Adexa is a leading provider of S&OP and supply chain planning solutions for the semiconductor industry. Adexa’s customers include 17 of the top 25 global high tech companies and almost 90% of the foundries worldwide including the largest. Adexa’s solutions were designed to handle the complexities of both fabless and foundry operations using its unique Attribute-Based Planning™ architecture.

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ams sensor solutions take sensing to the next level by providing a seamless interface between humans and technology. We enable our customers to create highly differentiated products that are smarter, safer, easier to use and more eco-friendly. We develop high-performance solutions for the most challenging applications in sensors, sensor interfaces, power management and wireless. Experience the seamless interface between humans and technology.

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Armanino is a Certified Microsoft Dynamics 365 ERP and CRM Partner with a reputation for developing innovative solutions for semiconductor and fabless semiconductor manufacturers to address industry specific manufacturing, accounting and supply chain needs. Let us bring our industry knowledge, strategic insight and expertise to your next project.

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Alongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging and System-in-Package solutions to meet growth momentum across a broad range of end markets. For more about our advances in SiP, WLP, MEMS, Flip Chip, and, 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: www.aseglobal.com

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Data I/O Corporation (NASDAQ: DAIO) is the leading global provider of advanced data and security programming solutions for flash, flash-memory based intelligent devices and microcontrollers for automotive, Internet-of-Things, medical, wireless, consumer electronics, industrial controls and other markets. Data I/O ‘s solutions reliably, securely, and cost-effectively embed security roots-of-trust early in manufacturing for firmware integrity, enable a supply chain of trust and deliver their Intellectual Property into programmable devices.

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EAG Laboratories is a recognized leader in electronics testing, failure analysis and materials characterization.  Through multidisciplinary science and engineering, we help the world’s leading technology companies translate ideas into commercial realities, equipment and component manufacturers improve processes and products, and global electronics giants protect their brands. Ask EAG. We Know How. 

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EquipIC supply chain provides turnkey ASIC services for fabless semiconductor companies and ‘system houses’. Headquartered in The Netherlands and operating internationally, we have been active in the IC market since 2002. Our services include manufacturing, test and assembly from IC prototype, through to full volume production. If required, we can also provide design services.

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ESD-Alliance, an international association of companies providing goods and services throughout the semiconductor design ecosystem, is a forum to address technical, marketing, economic and legislative issues.  It is the central voice to communicate and promote the value of the semiconductor design industry as a vital component of the global electronics industry.

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Flex Logix provides EFLX embedded FPGA to increase the ROI and life of chips by enabling them to be customized and to update critical features in-system.  Applications are IoT, MCU, SoC, Networking, Data Centers, Wireless Base Stations and Aerospace/Defense.  EFLX embedded FPGA is proven in silicon now in TSMC 40, 28 and 16nm and is available in any size from 100 to 100K LUTs, with options for MACs and RAM.

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Imec’s IC-link division connects innovators and entrepreneurs to the leaders in semiconductor technology. Our ASIC Services team provides foundry manufacturing support across the entire prototype and production supply chain. We provide customers with professional technical support, ASIC prototyping, productization and volume production, including packaging, qualification and test.

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Integra Technologies, now in its 34rd year, provides semiconductor production testing (wafer probe and final test), qualification, and related technical services to manufacturers and users of semiconductor devices. We supply every post wafer fabrication service need to deliver a finished IC to your end customer including: Test Development, Characterization, Wafer Probe, Packaging, Final Test, and Qualification/Reliability services.

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MOSIS is a low-cost prototyping and  volume production Foundry service which enables it’s worldwide clients to minimize time to market for new semiconductor products.  MOSIS provides designers with a single interface to the constantly changing technologies and options available from the semiconductor industry. Wafer fabrication, test  and device packaging are contracted to leading industry partners.  In addition to MPW (multi project wafer) services MOSIS provides dedicated  Engineering runs  and wafer volume production across a broad range of Foundry technologies ranging  from 0.5um to 14nm.

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Nanotronics designs and manufactures autonomous microscopes to enhance existing inspection and process control equipment. nSpec® is used by many of the world’s leading semiconductor, electronics, advanced material, and aerospace manufacturers. nSpec® is powered by advanced computer vision, machine learning, and artificial intelligence software.

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nepes has proven to be an industry leader. With a semiconductor portfolio involving bumping, WLP (Wafer Level Packaging), and FOWLP (Fan-Out WLP) patented in Korea and the United States, nepes has become a company that identifies customer needs and meets them in the rapidly growing IoT market. nepes is driven to be the world’s leading semiconductor company by making its best efforts to become a successful partner with its customers.

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Silicon Release Solutions is a focused business group within Teradyne’s world-class Global Services Organization (GSO). It enables fabless companies of any size to get-to-market and get-to -profit quickly with a unique and comprehensive model offering expert support for any integrated circuit (IC) technology.

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UTAC Holdings Ltd and its subsidiaries (“UTAC”) is a leading independent provider of assembly and test services for a broad range of semiconductor chips with diversified end uses, including in-communications devices (such as smartphones, Bluetooth and WiFi), consumer devices, computing devices, automotive devices, security devices, and devices for industrial and medical applications. We offer our customers a full range of semiconductor assembly and test services in the following key product categories: analog, mixed-signal and logic, and memory.

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