Understanding the needs & perceptions of soi technology: Silicon-on-insulator survey analysis
Silicon-on-insulator (SOI) adoption initially began within the integrated device manufacturer (IDM) community in the late 1990s for its high-performance advantages. Since the demand for information on SOI has spiked over the past few years, GSA and the SOI Industry Consortium collaborated to determine industry awareness and the various perceptions of SOI technology. This joint effort resulted in an online survey.
Given the critical low-power and high-performance needs in the
semiconductor industry today, Silicon-on-Insulator (SOI) technology may become an enabler to companies attempting to meet these requirements, especially at more advanced nodes. GSA hosted the survey to better understand the needs and perceptions of SOI from users within the industry.
GSA is pleased to support the work of the SOI Consortium whose mission is to accelerate SOI innovation into broad markets by promoting the benefits of SOI technology and reducing the barriers to adoption.
View Press Release
Key results from the SOI survey include:
- Promising growth potential in SOI technology
- Significant interest in SOI for low power
- Counter perceptions that SOI is only applicable at leading-edge nodes
Download a PDF version of the SOI Report (22 pages, 167KB)
GSA surveyed the following company types
around the world to gauge industry awareness and perception of SOI Technology.
- IC Users
- Semiconductor suppliers
- Design services providers
- Systems companies
- IP providers
- EDA providers
- Silicon suppliers (wafer foundries)
- Equipment suppliers
- Back-end services suppliers
The survey garnered 110 valid industry respondents from designers currently using and not using SOI Technology. Repsondents reflected the following titles: Chief Executive Officer, Chief Technical Officer, Vice President of Engineering, Vice President of Operations, Director of Engineering, and other engineering professionals. Eighty-five percent of companies were responsible for IC design.
For more information on the survey content, contact Chelsea Boone.
|