NEW USER
separator
Forgot
Password?
separator
separator
FacebookTwitterLinkedInYouTube
separator
Global Semiconductor Alliance Logo

GSA BLOGS

3D-IC Working Group—Tool Support Needed, But “Gaps” May Be Narrowing

By Richard Goering on August 17, 2014

Where are the gaps in 3D-IC design, and how can they best be bridged? In order to provide a cost-effective alternative to silicon process scaling, work is still needed in 3D-IC design tools and methodologies, according to presenters at a recent meeting of the Global Semiconductor Alliance (GSA) 3D-IC Packaging Working Group. Continue reading

Posted in Blogs, News | Comments Off on 3D-IC Working Group—Tool Support Needed, But “Gaps” May Be Narrowing

EDA’s Role in 2.5D/3D IC Game

EDA’s Role in 2.5D/3D IC Game
E. Jan Vardaman
A debate in the industry has centered around the 2.5D or an interposer solution as an alternative to 3D ICs with through silicon vias. As the industry discusses various solutions, the picture that emerges in the near term is the use of 3D IC in combination with an interposer solution. Continue reading

Posted in Blogs | Comments Off on EDA’s Role in 2.5D/3D IC Game

Take Five with Warren Savage

IP industry veteran Warren Savage, IPextreme, interviews GSA’s Harrison Beasley. Harrison discusses GSA’s goals and activity, as well as the technical working group he is responsible for driving. After a brief introduction of Harrison’s background, Warren’s questions dive into the … Continue reading

Posted in Blogs, News, Working Groups | Comments Off on Take Five with Warren Savage

3D IC Stacks: Myth or Fact?

Education on the possibility of heterogeneous, 3D IC stacks began several years ago. As with all disruptive technologies, hype preceded reality. Over the last few years, development has begun to match promise. This article will address current, emerging, and potential killer applications that drive 3D IC development. System level design considerations, such as assembly and test flow, and system level issues such as ESD considerations will be presented. Continue reading

Posted in Blogs, Working Groups | Comments Off on 3D IC Stacks: Myth or Fact?

The Next Cycle: Big Data-Enabled Everywhere Computing

The Next Cycle: Big Data-Enabled Everywhere Computing
Similar to being a futurist, aligning your strategy with the future is hard. Sometimes you miss the timing and magnitude of your opportunities. “Smart dust will be one of the central industries of tomorrow,” futurist Alvin Toffler told Investor’s Business Daily in December 2008[1]. Smart dust refers to tiny, wireless networks of sensors. But you could also think of the sensors as tiny chips, or even miniature robots. Continue reading

Posted in Blogs, Working Groups | Comments Off on The Next Cycle: Big Data-Enabled Everywhere Computing

IP Quality – Is it Time For an IP Consumer Reports?

IP Quality – Is it Time For an IP Consumer Reports?

By Mike Gianfagna, VP corporate marketing, Atrenta Inc.

Like many people, I’ve subscribed to Consumer Reports for years. Generally speaking, I will look at their reviews before venturing out to buy anything that costs more than $50. Sometimes, impulse buying kicks in, and then I rush back to look at the article on what I just bought to see how it fared. That creates positive validation or buyer’s remorse in about the same quantities typically. Continue reading

Posted in Blogs | Comments Off on IP Quality – Is it Time For an IP Consumer Reports?

More than Moore and 3D IC: Decoding the Code at the GSA Silicon Summit 2013

There’s probably no more fitting venue for discussing future directions for processing and packaging technology in integrated circuit fabrication than the Computer History Museum in Mountain View, CA. After all, “The mission of the Computer History Museum is to preserve and present for posterity the artifacts and stories of the information age. As such, the Museum plays a unique role in the history of the computing revolution and its worldwide impact on the human experience.” “What’s past is prologue,” right? “The child is father of the man.” Or at least that’s how the English poets (Shakespeare, Wordsworth) would have us see it. Continue reading

Posted in Blogs, News | Comments Off on More than Moore and 3D IC: Decoding the Code at the GSA Silicon Summit 2013

GSA Working Group April Blog

GSA Working Group April Blog

Second quarter working group meetings kicked off with a flourish. We held both the IP and 3D IC meetings the day before GSA’s annual Silicon Summit. Presentations and minutes can be found here. Continue reading

Posted in Blogs | Comments Off on GSA Working Group April Blog

MEMS in Medical Applications

On March 20, 2013 Alissa Fitzgerald, Founder, AMFitzgerald, gave an excellent and insightful presentation “MEMS in Medical Applications” to the GSA MEMS working group. The breadth of opportunity this application area provides, as well as the improved medical care from existing and future products are exciting for the entire MEMS and semiconductor ecosystems. Continue reading

Posted in Blogs, Working Groups | Comments Off on MEMS in Medical Applications

IoT – The Next Market Driver

Jack Browne, Marketing Guru: Fueling the Internet of Things (IOT) is the next semiconductor growth opportunity with opportunities for the billions of M2M (Machine-to-Machine) connected devices as well as the smart devices that provide the man-machine User experience. System companies offer consumer benefits by leveraging the IOT nodes; teasing out valuable information using big data, crowd sourcing and location information. One example, as shared recently by EETimes reporter Peter Clarke explored Connected Cars updating commuting conditions and drive times analyzing crowd sourced data of driver’s usage of wipers, defrosters, brakes, etc. Continue reading

Posted in Blogs, Intellectual Property | 1 Comment