overview

GSA Unites Leaders | Leaders Ignite Change

The Global Leadership Summit (GLS) is GSA’s flagship event that occurs every two years in an international metropolis. This year, the event will take place in Shanghai, China. What makes GLS so unique is that it is a truly international event, attracting industry executives from across the globe for a day of thought leadership and discussion. 2018 GLS is honored to invite more than 80 outstanding companies, with over 45 % of industry C-level leaders.

The theme of this year’s event is “Enabling Future, from semiconductors to systems”, in which we will discuss how the trend of semiconductor development is becoming increasingly integrated with the system designs, and how the future systems are requiring new semiconductor to realize the exciting innovations. We will examine how this trend will impact the industry technically and business wise. So please join us on May 16th, 2018 at The Peninsula Shanghai for the day and take advantage of this rare opportunity to meet and network with your peers from around the globe, and be sure to carry these discussions over to the always-anticipated evening reception and VIP dinner at Sun Chateau on the Bund.

Sincerely,

jodi-signature

Jodi Shelton
Co-Founder and President
Global Semiconductor Alliance

Program

Speakers

Registration

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attendees
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Rupert Baines

CEO

UltraSoC Technologies Ltd.

Rupert is the CEO of UltraSoC, developing semiconductor IP that helps people develop complex SoCs. This IP helps give rich insight into the performance & operation of SoCs, addressing problems of systemic complexity, performance optimization, and for security or functional safety.

He a 30-year veteran of the global semiconductor industry. He previously held senior roles in both start-ups and prominent international companies in UK, USA and Europe. Before joining UltraSoC he was VP of Strategic Marketing at Mindspeed following that companys acquisition of Picochip (now part of Intel), where he had been VP of Marketing and pioneered the launch of Small Cells.

He has also worked at first:telecom (acquired by Atlantic Telecom for $880M), Pond Ventures (a leading early stage VC fund), Arthur D Little and Analog Devices, where he played a key role in the development and mass-market adoption of DSL.

Rupert has a BSc from Hull University, an MBA from IESE and is a Fellow of the IET.


Sam Baker

Greater China Lead

Accenture

Sam Baker is an industry consultant and a managing director in the Communications, Media & Technology operating group in Greater China with more than 25 years in the IT and high tech industries worldwide. Prior to joining Accenture, he led Industry 4.0 and Big Data initiatives in Foxconn. He joined Foxconn from Samsung Electronics where he was a VP of Sales and Marketing in the IT and Mobile Communications business unit. Previously, he was a VP in the Communications Sector and a Director in the Microelectronics division at International Business Machines (IBM).


Bami Bastani

Sr. VP, RF Business Unit

GLOBALFOUNDRIES

Dr. Bami Bastani has over three decades of high-tech industry experience, including component to system-level RF enterprises and digital SoC companies. He has held the position of President, CEO, and board member in the mobility, consumer, and broadband markets.

Dr. Bastani is the Senior Vice President, RF Business Unit for GLOBALFOUNDRIES.

Prior to joining GLOBALFOUNDRIES, he was President, CEO, and board member of Meru Networks, a global enterprise-grade Wi-Fi networks solution provider.

Dr. Bastani served as President, CEO and Board member for Trident Microsystems, Inc., a global semiconductor company with primary products in Smart Set Top Box and Smart TV SoCs. Dr. Bastani also served as President, CEO, and board member, for ANADIGICS Inc.,focused on RF solutions for the mobility and broadband markets.

Prior to ANADIGICS, Dr. Bastani served in leadership positions at Fujitsu Microelectronics as EVP for System LSI Group, at National Semiconductor as VP and GM of Embedded Technologies Division, VP of Memory Products Division, and VP of Technology Development, and at Intel Corporations Memory and Microprocessor Technology Development organization.


Gunjeet Baweja

Managing Director, Global Head of Semiconductors and Electronics

Jefferies Group LLC

Gunjeet Baweja is a Managing Director in the Technology Investment Banking Group at Jefferies and Global Head of Semiconductors and Electronics. He has 26 years of experience in investment banking and technology. Prior to Jefferies, Gunjeet was with Needham & Company as Co-Head of M&A. At Needham, he completed over 100 M&A sell-side and buy-side transactions, IPOs, public financings and advisory assignments for public and private companies. He also worked at Intel corporation for seven years with positions in strategic marketing and microprocessor design. Gunjeet holds a BE in Electronics Engineering from M.S. University, India, a MS in Electrical Engineering from Virginia Tech, and an MBA from University of California, Berkeley.


Leopold Beer

Regional President, Asia Pacific

Bosch Sensortec GmbH

Leopold Beer is the Regional President of the Asia Pacific for Bosch Sensortec. With a specialization in semiconductor physics, he started his professional career as an engineer in the DRAM plant of Siemens Semiconductors in Regensburg /Germany in 1994. After the spin-off of Infineon from the Siemens Group, Leopold held various managerial positions within the Infineon Manufacturing Division.

Leopold joined Bosch Sensortec shortly after its foundation in 2006 as Director Sales and later became Head of Global Marketing and Product Planning. Since March 2013 he holds the position of Regional President for Asia Pacific and is based in Shanghai/China.


Paul Boudre

Chairman & CEO

Soitec SA

Since 2015, Paul Boudre has been chief executive officer and board member of Soitec, a world leader in designing and manufacturing innovative semiconductor materials. He joined the company in 2007 as executive vice president of sales, marketing and business development, focusing on new market opportunities and building the silicon-on-insulator (SOI) ecosystem to enable SOI adoption for consumer and More Than Moore applications.

Besides leading Soitec, Paul Boudre serves on the boards of directors for FOGALE nanotech, a leader in advanced metrology solutions; Exagan, a producer of gallium-nitride power switches; AENEAS, the Association for European NanoElectronics Activities; and the SOI Industry Consortium, an international organization that he played a role in launching in 2007 to promote understanding, development and adoption of SOI-based technologies. He also is a member of the European Advisory Board of SEMI, the global industry association serving the electronics manufacturing supply chain.

During his more than three decades in the global semiconductor industry, Paul Boudre spent nearly 10 years at KLA-Tencor, one of the worlds top five semiconductor equipment manufacturers. He first managed the companys European operations and subsequently was named executive vice president for both the U.S. and Europe. In addition, he has managed industrial operations for IBM Semiconductor, now part of GlobalFoundries; STMicroelectronics; Motorola Semiconductor, now part of NXP Semiconductors; and Atmel.

He holds a graduate degree in chemistry from Frances Ecole Nationale Suprieure de Chimie de Toulouse.


Dr. Raik Brinkmann

Co-Founder, President and CEO

OneSpin Solutions GmbH

Dr. Raik Brinkmann, co-founder of OneSpin Solutions, was named president and CEO in May 2012, with overall responsibility for leading the company and its business growth worldwide. He brings to this role more than 15 years of broad expertise in management, verification and industrial R&D, having served at companies in both Europe and the U.S.

Previously, as vice president of OneSpin's software development, he successfully turned the company's fundamental scientific and engineering innovations into state-of-the-art, award-winning EDA tools. Earlier, he was intimately involved in planning and implementing OneSpin's spin-off from Infineon Technologies in 2005. Prior to OneSpin, Brinkmann worked in the formal verification group at Infineon Technologies in Munich. Previously, at Siemens, he conducted industrial research projects on formal verification at the company's Corporate Research Labs in the U.S. and Germany. He began his career in the systems verification group at Siemens Public Communication Networks, and later focused on hardware emulation, formal verification and systems-on-a-chip design.

Dr. Raik Brinkmann holds a Diplom Informatiker (equivalent to a master's degree in computer science) from the Clausthal Technical University, Germany and a Dr.-Ing. (equivalent to a Ph.D. degree) from the Department of Electrical Engineering at the University of Kaiserslautern, Germany.


Marc Canel

VP, Security Technologies

ARM, Inc.


Kimi Cao

Greater China Marketing Lead

Accenture


Dr. Chi-Ming Chang

President

Ardentec Corporation

Dr. Chi-Ming Chang is Co-Founder, President and Vice Chairman of Ardentec Corporation in Taiwan, R.O.C. Dr. Chang also serves as the Chairman of Ardentec Nanjing Co., Ltd. He was the founding Chairman of Ardentec Singapore (2006 2011) and founding Representative Director of Ardentec Korea (2010 2011).

Prior to co-founding Ardentec Corporation in 1999, he was with Vanguard International Semiconductor Corporation as a division director responsible for product manufacturing engineering and then for operations planning and control and was with ERSO/ITRI as a deputy division director for R&D wafer fab operations management. Dr. Chang received his Ph.D. and MSIE degrees in 1986 and 1983 respectively from Texas Tech University. Before joining the submicron process technology development program at ERSO/ITRI in Taiwan in 1990, he was an assistant professor at Louisiana Tech University.

Dr. Chang received Outstanding Award in Technology Programs by Ministry of Economic Affairs of R.O.C. in 1995, Distinguished Engineer Award by Texas Tech University in 2009, and the Industrial Engineering Medal by Chinese Institute of Industrial Engineers (Taiwan) in 2009 and Fellow honor in 2012. Dr. Chang also received Golden Merchant Award from the General Chamber of Commerce of R.O.C. in 2011. Dr. Chang serves as a member of Board of Directors at the Taiwan Semiconductor Industry Association (TSIA) (2017 present).


Roger Chang

President

Applied Materials, Inc.

Roger TH Chang

Country President, Applied Materials China
General Manager, China Account, Semiconductor Product Group
Appointed Vice President, Applied Materials, Inc.



Roger TH Chang is appointed vice president and account general manager for China Account in the Semiconductor Product Group, and serves as country president for China. He is responsible for the formulation of sustainable growth strategy and management of Applied Materials regional business units and support functions in China, and elevating corporate reputation and leadership in this critical market by enhancing relationships with the government, customers and other partners in the Chinese semiconductor, display, and energy industries.

Roger TH Chang has been with Applied Materials for over 20 years and bringing to this role a wealth of global leadership in customer and product support based on his previous working and management experience in Mainland China, Japan, and Taiwan.

Roger TH Chang holds a Bachelor of Science degree in material science and engineering from Tsinghua University in Taiwan, and an EMBA degree from Taiwan University.


Clement Chen

SVP

Semiconductor Manufacturing International Corporation (SMIC)


Feng Chen

Chief Marketing Officer

Fuzhou Rockchip Electronics Co., Ltd. (Rockchip)


Hao Chen

VP Sales and Marketing

Hangzhou C-SKY Microsystems Corp. LTD.


Jeffrey Chen

ASE GROUP Member of the Board

Advanced Semiconductor Engineering, Inc. (ASE Group)

Jeffrey Chen is on the Board of ASE Group and also General Manager of ASE China headquarters, He has spent past 24 years at ASE Inc. at various position including the head of President office, CFO of ASE Test Limited, Special Assistant to the Chairman, and the Chief of Staff. Prior to joining ASE Inc., he worked as a Vice President in the corporate finance department at Bankers Trust in Taipei. He holds a master's degree in business administration from the University of British Columbia in Canada.


Lingzhi Chen

Vice President

Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET)

RebeccaLZchen, Ph.D
VP of JCET group sales management, obtained Ph.D in particle physics from Nanjing University in 2007.
From Jan.2015 to Dec.2017, she had been working as GM in MISpak which is spun off from JCET.
Before working in Mispak: GM of MIS material business center in JCET.
From July 2012 to Mar.2014: director of corporate R&D center in JCET, responsible for MIS material & packaging technology development.
From July 2009 to July 2012, she was responsible for government-funded project management in JCET.
Additionally, she is associate general secretary of NAAT and CSIA IC chapter. she is one of the authors of book" Chinese technology roadmap of IC packaging and test industry chain". And hold about 20+ patents, published several papers and gave talks in ICEPT, Semi CSTIC conferences and so on.


Dr. Roawen Chen

Sr. VP, Global Operations

QUALCOMM Incorporated

Dr. Roawen Chen is currently Senior Vice President of Global Operations at Qualcomm. In this role, Roawen oversees the worldwide operations including supply chain management, silicon and package technology, product and testing engineering, quality and reliability, module engineering, procurement, and Asia operation functions for Qualcomm semiconductor business, the largest one in fabless semiconductor industry.
He has overall responsibility for driving the global manufacturing operation to support >$20 billion annual revenue with one of the most complex and dynamics supply chain supported almost entirely by fabless model.

Roawen is an experienced leader in semiconductor industry with diversified background in playing leading roles in multiple functions. In addition to his strong technical depth, he has proven experience in building fabless global supply chains and driving large organization to support high volume production. Prior to Qualcomm, Roawen was Vice President of Manufacturing Operations at Marvell Semiconductor in Santa Clara, California. Additionally, Roawen held a variety of leadership roles, including Vice President and General Manager of the Communications and Computing business unit and Vice President and General Manager of the Connectivity business unit, during his tenure in Marvell.

Prior to Marvell, Roawen held technical and business positions at Intel and TSMC-US. He earned a bachelors degree in Physics from Tsing-Hua University in Taiwan and a PhD in Electrical Engineering and Computer Science from the University of California, Berkeley. He served the Board of Directors at Global Semiconductor Alliance and a number of non-profitable organizations.


Roawen Chen

Senior Vice President of Global Operations

Qualcomm

Dr. Roawen Chen is currently Senior Vice President of Global Operations at Qualcomm. In this role, Roawen oversees worldwide operations including supply chain management, silicon and package technology, product and testing engineering, quality and reliability, module engineering, procurement, and Asia operation functions for Qualcomm semiconductor business, the largest in the fabless semiconductor industry.
He has overall responsibility for driving the global manufacturing operation to support more than $20 billion annual revenue with one of the most complex and dynamic supply chains, supported almost entirely by a fabless model.

Roawen is an experienced leader in the semiconductor industry with a diversified background playing leading roles in multiple functions. In addition to his strong technical depth, he has proven experience in building fabless global supply chains and driving large organizations to support high volume production. Prior to Qualcomm, Roawen was Vice President of Manufacturing Operations at Marvell Semiconductor in Santa Clara, California. Additionally, Roawen held a variety of leadership roles, including Vice President and General Manager of the Communications and Computing business unit and Vice President and General Manager of the Connectivity business unit, during his tenure in Marvell.

Prior to Marvell, Roawen held technical and business positions at Intel and TSMC-US. He earned a bachelors degree in Physics from Tsing-Hua University in Taiwan and a PhD in Electrical Engineering and Computer Science from the University of California, Berkeley. He served the Board of Directors at Global Semiconductor Alliance and a number of non-profit organizations.


Aden Cheng

CEO

SILEAD INC.


Prof. Patrick Chiang

Co-Founder & CTO

PhotonIC Technologies

Patrick Chiang received the B.S. degree in electrical engineering and computer sciences from the University of California, Berkeley, and the M.S. and Ph.D. degrees in electrical engineering from Stanford University. He is a tenured associate professor (on-leave) at Oregon State University, and a 1000-Talents Young Foreign Experts professor at Fudan University in Shanghai, China.

He is currently CTO and co-founder of PhotonIC Technologies, a mixed-signal fabless semiconductor startup based in Shanghai, China.
He is the recipient of a 2010 Department of Energy Early CAREER award and a 2012 NSF-CAREER award for energy-efficient interconnects and robust near-threshold computing, and has published more than 150 conference/journal publications. He leads an international team in both China/USA on energy-efficient microelectronics, focusing specifically on optoelectronic communications and sensing.


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