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Packaging Survey

GSA is addressing the proposed changes to RoHS and is looking for your feedback on how these exemptions will affect your business. The exemptions are due to expire in 2014.

Based on the feedback we receive, GSA invites all survey participants to join our GSA Packaging Interest Group, chaired by Tom Gregorich, VP, IC Package Engineering, QUALCOMM.

How will the following exemptions impact your business? Select significant, moderate, minor or no impact.

  Degree of Impact: Significant Moderate Minor None
1. How will your your packaging operations be impacted by the elimination of RoHS Exemption 5 - Lead in Glass of Cathode Ray Tubes, Electronic Components and Fluorescent Tubes?
2. How will your your wafer fabrication, package and assembly or customer SMT operations be impacted by the elimination of RoHS Exemption 7a - Lead in High Melting Temperature Type Solders (i.e., Lead-Based Alloys Containing 85% by Weight or More Lead)?
3. How will your your customer's SMT operations (Design, materials, processes) be impacted by the elimination of RoHS Exemption 7b - Lead in Solders for Servers, Storage and Storage Array Systems, Network Infrastructure Equipment for Switching, Signaling, Transmission as well as Network Management for Telecommunications?
4. With the elimination of RoHS Exemption 7c - Lead in Electronic Ceramic Parts (e.g. piezoelectronic devices), how will your packaging operations be impacted?
5. With the elimination of RoHS Exemption 11 - Lead Used in Compliant Pin Connector Systems, how will your packaging and assembly operations be impacted?
6. How will your packaging operations be impacted by the elimination of RoHS Exemption 12 - Lead as a Coating Material for the Thermal Conduction Module C-Ring?
7. With the elimination of RoHS Exemption 14 - Lead in Solders Consisting of More Than Two Elements for the Connection Between the Pins and the Package of Microprocessors with a Lead Content of More Than 80% and Less than 85% by Weight - to what degree will your customer SMT operations be impacted?
8. With the elimination of RoHS Exemption 15 - Lead in Solders to Complete a Viable Electrical Connection Between Semiconductor Die and Carrier within Integrated Circuit Flip Chip Packages - how will your wafer fabrication, package, assembly or customer SMT operations be impacted?
9. How will your business impacted by the elimination of RoHS Exemption 23 - Lead in Finishes of Fine Pitch Components Other Than Connectors with a Pitch of 0.65 mm or Less with NiFe Lead Frames and Lead in Finishes of Fine Pitch Components Other Than Connectors with a Pitch of 0.65 mm or Less with Copper Lead Frames - impact your assembly operations?
10.

Please tell us about any other packaging issues or concerns that you feel GSA should address.

        

Contact Information

If you would like to participate in GSA's Packaging Interest Group focusing on RoHS concerns, please submit your name, company, title and email address.

First Name
Last Name
Title
Company
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