Low Power designs for embedded memories and standard cell libraries. New architectures are released from the 130 nm technological process down to 40 nm LP with versions optimized for high speed. eSilicon names Ajay Lalwani as Vice President, Strategic Sourcing
Newly created position highlights importance of eSilicon’s supply chain
Sunnyvale, Calif. (February 17, 2010) eSilicon announced the appointment of Ajay Lalwani as vice president, strategic sourcing. In this new and key position at the company Lalwani is responsible for expanding eSilicon’s capabilities in strategic sourcing across eSilicon’s entire global semiconductor supply chain. Additionally, Lalwani will develop and manage strategic alliances with key IP, EDA, photomask, wafer, assembly and test suppliers to benefit the company’s rapidly expanding customer base. Presto Engineering Offering Semiconductor Test And Analysis Services in New European Hub Caen, France (February 16, 2010) Presto Engineering, the pioneer of the labless business model that helps chip companies bring devices to volume production, has opened its new hub in Caen, France. The facility, which includes equipment and infrastructure acquired from NXP Semiconductors, allows customers to outsource comprehensive failure analysis and reliability testing, so they can focus on their core business. Silicon-IP, Inc. Founder Presents Interim Results of Semiconductor IP Licensing Best Practices at DesignCon 2010
Santa Clara, CA (February 15, 2010) Independent company implements industry best practices – enables SoC designers to achieve full benefits of 3rd party semiconductor IP outsourcing MIPS Technologies Licenses Processor IP to Taiwan’s IC Plus Corp. Sunnyvale, Calif. (February 8, 2010) High-Performance, Flexible MIPS32® 24KEf™ Pro Series® Core to Power Next-Generation Digital Home Devices austriamicrosystems expands reliance on Cadence technology to achieve seamless mixed-signal SoC design Unterpremstaetten, Austria (February 5, 2010) austriamicrosystems has extended its collaboration with Cadence by selecting encounter digital implementation system for digital designs Sonics on Track to Reach One Billion Units by Year End Milpitas, CA (February 4, 2010) Sonics is announcing its milestone cumulative units shipped worldwide from licensees to date Sunnyvale, Calif. (February 2, 2010) MoSys, Inc. (NASDAQ: MOSY), a leading provider of differentiated, high-density memory and high-speed interface (I/O) intellectual property (IP), today unveiled a roadmap for its new Bandwidth Engine(TM) integrated circuit (IC), which will combine MoSys' patented 1T-SRAM(R) high-density embedded memory with its ultra high-speed 10 Gigabits per second (Gbps) SerDes interface (I/O) technology and an arithmetic logic unit (ALU). MoSys' Bandwidth Engine promises to deliver unparalleled bandwidth performance in next-generation networking systems for storing, manipulating and accessing packets, control information and statistics at breakthrough rates. In conjunction with the announcement of this new product initiative, MoSys also today announced the expansion of its overall business model to become a fabless semiconductor company supplying high-performance ICs, in addition to differentiated IP. Dolphin Integration announces the availability of a complete FREE evaluation kit for its Memory CACHE controller Meylan, France (January 29, 2010) Its name I-Stratus-LP (http://www.dolphin.fr/flip/logic/peripherals/logic_stratus.html) stands for its position at level L1 as Instruction Cache for any processor in search for Low-Power. Indeed, the breakthrough innovation of I-Stratus-LP is twofold: its dynamic adaptation to the program demands through self-reconfiguration ensuring a drastic reduction of power consumption. ROHM Signs Major 1T-SRAM Technology License Agreement with MoSys Sunnyvale, Calif. (January 27, 2010) MoSys, Inc. (NASDAQ: MOSY), a leading provider of differentiated, high-density memory and high-speed interface (I/O) intellectual property (IP), today announced that ROHM Co., Ltd., a leading electronics company, has signed a major technology license agreement for MoSys' 1T-SRAM(R) embedded memory technology. The technology license agreement will enable ROHM to design and manufacture ICs utilizing 1T-SRAM in ROHM's fabrication facilities. Sandeep Vij Appointed CEO of MIPS Technologies Sunnyvale, Calif. (January 25, 2010) MIPS Technologies, Inc. (Nasdaq:MIPS), a leading provider of industry-standard processor architectures and cores for home entertainment, communications, networking and portable multimedia markets, today announced that the MIPS Technologies Board of Directors has appointed Sandeep Vij as president, chief executive officer and director. Mr. Vij succeeds Interim CEO Anthony B. Holbrook, who will continue to serve as chairman of MIPS Technologies' Board of Directors. Dolphin Integration: the embedded audio CODEC with smallest power consumption on the market! Meylan, France (January 25, 2010) The Helium architecture, already successfully implemented by Dolphin Integration in 130 nm G audio CODECs, is now adapted to the 180 nm and its shrunk versions at 160 nm and 152 nm. Specifically suited for portable applications requiring the longest playback capability, Helium components are cost-optimized both through silicon area and through lowest Bill-of-Material. International CES Highlights MIPS Technologies’ Growing Presence in Connected Digital Home and Beyond Sunnyvale, Calif. (January 20, 2010) MIPS Technologies, Inc. (Nasdaq: MIPS), a leading provider of industry-standard processor architectures and cores for digital consumer, home networking, wireless, communications and business applications, today announced that dozens of the world's leading electronics companies introduced and demonstrated devices and technologies based on the popular MIPS® architecture during the recent International Consumer Electronics Show (CES) in Las Vegas. Inphi samples first JEDEC-compatible memory buffer that enables a new-class of memory modules -- load-reduced DIMMs West Lake Village, Calif. (January 20, 2010) Inphi component enables servers and workstations to operate at higher speeds and support more memory modules Syndiant and SSTDC Demonstrate Smallest SVGA Laser Pico Projector Engine Dallas, Texas (January 19, 2010) Syndiant, the leader in high resolution microdisplays for pico projectors, and Shanghai Sanxin Technology Development Co., Ltd (SSTDC) announce the SEE100 Smartphone focus free laser optical engine for embedded pico projector applications. The engine, including three lasers (red, green and blue), all optics, and the Syndiant SYL2010 SVGA (800 by 600 pixel) microdisplay, is only 39 mm by 24 mm by 7.8 mm. The SEE100 engines are being demonstrated to select customers around the world. Inphi brings to market the industry’s first OIF-compliant 100G coherent TIA and highest sensitivity 40G linear TIA West Lake Village, Calif. (January 18, 2010) New components, to be showcased at Fiber Optics Expo, meet strong demands for extending 40G applications and emerging 100G applications Dolphin Integration strengthens their portfolio of Standard Cell libraries with the DUAL innovation targeting Low Power designs Meylan, France (January 18, 2010) The HD-BTF Dual Voltage RCSL (Reduced Cell Stem Library) is the latest demonstration of Dolphin Integration’s technical know-how on Low Power Silicon IPs. Presto Engineering Receives Venture Funding To Expand its Pioneering Labless Strategy into Europe San Jose, Calif. (January 14, 2010) Investment Enables Presto to Open Product Analysis Hub in France; RF and 3D-integration Technologies Will Be Expanded Sidense OTP Memory IP Helps “Green Up” Audium’s Power Amplifier Ottawa, Canada and Bristol, UK (January 13, 2010) Sidense Corp. and Audium Semiconductor announced the use of Sidense’s ultra-low-power SLP one-time programmable (OTP) memory in Audium’s recently announced high efficiency AS1001 audio power amplifier chip. VCP, pioneered by eSilicon, now an official GSA category
Jack Harding nominated to serve as first board member for the new category
Sunnyvale, Calif. (January 13, 2010) eSilicon, a pioneering semiconductor value chain producer (VCP), announced that Jack Harding, chairman, president and CEO of eSilicon, has been nominated to serve on the GSA Board as the first representative of the newly created VCP category. |
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GSAが2009年度の半導体リーダーズ・フォーラム台湾を開催
Les Dirigeants mondiaux du semi-conducteur soulignent l’Expertise Européenne à la Conférence de Munich
Globale Führungsgrössen in der Halbleiterindustrie Beleuchten Europäische Expertise auf Münchner Konferenz
