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Use the below contact information for news related to Global Semiconductor Alliance (GSA), GSA members or semiconductor industry news. Thank you. Press ContactsNicole Bowman Global Semiconductor Alliance Establishes Capital Lite Working Group SAN JOSE, Calif. (January 24, 2012) The Global Semiconductor Alliance (GSA), announces the formation of the Capital Lite Working Group whose primary focus is helping new semiconductor start-ups reduce costs, raise equity financing and improve their chance of success by providing new business models, partnerships and tools. GSA Emphasizes 3D IC Architecture Evolution with the Release of Report and Tour Guide San Jose, Calif. (December 19, 2011) The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, is pleased to announce the release of 3D IC Architecture: A Natural Evolution, a report sponsored by Macronix International Co., Ltd. and Etron Technology, Inc., and the second edition of the 3D IC Design Tools and Services Tour Guide. GSA REPORTS A RESURGENCE OF SEMICONDUCTOR IPO ACTIVITY IN NOVEMBER San Jose, Calif. (December 16, 2011) GSA Releases November/11M Statistics from its Global Semiconductor Funding, IPO and M&A Update San Jose, Calif. (December 15, 2011) The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, is pleased to announce the release of its Analog/Mixed-Signal/Radio Frequency (AMS/RF) Process Control Monitoring (PCM) Checklist Version 1.0. The tool was developed by the GSA AMS/RF Working Group’s PCM/Process Checklist Sub-Working Group. San Jose, Calif. (December 15, 2011) The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, is pleased to announce the appointment of Joep van Beurden and Steve Mollenkopf, respectively, as the Chairman and Vice Chairman of the GSA Board of Directors through 2013.
Global Semiconductor Alliance Announces Its 2011 Award Recipients San Jose, Calif. (December 12, 2011) The Global Semiconductor Alliance (GSA) announces its 2011 awards recipients. The awards are presented each year to outstanding semiconductor companies worldwide that have demonstrated excellence through their success, vision and strategy in the industry. The 2011 awards were presented at the annual GSA Awards Dinner Celebration, held on Thursday, December 8, 2011, in Santa Clara, California. STUDY RELEASED ON IC FOUNDRY MARKET GROWTH, CAPACITY TRENDS, AND WAFER & MASK SET PRICING San Jose, Calif. (December 6, 2011) GSA is pleased to announce the release of the fourth edition of The IC Foundry Almanac, a joint effort between GSA and IC Insights. The Almanac is a concise annual reference book for foundry segment analysis, five-year forecasts, wafer and mask set pricing information, and foundry company profile data. The partnership combines IC Insights’ analysis of market growth and capacity trends with GSA’s analysis of wafer and mask set pricing data and extensive database of IC foundry service provider profiles. GSA Announces Addition of Intersil CEO David Bell to its Board San Jose, Calif. (November 16, 2011) The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, announces the appointment of David Bell, president and chief executive officer of Intersil Corporation, to its board of directors. With this addition, GSA further reinforces its commitment and focus to address analog/mixed-signal (A/MS) issues within the industry. 2011 Global Semiconductor Alliance Award Nominees Announced San Jose, Calif. (November 8, 2011) The Global Semiconductor Alliance (GSA) today announces the 2011 award nominees for the GSA Awards Dinner Celebration taking place on Thursday, Dec. 8, 2011, at the Santa Clara Convention Center in Santa Clara, Calif. The awards program recognizes semiconductor companies that have demonstrated excellence through their vision, strategy, execution and future opportunity in the industry. The 2011 Dr. Morris Chang Exemplary Leadership Award is being presented to Dr. Henry Samueli, co-founder and chief technology officer of Broadcom Corporation. The winners of the 2011 Outstanding Revenue Growth by a Private Semiconductor Company award include SandForce, Inc. and Silicon Mitus, Inc GSA President Named as Finalist in 8th Annual Stevie Awards for Women in Business Dallas, TX (November 1, 2011) The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, proudly announces that Jodi Shelton, Co-Founder and President, is a finalist in Best Executive - Non-Profit or Government (Up to 100 Employees) category in the 8th Annual Stevie Awards for Women in Business. The GSA Bestows its Highest Honor to Dr. Henry Samueli San Jose, Calif. (October 26, 2011) The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, proudly announces the 2011 winner of the Dr. Morris Chang Exemplary Leadership Award: industry pioneer and co-founder of Broadcom Corporation, Dr. Henry Samueli. He will be presented with this lifetime achievement award during the GSA Awards Dinner Celebration on Thursday, Dec. 8, 2011, at the Santa Clara Convention Center in Santa Clara, Calif. Dr. Samueli is currently Broadcom’s Chief Technology Officer. GSA Semiconductor Leaders Forum Taiwan to Focus on Innovation and Clustering Collaboration Taipei, Taiwan (October 19, 2011) The seventh annual GSA Semiconductor Leaders Forum Taiwan will be held at the Shangri-La's Far Eastern Plaza Hotel, Taipei, Taiwan on Wednesday, October 26, 2011. SanDisk CEO Joins GSA Board of Directors San Jose, Calif. (October 5, 2011) The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, announces the appointment of Sanjay Mehrotra, president, chief executive officer and co-founder of SanDisk Corporation, to its board of directors. In his new position, Mehrotra will represent North America as a regional leadership director. MOS-AK/GSA Modeling Working Group Holds Fall Workshop in Helsinki San Jose, Calif. (October 3, 2011) The MOS-AK/GSA Modeling Working Group, a global compact modeling standardization forum, held its annual autumn workshop on September 16, 2011 as part of the European ESSDERC/ESSCIRC Conference in Helsinki, Finland. More than 50 international academic researchers and modeling engineers attended three sessions to hear 13 technical compact modeling keynote addresses and complementary poster presentations. GSA Announces Semiconductor Leaders Forum Taiwan 2011 Taipei, Taiwan (September 20, 2011) The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, announces its seventh annual Semiconductor Leaders Forum Taiwan, taking place on Wednesday, October 26, 2011 at the Shangri-La's Far Eastern Plaza Hotel, Taipei, Taiwan. GSA is honored to have keynote addresses from Dr. John Hennessy, president of Stanford University, who is making a special trip to Taiwan for this event, and Dr. Chao-shiuan Liu, chairman of The General Association of Chinese Culture & honorable chairman of Monte Jade Science & Technology Association (Taiwan).
GSA Reports All Semiconductor Company Segments Garnered Funding in August 2011 San Jose, Calif. (September 19, 2011) GSA REPORTS 1H 2011 SEMICONDUCTOR FUNDING DECREASED 18% OVER 2010 San Jose, Calif. (July 12, 2011) GSA Releases June/Q2/Mid-Year Statistics from its Global Semiconductor Funding, IPO and M&A Update GSA to Host Inaugural Semiconductor Ecosystem Summit San Jose, Calif. (July 12, 2011) The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, announces its inaugural GSA Semiconductor Ecosystem Summit, taking place on October 6, 2011 at the Santa Clara Convention Center. The one-day program will feature three sessions – Outlook, Memory & Supply-Chain Partnership Infrastructure, Technology & Security Infrastructure Optimization and Global Investment Opportunities & Funding Infrastructure along with an exhibition of 40 supply-chain partners on the conference floor. GSA Revitalizes Its Test Interest Group With New Leadership and Focus San Jose, Calif. (June 13, 2011) The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, announces the appointment of Dan Hamling, Sr. Director, IC Test and Assembly Business Development, GE Global Electronics Services, to serve as the GSA Test Interest Group Chairman. Hamling was chosen for this position for his industry expertise, established credibility and immeasurable contribution to GSA’s past test-related efforts. Dan’s first action as chairman will be to establish a new mission, objectives and initiatives for the Test Interest Group. San Jose, Calif. (May 19, 2011) The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, held the exclusive panel session Supporting Analog/Mixed-Signal (A/MS) Talent in Europe & Its Impact on the Future in conjunction with the GSA & IET International Semiconductor Forum on May 12. The panel addressed challenges in attracting young talent to the A/MS field, best practices that could be used to peak students’ interest in A/MS, how to encourage universities to have stronger education in A/MS, how to keep A/MS talent within Europe, and new A/MS solutions being developed within universities and institutions that are tackling the most advanced design challenges.
Technical Editor Paul Rako looks at analog technology in power supplies, interface, the signal path, and life in general. Rako is headed to Analog Devices December 19, 2011 It is with a sad heart I tell you that I am leaving EDN today. Next year I will start at Analog Devices. I will be working here in the Silicon Valley office. I loved my gig here at EDN, but Analog... Analog Aficionados party Feb 18, 2012 December 16, 2011 I will be hosting the 3rd annual Analog Aficionados party Saturday, February 18, 2012. As always, this is the Saturday before the start of the IEEE ISSCC (international solid state circuits... TI Tech Day unveils the MAVRK prototyping system December 14, 2011 I was lucky enough to go to the Texas Instruments tech day here in San Jose last week. It was fantastic and I encourage all engineers to attend this an other conferences like our famous ESC... LTspice seminar with Mike Engelhardt December 12, 2011 Last week I was lucky enough to get tipped off about the last seminar this year for Linear Technology’s free Spice program, LTspice. The seminar was given by the author of the program, Linear... LTspice seminar today, TI Tech day Thursday, Computer History Museum Saturday plus eFlea breakfast December 6, 2011 Lots of happenings this week in Silicon Valley: LTspice seminar today at Linear Techhttp://www.nuhorizons.com/xpresstrack/ltspice/TI Tech day at the Doubletree Hotel on Thursday the... Make 27.63 an hour and you are a professional December 5, 2011 Sent by alert fellow Croatian, and offered without a rant or comment, is this link to a proposed law that will classify tech workers making over $27.63 an hour as “an employee in a... Medical electronics webinar Dec 7 December 2, 2011 EDN editorial director Patrick Mannion has tipped me off to a medical electronics webinar. He notes: “Seems like something worth looking into. It’s titled “The Medical Electronics Balancing... Bangalore tech workers are the Ugly Indian December 2, 2011 I saw a great article in the BBC about a volunteer group in Bangalore that calls themselves the Ugly Indian. The group is largely comprised of engineers and technical workers. Like engineers... Fission Chips and Mushy EEs party Dec 14 2011 November 29, 2011 The fine folks at our sister publication EETimes are putting on an engineer get together here in Silicon Valley. It will be Wednesday, December 14, 2011 from 6:00 PM to 8:00 PM (PT) in San Jose,... Linear Tech and Maxim smackdown at the loco November 18, 2011 So my analog guru buddy Eric Schlaepfer, who worked at Maxim at the time, came over to St. John’s grill, where a lot of us analog folks get hammered, ahhh, errr, I mean conduct inter-company... Improved Spice model of a transmission line November 18, 2011 Diligent reader Roy McCammon wrote me to point out an article he did over at EETimes. He felt that not many “real” engineers would see it over there, so he wanted me to republish it in EDN.... Ott, Gilbert, Sauer, Harvey, and Fong discuss the new Spice model for transmission lines November 18, 2011 The previous blog post talks about Roy McCammon’s method to do Spice simulation of transmission lines. Before blogging about it, I sent the links to his original EETimes article to several... Tour of the NASA Ames Sustainability Base green building November 10, 2011 Alert reader and fellow Croatian Andy T tipped me off about an IEEE tour of the super-green platinum cool-dude NASA building just a couple miles from my house in the Ames Research center next to... Another messy lab photo for your enjoyment November 9, 2011 Randall Logan of Scientific Solutions (the Canadian one) saw the picture of Jim Williams’ lab bench in my recent editorial. He was nice enough to send this photo of the lab of Harold T.... Six weeks later, still a nation of idiots October 24, 2011 My college buddy Russ Grosse sent me a link to an article that claims cold fusion is just around the corner. Russ knew I would be especially outraged since the article does not come from some... October 21, 2011 I came across this great article about Jim William’s artistry as I searched through my EDN back issues. It is from the February 1987 edition of EDN.I want to tell you all my scanning secrets in... Barrie Gilbert on analog ubiquity October 11, 2011 This article originally appeared on the ChipCenter domain athttp://www.chipcenter.com/analog/c001.htmI have added a newer bio Barrie sent me, as well a nice picture of him with one of his lab... Tektronix product and embedded wireless design seminars for fall 2011 September 28, 2011 Tektronix has four product and design seminars this fall. The design insight tour touts their new 33GHz DPO70000D. From their release:The Fall 2011 Design Insight Seminar Tour offers designers... The Pacific Coast Machine Tool show, with Paul Brokaw goodness September 23, 2011 I corralled some of my mechanical engineer buddies as well as some analog electronics gurus that like machining and went to the Silicon Valley Pacific Coast Machine Tool Expo. As a guy that does... Margery Conner at the LED conference at the Boston Embedded Systems show. September 21, 2011 As an analog guy, I never much cared about the Embedded Systems show. But over the last few years there have been more and more analog topics in the conference and more analog companies on the... September 12, 2011 Great news for you fire-ravaged good ol’ boys in Texas. Henry Ott, the EMC, noise, and signal integrity guru is giving his course October 25-27, 2011 at the Wyndham Garden Hotel in Austin. Cost... Its official- we are a nation of idiots September 1, 2011 I got an email from the public relations company for General Electric Corporation’s house organ Txchnologist magazine. The PR guy noted“As an FYI-the Txchnologist is a digital magazine... Op amp myths – by Barrie Gilbert August 26, 2011 This article first appeared at:http://www.chipcenter.com/analog/c007.htmbut that domain is not longer active.Op amp MythsBy Barrie Gilbert,ADI Fellow; Manager, NW Labs, Beaverton, ORSome... Bob Dobkin and Jim Williams 960-page book of app notes August 25, 2011 Newnes/Elsevier Science & Technology has just announced the publication of a 960-page book of Jim Williams’ application notes. These notes span decades of Jim’s work and is a fitting... COMPANY A B C D E G I J L M N O P Q R S T U W X ALL Presto Engineering Announces Opening of New Semiconductor Service Hub in Israel Through Its Acquisition of ITH’s Assets
San Jose, CA and Migdal HaEmek, Israel (January 24, 2012) Presto Engineering, the leader in integrated test and product engineering services, today announced the opening of its newest Hub to serve the semiconductor design community in Israel. The company’s new Israeli Hub was established through the acquisition of the assets of ITH (Israel Test House) by Presto Engineering. Working in conjunction with the existing Presto Engineering Hubs in Silicon Valley and Europe, the new Hub offers the Israeli electronics and semiconductor community a complete selection of chip testing, reliability / stress testing and failure analysis services. MIPS Joins Renesas Electronics’ SoC Partner Program Sunnyvale, Calif. (January 18, 2012) MIPS Technologies, Inc. (NASDAQ: MIPS), a leading provider of industry-standard processor architectures and cores for digital home, networking and mobile applications, announced today that it has joined the Renesas Electronics SoC Partner Program. Renesas Electronics Corporation, a leading global provider of advanced semiconductor solutions, is a long-time licensee of the MIPS64® architecture and processor cores including the MIPS32® 74KTM, 24KETM and 4KETM cores. Sidense Enjoys Best Quarter in its History
Company's 1T-OTP bookings at an all-time high; first customer licensed for TSMC 28nm process. Ottawa, Canada (January 18, 2012) Sidense Corp. announced its bookings over the quarter ending December 31, 2011, the first quarter of Sidense's Fiscal Year 2012, were the highest in the Company's history. Sidense has also licensed to customers the first commercially available 1T antifuse one-time programmable (OTP) non-volatile memory (NVM) macros at 28nm. This includes a customer using TSMC's 28nm HPL process. Triad Selects Berkeley Design Automation Analog FastSPICE Platform for Verification of Configurable Mixed-Signal ASICs
Santa Clara, CA (January 17, 2012) SANTA CLARA, CA, —January 17, 2012— Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that Triad Semiconductor Inc., the industry’s leading supplier of configurable mixed-signal ASICs, has selected the company’s Analog FastSPICE (AFS) Platform for block-level characterization and full-circuit verification of their analog and mixed-signal designs. Dolphin Integration unveils an sRAM architecture for Cost Sensitive Devices at 90 nm LP Grenoble, France (January 16, 2012) Dolphin Integration is releasing RHEA, the latest innovation of the sRAM family, for cost sensitive SoCs at 90 nm and 85 nm TSMC technological processes. austriamicrosystems’ Active Noise Cancelling solution drives trend for better communication and greater peace of mind Unterpremstaetten (January 9, 2012) austriamicrosystems (SIX: AMS), a leading global designer and manufacturer of high-performance analog ICs, today announced that the Jabra SUPREME Bluetooth headset features austriamicrosystems recently introduced Active Noise Cancelling (ANC) IC. These ANC ICs from austriamicrosystems improve hearing in noisy environments and feature the lowest power available, resulting in at least 20 % longer battery life than other ANC solutions. Audio performance is also improved over competing solutions with a 10 dB positive SNR -- no matter the environment -- improving intelligibility in Bluetooth headsets. Dolphin Integration announces the availability at 40 nm of low-power audio codec with SNR of 100 dB Grenoble, France (January 9, 2012) The audio converter panoply from Dolphin Integration is based on ultra Low Power architecture of cores - ADC and DAC - and offers peripherals for high density or low BoM to address mobile devices like smart phones, tablets, DSC, portable DVD players… STATS ChipPAC Expands Manufacturing Presence in Singapore with a New Factory Singapore (January 5, 2012) STATS ChipPAC held a groundbreaking ceremony for a new 197,000 square foot factory in Singapore to support expansion of advanced wafer level technologies. Berkeley Design Automation Wins ISA Technovation Award
Santa Clara, CA (December 16, 2011) Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that it has been selected as a winner of the ISA Technovation Award (Dec 2011) in the Semiconductor (Intellectual Property) category by the India Semiconductor Association (ISA). NetLogic Microsystems Wins the 2011 Most Respected Emerging Public Semiconductor Company Award for Third Consecutive Year Santa Clara, Calif. (December 12, 2011) NetLogic Microsystems, Inc. [NASDAQ: NETL], a worldwide leader in high-performance intelligent semiconductor solutions for next-generation Internet networks, today announced that it has received the distinguished 2011 Most Respected Emerging Public Semiconductor Company Award for the third consecutive year from the Global Semiconductor Alliance (GSA). NetLogic Microsystems was recognized by its industry peers, customers, partners and the GSA as the most respected public semiconductor company with revenue up to $500 million. SilTerra and Symetrix announce a major collaboration to offer ferroelectric memory as a standard offering for the first time at a foundry Kulim, Malaysia & Colorado Springs, CO, USA (December 7, 2011) SilTerra Malaysia Sdn Bhd and Symetrix Corporation today announced a major collaboration to offer non-volatile ferroelectric random access memory (FeRAM) as a standard memory offering. FeRAM is a well established technology offered by several independent device manufacturers to serve many applications such as smart cards, smart meters and automotive controllers. Now, with FeRAM becoming a standard offering at SilTerra, the design community at-large will be able to incorporate the unique features of this technology in their designs. MIPS Technologies and Ingenic Semiconductor Announce Availability of World’s First Android™ ‘Ice Cream Sandwich’ Tablet Sunnyvale, Calif. (December 5, 2011) MIPS Technologies, Inc. (NASDAQ: MIPS), a leading provider of industry-standard processor architectures and cores for digital home, networking and mobile applications, and Ingenic Semiconductor, a leading China-based CPU provider for mobile multimedia applications, today announced worldwide availability of the world's first tablet based on Android TM 4.0, known as 'Ice Cream Sandwich', that is retailing for less than $100 (U.S). The tablet is powered by Ingenic's JZ4770 mobile applications processor, which leverages a MIPS-BasedTM XBurstTM CPU running at 1GHz. Leading-edge demonstration of Application Hardware Modeling for SoC Integrators and Application Engineers of Fabless suppliers by Dolphin Integration Grenoble, France (December 5, 2011) The mixed-signal Silicon IP and EDA Solutions provider announces the availability of demonstrators of the usefulness of Application Hardware Modeling (AHM) to ensure the performance of Silicon IP or IC at PCB/System level, as early as possible in the design and integration process. austriamicrosystems releases comprehensive CMOS, High-Voltage, High-Voltage Flash and RF Multi Project Wafer Services schedule for Foundry Customers Unterpremstaetten (November 30, 2011) austriamicrosystems’ (SIX: AMS) Full Service Foundry business unit today released its further expanded fast and cost-efficient IC prototyping service, known as Multi-Project Wafer (MPW) or shuttle run, with an even more extensive schedule in 2012. The prototyping service which combines several designs from different customers onto a single wafer offers significant cost advantages for foundry customers as the costs for wafer and masks are shared among a number of different shuttle participants. MIPS Technologies Selected for Inclusion in Ocean Tomo 300® Patent Index
Sunnyvale, Calif. (November 29, 2011) MIPS Technologies, Inc. (NASDAQ: MIPS), a leading provider of industry-standard processor architectures and cores for digital home, networking and mobile applications, today announced that it has been included in the highly regarded Ocean Tomo 300® Patent Index (OT300), the industry’s first index based on the value of corporate intellectual property. The OT300 represents a diversified portfolio of 300 companies that own the most valuable patents relative to their book value, and includes well-known names such as AT&T, Broadcom, Cisco Systems, General Electric, Microchip Technology, and Sprint Nextel. AltaSens Adopts Berkeley Design Automation Analog FastSPICE™ Platform for HD CMOS Image Sensors Santa Clara, Calif. (November 29, 2011) Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that AltaSens, Inc., a premier supplier of high-performance CMOS image sensors, has selected the company’s AFS Platform for full-circuit post-layout verification, block-level characterization, and device noise analysis of their high-definition (HD) and wide-dynamic-range CMOS image sensors. Proven on silicon: A Panoply of Memories and Standard Cells of Dolphin Integration to divide dynamic power by 5 at 180 nm! Grenoble, France (November 25, 2011) With the release of its latest 180 nm Panoply of standard cells and memories, Dolphin Integration paves the way for a new generation of ultra low power SoCs in mature processes. austriamicrosystems announces industry’s first FlexRay™ transceiver designed for high temperature automotive applications Unterpremstaetten (November 16, 2011) austriamicrosystems (SIX: AMS), a leading global designer and manufacturer of high-performance analog ICs has announced the AS8222 FlexRay™ transceiver. This transceiver, with an in-package maximum ambient temperature of 150°C and bare dice with a maximum temperature of 165 °C, is the first to be able to work in harsh, high temperature powertrain applications. This extended temperature range enables the use of FlexRay™ in every vehicle domain, especially in environments beyond the standard automotive requirements. Industry’s first demonstration for standalone NFC MicroSD announced by austriamicrosystems; developed in cooperation with Infineon
Unterpremstaetten (November 15, 2011) austriamicrosystems (SIX: AMS), a leading global designer and manufacturer of high-performance analog ICs, today announced the first demonstration that enables NFC (near field communication) data transfer on removable secure elements using a micro-antenna design. This solution is developed in cooperation with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), the world’s leading supplier of integrated circuits for chip cards. It will speed up the deployment and the acceptance of standalone NFC solutions based on ultra small form factors such as microSD. Dolphin Integration Receives 2011 TSMC IP Partner Award for Analog/Mixed-Signal IP San Jose, USA (November 4, 2011) Dolphin Integration, provider of mixed-signal IP, has received the 2011 TSMC IP Partner Award for Analog/Mixed-Signal IP. The award is based on customer feedback, TSMC 9000 compliance, support and success of the IP. Sonics Files Lawsuit Against Arteris for Patent Infringement Milpitas, Calif. (November 2, 2011) Sonics, Inc.®, the world’s number one supplier of on-chip communications IP, today announced that the company filed a patent infringement lawsuit against Arteris, Inc. on November 1, 2011 in the United States District Court, Northern District of California. The suit alleges that Arteris is willfully infringing on seven of Sonics’ technology patents. ICsense Adopts Berkeley Design Automation Analog FastSPICE™ Platform Santa Clara, Calif. (November 1, 2011) Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that ICsense, a prominent European analog IC design house, has selected the company’s AFS Platform for full-circuit verification, block-level characterization, and device noise analysis of their high-performance analog, mixed-signal, and high-voltage designs. Microchip Technology Licenses Sonics’ On-Chip Networks for Industry-Leading 32-bit Microcontroller Family
Milpitas, Calif. (October 31, 2011) Sonics, Inc.®, the world’s number one supplier of on-chip communications IP, today announced Microchip Technology Inc. has licensed a number of its popular on-chip networks and memory subsystems for its award-winning 32-bit PIC32 microcontroller family. Sonics’ solutions will be used in the PIC32 product family, in an array of diverse applications from automotive, consumer electronics and home appliances to wireless connectivity. austriamicrosystems announces the highest performance NFC Reader IC for payment and automotive applications Unterpremstaetten (October 31, 2011) austriamicrosystems (SIX: AMS), a leading global designer and manufacturer of high-performance analog ICs, has announced the AS3911 NFC (near field communications) and HF (high frequency) reader IC. The AS3911 has unique capabilities not available in the market and enables a number of applications, including EMV (Europay MasterCard Visa) payment, access control, automotive, NFC Infrastructure, and ticketing. |
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世界半導体連盟 GSAの会長にJoep van Beurden氏（CSR） 就任 ～ 副会長にSteve Mollenkopf氏（Qualcomm） ～
CSR及Qualcomm選任為GSA董事會新任正副主席
