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5G所向 价值所往— 2020紫光展锐春季线上发布会全视角解读

紫光展锐发布会都发布了哪些新品? 5G、物联网和AIoT 紫光展锐一网打尽 5G所向 价值所往— 2020紫光展锐春季线上发布会全视角解读 全球领先的移动通信及物联网核心芯片供应商紫光展锐26日成功举办了主题为“5G所向 价值所往”春季线上发布会,宣布了一系列重磅产品的发布。 发布会上,紫光展锐首席执行官楚庆从消费电子、工业电子、泛连接三大业务阐述了“新展锐”布局规划,分享了在5G机遇下,紫光展锐引领其商业价值落地的各项举措,通过不断增长的技术产品组合以及联合强大的生态合作伙伴,推动产业链的共同创新和成长。 来自中国联通、海信、中国移动、台积电、是德科技等行业具有影响力的企业高层代表,围绕如何加速5G创新技术应用、赋能行业与商业价值,分享了各自的重要观点和看法。 加速5G商用落地 搭载展锐5G芯片的多款5G终端震撼来袭 5G商用时代的到来,对于我国经济社会发展和人民生活改善有着重要影响。2020年将有数十款基于紫光展锐芯片的5G终端实现商用。其中就包括此次发布会推出的联通5G CPE VN007和海信5G手机F50。 联通5G CPE VN007是紫光展锐联合中国联通合力打造的最新5G商用终端,搭载春藤V510,定位千元旗舰首选,是全球首款VoNR 以及eSIM和实体卡双支持的5G CPE,引领广大消费者进一步迈向万物互联的智慧世界。 此外,紫光展锐还联合海信发布的首款5G手机F50也正式推出,该手机搭载的是紫光展锐首款5G解决方案—虎贲T7510,它由展锐5G基带芯片春藤V510+虎贲T710应用处理器组合而成。这是紫光展锐和海信在5G终端方面通力合作上的一大突破,对于推进5G手机商用有着重要意义。 全新5G SoC移动平台 虎贲T7520重磅发布 作为此次发布会的重磅新品,全新的5G SoC移动平台—虎贲T7520是紫光展锐在5G上的再次出击,在技术工艺、通信能力、AI、视觉能力、续航能力、安全性六大方面表现惊艳。 先进的6nm EUV工艺:多层极紫外(EUV)光刻技术加持,工艺光源波长缩短到5nm,接近X射线的精度带来了极高的光刻分辨率,使芯片的成本、性能和功耗达到了更好的平衡。相比上一代7nm,6nm EUV晶体管密度提高了18%,这将使芯片单位面积内集成更多的晶体管,芯片功耗降低8%,可提供更长的续航时间。 功耗再创新低:紫光展锐新一代的低功耗设计架构,以及基于AI的智能调节技术,与分离式5G方案相比,虎贲T7520无论是在轻载还是重载场景下,功耗优势全面领先,在部分数据业务场景下的功耗降低了35%。 全球首款全场景覆盖增强5G调制解调器(1):支持5G NR TDD+FDD载波聚合,以及上下行解耦技术,可提升超过100%的覆盖范围。基于紫光展锐创新的5G超级发射技术,可为小区近点提升60%上传速率,解决了增强VR、4K/8K超高清视频直播等业务需要更大上行带宽的痛点。虎贲T7520支持 Sub-6GHz 频段和NSA/SA双模组网,支持2G至5G七模全网通,在SA模式下,下行峰值速率超过3.25Gbps。虎贲T7520还支持领先的双卡双5G以及EPS Fall back、VoNR高清语音视频通话。 强大的AI能力和无尽的开发空间:虎贲T7520集成新一代NPU,相比上一代平台,算力大幅度提升,同时通过创新的架构设计,虎贲T7520在算力提升的同时,实现了优异的功耗控制,能效(TOPS/W)相对上一代产品提升超过50%。创新的设计可更好的支持高性能、低功耗模式下的复杂AI应用。 全面增强的多媒体处理能力:虎贲T7520搭载紫光展锐自主研发的第六代影像引擎Vivimagic解决方案和第二代FDR ( Full Dynamic Range ) 技术,专用AI加速处理器,全新升级的四核ISP架构,高达一亿像素的超高分辨率和多摄处理能力,结合安奇逻辑(ACUTElogic)领先的影像技术,将为拍照和摄像提供出类拔萃的效果。 虎贲T7520采用全新一代多核显示架构,最高支持120Hz的刷新率,全通路、全格式HDR标准渲染能力,多屏显示最高可支持4K HDR 10+,将极大提升用户在高帧率类竞技游戏、5G超高清视频观影、AR/VR等视觉沉浸式场景上的体验。 全内置金融级安全:虎贲T7520采用了展锐第二代集成安全方案。该方案将金融级iSE安全单元集成在SOC中,相较外置SE,更难攻击定位,安全性更高;运算能力提升100%,支持视频加密通话等高算力安全需求;支持国际主流算法,扩展能力更为出色,并提升了存储容量,可同时支持数百个应用。虎贲T7520的高度集成化优势,大幅降低了PCB设计难度,并且降低了整机设计和制造成本,为客户带来更有竞争力的方案。 紫光展锐首席执行官楚庆表示:“虎贲T7520开发了多种先进技术,在性能全面提升的同时,功耗再创新低。除此之外,我们的架构设计开放创新,致力生态承载,未来将携手合作伙伴,共同带给用户更优异的智能体验。”   物联网领域成果丰硕 多款明星产品强势发力 5G时代,紫光展锐也十分重视物联网领域的布局。此次发布会更是一举推出了四款明星产品。 紫光展锐W307是目前全球集成度最高的4G儿童手表平台,可以达到五天以上的续航时间,采用了高精度亚米级定位方案,支持4G+Wi-Fi高清视频通话,以及LTE/WCDMA/GSM全球网络制式。W307高度集成的架构设计,与上一代平台相比,套片面积减少了30%以上,布板面积减少了20%。 春藤8910DM是全球首款LTE Cat. 1 bis物联网专用芯片,弥补了低速与高速物联网产品之间亿级市场的产品空白。它拥有四大优势: 1. 支持LTE Cat.1 bis + GSM 双模。2. 支持VoLTE+多媒体+蓝牙4.2。3. 对比Cat.4模组,尺寸缩小了30%,功耗降低了20%,部署费用降低了30%。4. 已在全球45个国家的157家运营商实现全球场测。 春藤 V5663 则是超强算力的全新AIoT解决方案,它拥有技术领先、算力强大、安全可靠、应用丰富、易于开发五大特性,。不仅拥有双核 Arm Cortex-M33 超强大脑,每一个运算速度都达到 460Mhz 以上。同时支持 WiFi 5 和 BT5 这两大低功耗连接技术,并已通过 Arm PSA 认证。 春藤V5663是一款高算力的AIoT解决方案。 它拥有超强的算力:Dhrystone性能高达2.68 DMIPS/MHz,在所有采用Arm CM33处理器的MCU中主频全球最高,算力全球最强;超强的连接:支持Wi-Fi 5和蓝牙5;超级安全:已通过ARM PSA第一阶段的安全架构认证,是国内首个通过PSA Level 1安全认证的AIoT解决方案,也即将全球首批通过PSA Level 2安全认证。 此外,紫光展锐还推出面向未来的一站式 AIoT 开发平台。该平台综合了先进的开放性架构、高性能AI边缘计算能力、丰富的开发组件,这些将切实解决AIoT应用场景的碎片化、多样化和数据安全三大挑战,有效降低开发者开发成本,缩短产品开发周期,为AIoT开发提供全行业一站式解决方案。 新的5G机遇下,未来已来。紫光展锐将以高质量高技术高价值的产品,为时代赋能。 Read More

5G所向 价值所往— 2020紫光展锐春季线上发布会全视角解读2020-03-20T11:05:25-05:00

UNISOC Spring Newsletter | Capture the Future Value of 5G

New Products Launch by UNISOC | 5G, IoT and AIoT, All at One Stop Capture the Future Value of 5G - 2020 SoC Spring Online Press Conference Newsletter On February 26, UNISOC, the leading global supplier of mobile communications chipsets and IoT chipsets, kicked off its ‘Spring Online Press Conference’ themed on "Capture the Future Value of 5G" in Shanghai. On the occasion, an array of groundbreaking products were unveiled. At the conference, Steve Chu, CEO of UNISOC, introduced UNISOC’s business plans for three sectors – consumer electronics, industrial electronics, and IoT & connectivity. Besides the initiatives that UNISOC Read More

UNISOC Spring Newsletter | Capture the Future Value of 5G2020-03-20T11:00:34-05:00

GSA welcomes DinoPlusAI as new member

We are pleased to welcome DinoPlusAI as a new member to GSA! DinoPlusAI focuses on Accelerating Inference on Edge. They build high performance computing platform for the rapidly growing AI Edge Computing market with ultra-low and deterministic latency. DinoPlusAI’s unique chip solution paired with a complete end-to-end software stack enables businesses to deploy latency sensitive applications efficiently and affordable on edge. Visit their website for more information: http://dinoplus.ai/

GSA welcomes DinoPlusAI as new member2020-03-18T13:00:23-05:00

GLOBALITY AND COMPLEXITY OF THE SEMICONDUCTOR ECOSYSTEM – ACCENTURE AND GSA STUDY

As the world’s economy has become much more dispersed and interconnected during the past two decades, the semiconductor industry remains the paragon of what a truly global supply chain looks like, how it operates, and how its players and ultimate end customers benefit. The Global Semiconductor Alliance (GSA) and Accenture have teamed up to conduct a joint study of the Globality and Complexity of the Semiconductor Ecosystem to explore the interdependencies and benefits of the cross-border partnerships required to produce semiconductors, as well as to illustrate what’s needed to keep this global ecosystem operating efficiently and profitably. Download phase 1 of this Read More

GLOBALITY AND COMPLEXITY OF THE SEMICONDUCTOR ECOSYSTEM – ACCENTURE AND GSA STUDY2020-03-16T14:37:33-05:00

Upcoming Events Update | Postponement

In light of growing concerns surrounding the COVID-19 outbreak, GSA has decided to reschedule the following upcoming events. GSA considers the health, welfare and safety of attendees our top priority and acknowledges that the recent increase in corporate & institutionally-mandated travel restrictions make it impossible to ensure the execution of quality conferences. Automotive Cybersecurity Conference | Fall 2020 Silicon Leadership Summit | Potential date of November 10, 2020 European Executive Forum | Potential date during the week of October 5-9, 2020 Global Leadership Summit | Fall 2020 We will communicate the final dates as soon as they are confirmed, and we hope you will be Read More

Upcoming Events Update | Postponement2020-03-13T09:09:51-05:00

全球半导体联盟(GSA)董事会任命三位新成员 实现持续拓展的使命

加州圣何塞(2020年2月12日)– 全球半导体联盟(Global Semiconductor Alliance,以下简称“GSA”)任命微软公司负责云硬件系统、云容量和供应链组织的副总裁Rani Borkar女士加入董事会领导层,这也是首次微软加盟GSA董事会的领导层。此外,GSA董事会领导层还增加了最受尊敬和最成功的业界领袖Microchip Technology的总裁兼首席执行官Steve Sanghi先生,以及行业资深前辈,发展迅猛的Inphi公司的总裁兼首席执行官Ford Tamer博士。随着我们迎来新的十年,GSA继续扩大其代表更广泛半导体生态系统的使命,确保组织得以多元化地代表更多来自服务、软件、系统和解决方案的新参与者。 Read More

全球半导体联盟(GSA)董事会任命三位新成员 实现持续拓展的使命2020-02-21T09:42:02-06:00

Global Semiconductor Industry Outlook 2020 Report – Part 2

According to a survey of 195 global semiconductor executives conducted by GSA and KPMG, one of the most significant factors limiting growth in the semiconductor industry is the lack of formal standards and regulations governing the development and operation of new products for 5G, IoT, and autonomous vehicles. Additionally, technology convergence and interaction in new, innovative ways is creating new opportunities and business models in the semiconductor industry. Download the latest installment of the Global Semiconductor Industry Outlook 2020 report. Part 2 of 3 highlights growth products and applications.

Global Semiconductor Industry Outlook 2020 Report – Part 22020-02-13T10:51:51-06:00

GSA & WLI launches Internship Portal

In conjunction with the Women's Leadership Initiative (WLI) and the WLI "Programs and Projects Committee for Increasing Technical Female New Hires," GSA has developed a complimentary, career-specific internship portal for college students interested in securing college or postgraduate internships in the semiconductor industry. GSA will work with universities to promote this portal and make students aware of this opportunity to attract young talent to semiconductor companies. Internship Portal Post an Internship Manage Your Listing If you're with a semiconductor company and looking to recruit top students and recent graduates for internships, please follow these links to list your internship(s). If you are not Read More

GSA & WLI launches Internship Portal2020-01-31T16:38:59-06:00

Global Semiconductor Industry Outlook 2020 Report

For the global semiconductor industry, tariffs are the nexus of the global trade issue. According to a survey of 195 global semiconductor executives conducted by GSA and KPMG, 67% of respondents expect some or all of the tariff costs to be passed onto customers. Additionally, despite the sector's 2019 under performance, leaders are optimistic and expect a resumption of growth in the semiconductor industry in 2020. Download the Global Semiconductor Industry Outlook 2020 report, the first of a series of three reports, to gain insight into the significant challenges the current trade environment presents to the semiconductor market and the associated supply chain. Read More

Global Semiconductor Industry Outlook 2020 Report2020-01-30T09:15:16-06:00

Phison Demonstrates 4-Bits Per Cell QLC SSDs with PCIe Gen 4×4 and SATA Mainstream Performance

Las Vegas, Nevada (January 8, 2020) - Phison Electronics (8299.TW), the industry’s leader in flash controller and NAND storage solutions, is demonstrating mainstream performance using 4-bits per cell QLC NAND flash controllers and SSDs at the Consumer Electronics Show 2020 (CES) in Las Vegas, Nevada. In its private suite, Phison is showcasing the addition of support for QLC NAND to its already shipping E16 PCIe Gen 4x4, E12 PCIe Gen 3x4, and S12 SATA controllers that use TLC NAND. Phison’s industry leading approach leverages highly successful controllers that were qualified by tier-1 OEMs, are in mass production now, Read More

Phison Demonstrates 4-Bits Per Cell QLC SSDs with PCIe Gen 4×4 and SATA Mainstream Performance2020-01-08T08:56:15-06:00