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Q4 Meet-Up | Enhancements in Manufacturing
November 14, 2017 1:30 pm - 5:30 pm CST
Overview
As the industry focuses on integrating more functions onto a single chip and chip performance increases with improvements in process technologies, packaging technology and new materials have gained even greater importance. Speakers from the leading OSATs and manufacturers will talk about their latest technology in packaging, assembly, test and materials. A networking opportunity will be provided after the session.
Event Agenda
| Time | Agenda Item |
| 1:30 – 2:00 | Registration |
| 2:00 – 3:30 | Packaging, Assembly and Test Technology Session Benefits of SiP Packaging Ron Huemoeller / Corporate VP, Research & Development– Amkor Technology Next Generation Advanced Packaging Solutions John Miranda / Director of Product Technology Marketing – STATS ChipPac, a JCET Company Latest in Wafer Level Packaging Hong Xie / General Manager – FlipChip International, LLC, a division of Huatian Technology Corporation New Approach to Package Design Jawad Nasrullah / Co-Founder, President & CTO – zGlue |
| 3:30 – 4:00 | Q&A Session |
| 4:00 – 5:00 | Networking Reception |
| 5:00 – | Adjournment |