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3D Integration Survey

Part 1 : Your Motivation & Plans for 3D Integration:

1. Would you be interested in using 3D technology with Through Silicon Vias (TSV) over the next few years if these could provide the most solid way to advance technology at your company?
 
YES NO
2. For which applications do you consider using 3D/TSV technology?
 
Cell phone Camera / Camcorder Netbook GPS
Others
3. If so, would you be willing to participate in prototype project work?
 
YES NO
4. What would be your primary drivers for considering 3D/TSV technology? Choose the three most important:
 
Low power Higher reliability
Better performance Smaller die sizes
Lower cost Smaller footprint
Lower weight Other
5. What types of products would you target for this 3D/TSV technology? Check all that apply.
 
Memory only FPGA & Memory
Memory & Logic FPGA, Memory, and Logic
Memory, Logic, and analog Logic, Memory, Sensor
Memory, Logic, and RF Other combinations
6. Which packaging technology would you prefer for 3D technology integration? Check all that apply.
 
Flip Chip/Direct chip attach POP
BGA Other(s)
7. Would you plan to integrate passive components in your 3D packages? Check all that apply.
 
None Resistors
Capacitors Other
Inductors    
8. How many layers of stacked die would you be willing to use? Check all that apply.
 
2 4 6
3 5 Up to
9. Would you initially engage with a 3D/TSV Design Service?
 
YES NO
10. Are there any additional modeling tools, design tools or other considerations that are important to you?
 

part 2: Your ability to contribute to a 3D/TSV working group

11. Do you already have a significant investment in 3D/TSV design?
 
YES NO
  If yes, what can you share with us / contribute to the working group?
 
12. Can you allocate an EDA expert, engaged in 3D challenges, to work part-time with the GSA EDA 3D Working Group?
 
YES NO
  If yes, how many hours a month can he/she contribute to the 3D Integration working group?
 
13. Which EDA vendors would you want to see as participants in this working group?
 
Synopsys Cadence Mentor Magma
Other

part 3 : Your preferences & recommendations for 3D/TSV tools

14. Do you plan to use:
 
Via First Technology Via Last Both
15. EDA vendors / tools for 3D/TSV modeling
16. Planning & partitioning for technical and cost trade-offs
17. 3D design implementation tools for low power synthesis, P&R
18. 3D design verification tools for timing, noise, SI, MI, power, temperature, DRC, LVS
19. 3D testability tools & methodologies
20. Other essential tools needed for 3D/TSV design
21. Other items you would like to address in the 3D/TSV Working Group:
 

Thanks for your feedback!

Herb Reiter, Chair of the GSA's EDA Interest Group
1.650.960.8578

Contact Information

This information is optional, unless you'd like us to contact you about participating in the 3D/TSV working group.

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