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3D-IC Working Group—Tool Support Needed, But “Gaps” May Be Narrowing

Where are the gaps in 3D-IC design, and how can they best be bridged? In order to provide a cost-effective alternative to silicon process scaling, work is still needed in 3D-IC design tools and methodologies, according to presenters at a recent meeting of the Global Semiconductor Alliance (GSA) 3D-IC Packaging Working Group.

Read the full article here.

 

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