IC Design Technology Symposium on Wireless and Low Power
无线与低功耗应用IC设计研讨会
Energy consumption has emerged globally as one the most visible issues confronting the world today. For developers of electronics products, reducing power has moved to be the number one design challenge. Leading electronics companies have come together to create a broad IC design ecosystem that supports advanced power lowering design techniques.
In this forum, the panelists will present the latest solution for those IC designers who are still struggling with energy, heat dissipation, feature size, or even environmental concerns. Moreover, the panelists will also discuss how they are reducing power and will illustrate benefits that can be achieved with a holistic low power design flow.
Wednesday, March 19
3月19日，周三
09:00-17:00
Shanghai New International Expo Center
上海新国际博览中心
W3-M10
西侧3号馆10号会议室
Event Code (活动代码): ICDCG
Free Program (免费活动)
Note: Agenda subject to change. , no Chinese interpreter will be provided on-site.
PROGRAM OBJECTIVE 活动简介
| Time |
Program Item |
| 09:00 - 09:30 |
Registration
听众登记 |
| 09:30 - 11:30 |
Session I：Challenge and Innovation in Wireless IC Design
无线应用IC设计的挑战和创新
Panelists:
- Semiconductor Investment Trends in Wireless sector
Wu-Fu Chen, Acorn Campus Ventures
- Dominik Schmidt, Director, Intel Wireless & Analog Engineering
- Process Variability – The Challenge in Low Power CMOS Design
Xiaonan Zhang, Director Qualcomm
- Design and verification for low power wireless applications
Vivek Shukla, Architect for Wireless Kits at Cadence Design Systems
- Low Power Wireless SOCs – Trends in Design and Verification
Srikanth Jadcherla, Synopsys
|
| 13:30 - 14:00 |
Registration
听众登记 |
| 14:00 - 16:00 |
Session II：Challenge and Innovation in Low Power IC Design
低功耗设计技术的创新
Moderator: Lung Chu, Corporate Vice President, Cadence
Panelists:
- John Wei, Senior Director, Alchip
- Felix Fei, Technical Marketing Manager, ARM China
- Pankaj Mayor, Group Director, Industry Alliances, Cadence
- Yu Lei, Principle Engineer, Design Service, SMIC
- Nianfeng Li, Vice President, VeriSilicon
Sponsored by  |
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WHO SHOULD ATTEND 对口听众
This is a valuable program for people from semiconductor manufacturing, design and EDA tool supplier companies.
本次活动有助于半导体制造、设计公司和EDA软件供应商
ORGANIZED BY 主办方
GSA （Global Semiconductor Alliance, formerly FSA)
CASPA （Chinese American Semiconductor Professional Association）
SUPPORTED BY 支持方
上海市浦东新区科学技术协会
Shanghai Pudong Association for Science & Technology
上海市浦东新区科技发展基金
Shanghai Pudong New Area Science & Technology Development Fund
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