The GSA International Summit invites senior executives from the global semiconductor ecosystem for an exclusive conference to explore the pivotal role of semiconductors, which serve as the foundation of modern technology. Semiconductors have become the focal point of global economies and are central to innovation, technology, and human ingenuity. As the industry navigates unprecedented challenges and opportunities, this conference aims to strike a balance between resilience and innovation.
The GSA International Summit convenes 100+ top executives from the expanded semiconductor ecosystem for discussions and collaboration on pressing business and technology issues surrounding the industry.
The semiconductor industry is experiencing unprecedented growth as new opportunities beyond traditional markets continue to emerge. With the evolution of automotive technology, the exponential rise of generative AI applications, and the demand for high-bandwidth memory solutions for high-performance computing, the industry’s potential continues to expand.
This year’s theme, “Core to Semiconductor Infinity,” will delve into technological advancements that are enabling growth markets and driving the industry’s future. The Summit provides a unique opportunity for senior executives to engage in candid discussions and share insights that will significantly impact the future of the semiconductor industry.
VeriSilicon
Wayne Dai
Chairman, President and CEO
VeriSilicon
Dr. Wayne Dai founded VeriSilicon in August 2001 and has served as the chairman of the board of directors, President and Chief Executive Officer since then. Prior to founding VeriSilicon, Dr. Dai was the Co-Chairman and Chief Technology Officer of Celestry Technologies, Inc., an EDA company, which was acquired by Cadence Design Systems in 2002. Prior to that, he was the founder, chairman of the board of directors, and Chief Executive Officer of Ultima Interconnect Technology, Inc., one of the predecessor companies to Celestry.
Dr. Dai was the founding Chairman of the IEEE Multi-Chip Module Conference and IEEE Symposium on IC/Package Design Integration, Co-Chairman of the Program Committee of the 2010 International Green Energy Forum. He was an Associate Editor of IEEE Transactions on Circuits and Systems and an Associate Editor of IEEE Transactions on VLSI Systems. He has published more than 100 papers in technical journals and conferences and received the NSF Presidential Young Investigator Award from the President of United States in 1990. He was recognized as top ten venture-backed entrepreneurs and top ten talents of science and technology in China in 2005. He was honored with The Ernst & Young Entrepreneur of the Year in China in 2007. He won the ACE’s Executive of the Year award in 2013, the Hurun Industry Achievement Award in 2014, the APAC Innovator of the year of WEAA in 2018, and was recognized as a “Leading Pioneer” in 2018 by Shanghai Smart City Construction, 2019 Contributor of the year and 2021 Outstanding Contributor of Industry Progress of WEAA, the 2021 Sci-Tech Innovation Golden Horse Awards Outstanding Leader award, 2023 Annual Outstanding Person of China IC Industry, and High Tech Contributor of the Year of 2023 Compass Tech Award. He is currently the Vice Chairman of Global Innovation Center, the Executive Vice President of the International Union for Science and Technology Innovation, the Vice President of the China Semiconductor Industry Association IC Design Branch, the President of the China RISC-V Industry Consortium, the Vice President and the Expert Committee Member of the Automotive Electronics Industry Alliance, the President of the Shanghai Open Processor Innovation Center, the Vice President of Shanghai Integrated Circuit Industry Association, the Vice Chairman of the Expert Committee of the Shanghai IC Industry Cluster Development Promotion Institution, and the President of Berkeley Club of Shanghai.
Dr. Dai received his B.A. degree in Computer Science and his Ph.D. degree in Electrical Engineering from the University of California at Berkeley. He was a professor in the department of Computer Engineering at the University of California at Santa Cruz.
Wayne Dai
Chairman, President and CEO
VeriSilicon
Ventana Micro Systems
Balaji Baktha
Founder, President, CEO and Chairman
Ventana Micro Systems
Balaji Baktha is founder and CEO of Ventana Micro Systems. He is an experienced semiconductor executive and serial technology entrepreneur and investor with a proven track record of over 30 years in Silicon Valley. Prior to Ventana, Balaji was founder and CEO of Veloce Technologies, the world’s first 64-bit ARM based high performance processor for cloud compute, networking, storage and embedded applications, which was subsequently acquired by AppliedMicro. Before Veloce, Balaji was the VP and GM of the Communications Business at Marvell Semiconductor. Before Marvell, Balaji co-founded Platys, a startup that pioneered iSCSI and was subsequently acquired by Adaptec (now Microsemi).
Balaji is a Board Member of several startups, and a Limited Partner and Senior Advisor at several PE and venture funds.
Balaji Baktha
Founder, President, CEO and Chairman
Ventana Micro Systems
GSME
Farhat Jahamgir
Founder, President and CEO
GSME
Farhat is the founder and CEO of GSME, where he brings over 25 years of hands-on experience in the semiconductor industry. Farhat is an expert in product, test, quality, reliability, and supply chain areas covering various hi-speed communication ICs, MEMS-based and CE System-based product lines. In 2016, Farhat led Quantenna to its IPO, which paved the way for the company’s acquisition by Onsemi for a staggering $1.1 billion in 2019.
As the General Manager/Vice President of Manufacturing at Onsemi, he successfully managed the 300mm EFK Fab as well as a revenue line exceeding $2 billion. Farhat is a recognized industry leader and uses his extensive experience to drive innovation in the field of semiconductor manufacturing. He began his career after graduating with a Master of Science in Electrical Engineering from the University of Arkansas.
Farhat Jahamgir
Founder, President and CEO
GSME
Secure-IC
Hassan Triqui
Co-Founder, CEO & President
Secure-IC
Hassan Triqui is Co-Founder, CEO and President of Secure-IC, rising leader and the only global provider of end-to-end cybersecurity solutions for embedded systems and connected objects. Hassan has over 25 years of experience in the technology sector. Prior to spearheading Secure-IC’s development into a major player in embedded cybersecurity solutions, he was a former senior executive at Thales and Technicolor Thomson.
Hassan holds a Master of Science in Electrical Engineering from the Institut National des Sciences Appliquées (INSA), as well as a Master of Business Administration from Rennes School of Business.
Hassan is a pioneer, a Brittany Tech patriot, and passionate about providing solutions that generate the real trust that clients deserve.
Hassan Triqui
Co-Founder, CEO & President
Secure-IC
Intel Foundry Service (IFS)
Hong Hao
Corporate Vice President, Worldwide Business Development
Intel Foundry Service (IFS)
Hong Hao is Corporate Vice President, Worldwide Business Development for Intel Foundry Service (IFS). In this role, Hong is responsible for leading the formulation of IFS’s business development strategies and execution of worldwide customer engagement plans to grow IFS revenue and customer base. Hong brings a combination of business expertise and track record, executive leadership, and strong technical background in the semiconductor industry.
Prior to joining Intel, Hong was Sr. Vice President and Head of North America Foundry Business at Samsung, Before joining Samsung in 2008, he started his career in 1992 in microprocessor design and test at Sun Microsystems, and expanded to ASIC, semiconductor IP, and systems engineering at Silicon Graphics, LSI Logic, as well as two Silicon Valley startup companies.
Hong received his PhD and MS degrees from Stanford University and his Bachelor’s degree from the University of Science and Technology of China, all in electrical engineering. Hong holds 9 US patents and has 10 refereed technical publications.
Hong Hao
Corporate Vice President, Worldwide Business Development
Intel Foundry Service (IFS)
UNISOC
Dr. Qiwei Ren
CEO
UNISOC
Dr. Qiwei Ren received the bachelor and master degrees from Tsinghua University in 1992 and 1995 respectively, and Ph. D. from Delft University of Technology in 2002.
In 2001, he joined Philips Semiconductors in the Netherlands, worked for embedded memory development as senior designer and project leader.
In 2006, he joined the design center of Qimonda Technology in Xi’an, China, as the Design Director for DRAM product development. In 2009 he promoted the acquisition as co-founder and re-found the design center as Xi’an Sinochip Semiconductors Co. Ltd, worked as general manager. In 2015 the company was acquired again and renamed as Xi’an UniIC Semiconductors Co. Ltd. In 2018 he started to work as CEO of UNIC memory technology Co. Ltd in the same time. From 2022, he becomes the CEO of UNISOC (Shanghai) Technologies Co., Ltd..
In 2012-2017 he was part time professor in Xi’an Jiaotong University, and IEEE senior member for many years.
Dr. Qiwei Ren
CEO
UNISOC
VIP Dinner Sponsor
VIP Reception Sponsor
Shanghai, China
60 HUANGPU ROAD, HONGKOU DISTRICT, SHANGHAI 200080
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