What's Your Take on RoHS Exemptions?

• Packaging Survey
  

  GSA is addressing the proposed changes to RoHS and is looking for your feedback on how these exemptions will affect your business. The exemptions are due to expire in 2014. Take this brief 10 question survey and give us your feedback.

Wafer Fabrication & Back-End Pricing

• This survey is intended to create a quarterly benchmark for the fabless and IDM sectors, depicting average wafer, mask set, assembly, test and wafer bump prices by company type, region, etc. The data is collected confidentially and tabulated in aggregate by Grant Thornton LLP using a weighted industry average approach. In exchange for completing the Survey online, you will receive complimentary access to the Wafer Fabrication and Back-End Pricing Reports ($3,000 annual value), analyzing the average wafer, mask set, assembly, test and wafer bump costs for each quarter in which you participate.

GSA Interest Group Survey

• GSA's Interest Groups are driving industry solutions in EDA/Design, IP, Wafer Manufacturing, Packaging and Test. Help us by giving your feedback in these areas.

Suppliers and Service Partners

• Suppliers to the semiconductor industry are eligible for inclusion in the GSA Supplier & Service Partner Profile Directory. To submit your company for inclusion, please complete this survey and submit it to GSA.

Semiconductor End Markets

• It is well known that the semiconductor industry changes rapidly; therefore, GSA surveys its database of companies regularly to ensure all information is updated and correct. This year, we are sending an abbreviated survey to capture your company’s detailed end market information. By completing the survey, it will guarantee your company is listed correctly in our database, which, in turn, will help us serve you better.

Global Semiconductor Funding, IPO and M&A Update

• To provide the industry with timely data on semiconductor investment activity in the private and public sector, GSA releases a monthly two-page update and a downloadable, sort-able Excel spreadsheet of all semiconductor funding, initial public offering (IPO), and merger and acquisition (M&A) activity.

Global Semiconductor Financial Tracker

• GSA's quarterly Global Semiconductor Financial Report is a comprehensive report, which includes detailed trend analysis, regional breakdowns, etc. on financial data. This report is complimentary to GSA members. Non-members may purchase it at the GSA Store.

Wafer Fabrication & Back-End Pricing Report

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  Grant Thornton

  The Wafer Fabrication Pricing Report is designed to gauge the average prices paid per wafer for fabless semiconductor companies and integrated device manufacturers (IDMs). The data was collected confidentially and tabulated in aggregate by Grant Thornton LLP using a weighted industry average approach.

India Semiconductor Market Research Reports

• The India Semiconductor Association (ISA) is the trade body representing the Indian semiconductor driven industry. ISA is committed to building global awareness for the Indian semiconductor-driven industry and supporting its growth through focused activities. ISA has played a prominent role in supporting the Government of India in the Semiconductor Policy.

Understanding the Needs & Perceptions of SOI Technology: Silicon-on-Insulator Survey Analysis

• Given the critical low-power and high-performance needs in the semiconductor industry today, Silicon-on-Insulator (SOI) technology may become an enabler to companies attempting to meet these requirements, especially at more advanced nodes. GSA hosted the survey to better understand the needs and perceptions of SOI from users within the industry.

Lead-Free Resources

• GSA provides you resources including presentations, reports and links to additional sites with helpful information such as defining RoHS, WEEE, lead facts, and more.

Building a Better Supply Chain: Successful Collaboration in the Fabless Semiconductor Industry

• Industry Directions and GSA

  A collaborative effort between industry analyst firm Industry Directions, Inc. and GSA, the study demonstrates that while fabless companies are adept at operating in the outsourced model and recognize the importance of the supply chain and how it helps drive competitive advantage, there is significant opportunity for improvement.

GSA Semiconductor Market Report: An Essential Data Resource for Outsourcing Companies

• The Semiconductor Market Report, last updated in May 2007, is an essential historical data resource that encompasses the entire fabless ecosystem. There is no single source or publication of this caliber with the more than 550 pages of easy-to-read charts, graphs and written analysis.

System in Package (SiP)) Market and Patent Analysis

• The GSA SiP Market and Patent Analysis provides a historical analysis for readers with a greater awareness of SiP applications and technologies. Featured topics include understanding the SiP market and technology trends, identifying the talents of competitors and major worldwide leaders in various arenas of SiP-related patents and R&D status, planning the direction of R&D and patent strategy and creating seamless vertical integration of the SiP supply chain.

To DFM (Design for Manufacture) or not DFM?

• Wes Hansford
  MOSIS

  This article discusses packaging options available for prototyping silicon ICs

  PDF, 1277.091 MB

Can MIPI and MDDI Really Co-Exist?

• Ashraf K. Takla, Mixel & Timothy Saxe, QuickLogic

  Since MIPI and MDDI standards both target interfaces to cameras and displays on mobile devices, are two separate standards really needed?

  PDF, 4.55 MB

Current Economic Downturn Monitor

• Throughout the current economic downturn, GSA is providing the industry with the latest data, resources and analysis supporting the GSA Hypothesis. We encourage you to download the articles and presentations for the most comprehensive analysis.

Gain Freedom Through a Value Chain Producer

• Kalar Rajendiran
  eSilicon Corporation

  PDF, 173.915 MB

GSA & IET International Semiconductor Forum
Munich, Germany
June 2, 2009

• Module Packaging Trends LOGIN
  Dr. Mohamed Wahab, Managing Director
  DELTA Microelectronics, Ltd.

  This presentation addresses digital chips and mixed-signal combinations in a single package, with emphasis on System-in-Package (SiP) applications. This presentation sheds light on this topic by illuminating case studies, providing best practices and general guidelines on how to evaluate the tradeoffs.

  PDF, 1.72 MB

IP Conference Taiwan
Hsinchu, Taiwan
May 7, 2009

• Strategizing for a healthy IP ecosystem
  Strategies for Managing Development Costs & Risks at Advanced Technology Nodes
  Brani Buric, Executive Vice President
  Virage Logic Corporation

  PDF, 2.002 MB

• Strategizing for a healthy IP ecosystem
  Future Prospective of Programmable Logic Non-Volatile Memory
  Charles Hsu, President
  eMemory Technology Inc.

  PDF, 1.016 MB

ITAC and GSA Conference
Waterloo, Ontario, CANADA
April 15, 2009

• Semiconductor Industry Will Innovate its Way Out of the Downturn
  Lisa Tafoya, Vice President of Global Research
  Global Semiconductor Alliance

  The semiconductor industry has a rich tradition of managing through dramatic and unforgiving cycles, ranging from years of extraordinary growth, to steep declines. After several unprecedented years of contiguous growth, the industry is now facing a downturn stunning even industry veterans. Semiconductor companies will not go unscathed in this current environment. Start-ups needing additional rounds of funding and do not yet have a product and are not cash-flow positive are the most vulnerable. However, in general, the industry is in a much stronger position to weather this downturn than it was in 2001. The presentation will provide data and analysis supporting the hypothesis that the semiconductor industry will innovate its way out of the downturn, and how great companies will be prepared for next-generation opportunities.

  PDF, 4.35 MB

• IDC Semiconductor Update: Semiconductor Industry Downturn Prolonged by Economic Reality
  Flint Pulskamp, Program Manager Wireless Semiconductors
  IDC

  At what point can we expect to reach the bottom of this current downturn? How does this downturn compare to 1996, 1998 and 2001?

  PDF, 908 KB

GSA Suppliers Expo & Conference
Santa Slara, CA
October 2, 2008

• GSA Annual Briefing LOGIN GSA

  PDF, 1.6 MB

IET & GSA International Semiconductor Forum
London, United Kingdom
May 15, 2008

• 3D Integration LOGIN
  Flynn Carson, Vice President Emerging Technology
  STATSChipPac

  PDF, 3.4 MB

FSA Suppliers Expo & Conference
Santa Clara, California, US
September 12, 2007

• FSA Annual Briefing LOGIN
  Jodi Shelton, Executive Director, FSA
  FSA

  PDF, 2 MB

• Panel Discussion: Divination and Wizarding Skills for Consumer Electronics Suppliers LOGIN
  Moderator: Brian Markwalter, Vice President, Technology & Standards, Consumer Electronics Association
  Consumer Electronics Association

  The 2007 Suppliers Expo morning panel discussion focused on how consumer electronics are driving the entire supply chain from consumer to OEM to semiconductor. The panel identified the challenges faced by fabless and OEM companies given the intensity of the consumer electronics market. They also explored how the demands of consumers have a profound effect and impact on all parts of the supply chain.

  PDF, 2.5 MB

FSA International Collaboration Series: System-in-Package (SiP)
June 26, 2007

• Chip-PKG-System Co-Design LOGIN
  Kenny Chang, VIA
  VIA

  PDF, 145 KB

• Opening Remarks LOGIN
  Dr. Jeremy Wang, Asia-Pacific Executive Director, GSA
  GSA

  PDF, 595 KB

• Enter the Age of Consumers (SiPs) LOGIN
  Dr. Ho-Ming Tong, GM of Corporate R & D, ASE Group
  ASE Group

  PDF, 491 KB

• SiP & System Integration - A Perspective from ITRS LOGIN
  W.R. (Bill) Bottoms, 3MTS & NanoNexus
  3MTS & NanoNexus

  PDF, 1.3 MB

• SiP Technology Overview LOGIN
  Leonardo Wang, Director of Advanced Package Technology Division, ASE, Inc.
  ASE, Inc.

  PDF, 1.4 MB

• Package on Package (PoP) - Applications, Advantages, Technology and Infrastructure LOGIN
  Lee Smith, Senior Director Business Development, Amkor Technology
  Amkor Technology

  PDF, 3.9 MB

• Small Form Factor SiP Development LOGIN
  Tom Gregorich, Vice President, IC Package Engineering, QUALCOMM
  QUALCOMM

  PDF, 2.5 MB

• Mobile Systems Application LOGIN
  CS Wang, Vice President of Worldwide Manufacturing Center, HTC
  HTC

  PDF, 1.2 MB

• IC PKG-PCB Co-Design/ SiP Design Environment LOGIN
  Willis Chang, Cadence
  Cadence Design Systems, Inc.

  PDF, 1.5 MB

• IC, Package, PCB 3D Co-Design Solutions for SiP LOGIN
  Mike Brenneman, Ansoft Corporation
  Ansoft Corporation

  PDF, 1.8 MB

• RF System Miniaturization LOGIN
  T.Y. Hsieh, Quanta Computer Inc.
  Quanta Computer Inc.

  PDF, 267 KB

• SiP DFT & Testing Solutions LOGIN
  Roger Hwang, ASE Inc.
  ASE, Inc.

  PDF, 197 KB

• PC Integration Applications LOGIN
  H. Shelton Lu, Vice President, System Platform R&D Core Logic, VIA
  VIA

  PDF, 2.8 MB

IET & FSA International Semiconductor Forum
Paris, France
May 15, 2007

• Business Theme: Supply Chain Management
  Panel Discussion: What Executives Can Do to Improve Time-To-Money LOGIN
  Moderated by: Robert Jelski, Global Sector Head Electronics, Semiconductor & Advanced Technologies, 3i
  3i

  PDF

• Technical Theme: System-in-Package (SiP)
  System-in-Package (SiP): A Catalyst for Innovation LOGIN
  William Chen, Senior Technical Advisor, ASE Group
  ASE Group

  PDF, 1.88 MB

• Panel Discussion: How to Develop System-in-Package (SiP) Solutions LOGIN
  Moderated by: Eric Beyne, Program Director Advanced Packaging and Interconnect Center, IMEC
  IMEC

  PDF, 711 KB

The Emergence of Intelligent Operations Management (IOM)

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  Bob Parker

  Manufacturing organizations in the electronics value chain are seeking to harvest value from the information they have and to harmonize processes and utilize the expertise of their trading partners. The information technology required to support these efforts demands a new kind of application with a modern architecture. For value chain management, this will be the IOM platform.

  PDF, 339 KB

Offshoring in the Semiconductor Industry: A Historical Perspective

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  Clair Brown and Greg Linden
  UC Berkeley

  PDF, 244 KB