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MIXED-SIGNAL/RF SUBCOMMITTEE

Purpose

The Mixed-Signal/RF Subcommittee's mission is to accelerate the formation of an advanced mixed-signal/RF supply chain and ecosystem for fabless and hybrid companies.

The Subcommittee’s objectives include: (1) developing a format for process design kit (PDK) roadmap representation and development criteria at various stages in the process lifecycle; (2) developing mixed-signal/RF requirements for characterization vehicle, SPICE modeling, design-for-manufacturing (DFM) and package modeling; (3) creating a common language for mixed-signal/RF intellectual property (IP) and establishing an environment where analog and RF IP can be reused; (4) defining a standard way of communicating basic process parameters and criteria for mixed-signal/RF processes; and (5) developing standard definitions for quantitative and qualitative metrics that can be used for classification and as figures of merit in selecting an appropriate process and process options for a specific design application.

Initiatives

Mixed-Signal/RF PDK Checklist Update – The Subcommittee's PDK Working Group is working to further improve and revise the current version (2.0).

Mixed-Signal/RF SPICE Model Checklist Update – The Subcommittee's Model Working Group is working to further improve and revise the current version (1.2).

AMS/RF Process Checklist Update - The Subcommittee's Process Control Monitoring (PCM)/Process Checklist Working Group has developed a four-page Process Checklist that (1) reflects the key attributes of an AMS/RF foundry process offering and (2) provides standard definitions for the quantitative and qualitative metrics that can be used for classification and as figures of merit in selecting an appropriate process and process options for a specific design application.

Mixed-Signal/RF PCM Checklist Update - Now that the Process Checklist has been completed, the Subcommittee's PCM/Process Checklist Working Group will work to develop a checklist that will help in communicating basic process parameters and criteria for mixed-signal and RF processes.

Deliverables

AMS/RF Process Checklist - The Subcommittee's Process Control Monitoring (PCM)/Process Checklist Working Group has established a checklist that identifies the different elements of a foundry’s AMS/RF process and its ability to fulfill a semiconductor company’s needs; serves as a basic set of guidelines for measuring available items in an AMS/RF foundry process; and is an efficient way to communicate information in a consistent format across all foundries.

Mixed-Signal/RF PDK Checklist – A document completed by the PDK developer and delivered with each new release of a mixed-signal/RF PDK. This document helps developers obtain a better understanding of the source data, completeness and quality of the PDK before using it to design ICs or to modify it to fit into your in-house design flow. A Checklist Users Guide is also available for download.

Click here for the PDK Checklist Adoption Table (Below)

Mixed-Signal/RF SPICE Model Checklist – A document completed by the SPICE model developer and delivered with each new release of an SPICE model. This document helps developers better understand the source data, completeness and quality of the model before using it to design ICs or to re-extract it to fit into specific product needs. A Checklist Users Guide and Checklist Taxonomy & Definitions are also available for download.

Click here for the SPICE Model Checklist Adoption Table (Below)

IP Deliverable Checklist - The Subcommittee's IP Working Group has established an IP checklist that is integrated into the Hard IP Quality Risk Assessment Tool.

Mixed-Signal/RF Subcommittee Calendar

Previous Month Nov 2008 Next Month
26 27 28 29 30 31 1
2 3 4 5 6 7 8
9 10 11 12 13 14 15
16 17 18 19 20 21 22
23 24 25 26 27 28 29
30 1 2 3 4 5 6

Working Groups

MS/RF PDK Working Group - Developing a format for PDK roadmap representation and development criteria at various stages in the process lifecycle.

MS/RF Model Working Group - Developing mixed-signal and RF requirements for characterization vehicle, SPICE modeling, DFM and package modeling.

MS/RF IP Working Group - Creating a common language for mixed-signal/RF IP and establishing an environment where analog and RF IP can be reused. IP providers will be able to offer essential building blocks and accelerate product time-to-market.

MS/RF PCM/Process Checklist Working Group - (1) Defining a standard way of communicating basic process parameters and criteria for mixed-signal and RF processes. (2) Developing standard definitions for quantitative and qualitative metrics that can be used for classification and as figures of merit in selecting an appropriate process and process options for a specific design application.

Get Involved

GSA members and non-members who deal with MS/RF-related issues are encouraged to get involved.

Join This Subcommittee – By signing up, you will be added to a distribution list and receive upcoming meeting notifications.

For more information, contact:

Marco Racanelli, MS/RF Subcommittee Chairman, Jazz Semiconductor
(T) 949-435-8309
(E) marco.racanelli@jazzsemi.com

Chelsea Boone, GSA
(T) 972-866-7579, ext. 123
(E) cboone@gsaglobal.org

 

 

PDK Checklist Adoption Table

Foundry Process PDK Checklist Version Used Link to PDK Checklist  PDK Support Contact 
Grace Semiconductor Manufacturing Corporation 0.18um IBG MS/RF CMOS 2.0 PDK Checklist

Emir Yu
(T)86-21-51318888-83505 (E)emiryu@gsmcthw.com

Silterra Malaysia Sdn Bhd CL130MR 2.0 PDK Checklist

Al Kordesch
(T)60-4-401-5572 (E)al_kordesch@silterra.com

Taiwan Semiconductor Manufacturing Company Ltd. 0.60um, 0.35um, 0.25um, 0.18um, 0.13um, N80um, N90um, N65um 1.5 N/A Bryan Chang
(T) 886-3-563-6688 ext. 7073456 (E)bryan_chang@tsmc.com
austriamicrosystems AG C35 2.0 PDK Checklist

Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@austriamicrosystems.com

  S35 2.0 PDK Checklist
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@austriamicrosystems.com
  H35 2.0 PDK Checklist
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@austriamicrosystems.com
Jazz Semiconductor CA18, SBC18 2.0

PDK Checklist
(need customer account)

N/A
X-FAB
Semiconductor Foundries
XC018, XH018, XH035, CX08HV, XDM10, XDH10 2.0 PDK Checklist (need customer account) PDK Checklist Support Contacts
  XC06, XL035 1.0 PDK Checklist (need customer account) PDK Checklist Support Contacts

SPICE Model Checklist Adoption Table

Foundry Process SPICE Model Checklist Version Used Link to SPICE
Model Checklist
SPICE Model
Support Contact 
Jazz Semiconductor SBC18, CA18 1.2

Model Checklist
(need customer account)

N/A
Taiwan Semiconductor Manufacturing Company Ltd. 0.60um, 0.35um, 0.25um, 0.18um, 0.13um, N80um, N90um, N65um 1.5 N/A

Bryan Chang
(T)886-3-563-6688 ext. 7073456 (E)bryan_chang@tsmc.com

austriamicrosystems AG C35 1.2 Model Checklist

Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@
austriamicrosystems.com

  S35 1.2 Model Checklist
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@
austriamicrosystems.com
  H35 1.2 Model Checklist
Thomas Moerth
(T)43-3136-500-5154 (E)thomas.moerth@
austriamicrosystems.com
X-FAB
Semiconductor Foundries
XH035, XC06, XC018, XH018 1.2

Model Checklist
(need customer account)

Model Checklist Support Contacts
DesignCon 2009 True Circuits TSMC MagnaChip SAP Cadence Design Systems, Inc.
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