Loading Events

2026 GSA International Summit

Event Recap

The 2026 GSA International Summit (GIS) in Shanghai was a great success, bringing together semiconductor industry leaders, innovators, and executives for an afternoon of insightful discussions and meaningful connections. From AI infrastructure to physical AI, our speakers explored the technologies and opportunities shaping the industry’s next phase of growth. Handel Jones of IBS examined how agentic AI is driving semiconductor demand, while Feng Chen of Arm China discussed the evolving value of compute in the AI era. Wayne Dai of VeriSilicon explored AI ASIC opportunities across cloud, edge, and devices. Dr. Haoli Qian of Credo and Hong Hou of Semtech addressed critical memory, connectivity, and power challenges in AI infrastructure. Dr. Youm Huh of Silicon Mitus, Rock Yang of Striding AI, and Ivan Lee of Poncan Semiconductor brought perspectives on edge AI, robotics, and connecting intelligence to the physical world. A closing panel moderated by Yu Yang of Yole Group connected these themes, with insights from Dr. Haoli Qian, Hong Hou, and Wei Wang of SITRI. The conversations continued into the evening at the VIP Reception and Dinner, where industry leaders strengthened relationships and made new connections in a warm and engaging atmosphere.

A big thank you to all our speakers, sponsors, and attendees for making GIS 2026 such a memorable event!

Executive Fireside Chat

Program

13:00

Registration

13:30 Welcome

Welcome Remarks

  • Jodi Shelton / CEO / GSA
  • Haijun Zhao / GSA BOD Member, Co-Chief Executive Officer / SMIC
13:40 Keynote

Agentic AI Factors Impacting Growth of Semiconductor Market and Activities of US and Chinese Companies in Agentic AI

Abstract: The increased adoption of agents is resulting in high growth in demand for tokens, which is resulting in strong demand for semiconductors.

The result is that there are shortages of many semiconductor products, which is expected to continue through Q1/2028. There is also growth of physical AI, including humanoid robots, smart glasses, and other areas, which has a positive impact on the semiconductor market in 2030 to 2035.

There are rapid enhancements in AI capabilities, and leadership in AI will have a major impact on competitiveness in the global economy.

  • Handel Jones / Founder and CEO / International Business Strategies (IBS)
14:10 Keynote

From Watts to Bits: Reshaping the Value of Compute and Unlocking New Industry Opportunities In the AI Era

  • Feng Chen / CEO / Arm Technology (China) Co., Ltd.
14:30 Keynote

AI ASIC in the Cloud,at the Edge, on the Device

Abstract: With the rapid advancement of AI technology, AIGC models are creating massive computing power demands for training and inference in the cloud, as well as fine-tuning and inference at the edge. Meanwhile, as on-device AI continues developing, AI is accelerating its integration into smart devices, positioning applications such as AI glasses, AI toys, AI rings, and intelligent driving as key incremental drivers of industrial growth. Compared to cloud AI, edge and on-device AI impose more stringent requirements on chip power consumption, energy efficiency, and real-time responsiveness, and these demands, along with fast-growing personal AI agents, are creating new development opportunities for AI ASICs. This presentation will outline implementation solutions and key technical specifications of VeriSilicon’s cloud, edge, and on-device AI ASIC design platforms.

 

  • Wayne Dai / Chairman, President, and CEO / VeriSilicon
14:50 Keynote

OmniConnect: Fanout Solution Addressing AI Inference Memory Wall

  • Dr. Haoli Qian / Chief R&D Officer / Credo
15:10 Keynote

The Impact of AI on Edge-Side Semiconductors

  • Dr. Youm Huh / Founder and Chairman / Silicon Mitus
15:30

Networking Break

16:00 Keynote

Networking for AI Data Centers: Breaking Connectivity and Power Walls

Abstract: Global data center capex is on a trajectory to more than $2 trillion annually by the end of the decade, driven by agentic AI, inference, and enterprise adoption. Yet the binding constraint on AI infrastructure is no longer compute — it is connectivity and power. This keynote examines the AI data center network across its four connectivity domains — scale-in, scale-up, scale-out, and scale-across — and how the mix of copper and optical solutions is evolving as data rates move from 800G to 1.6T and 3.2T. It will address the growing role of linear signal integrity (“linear when you can, retimed when you must”), which cuts interconnect power by 50–60% versus DSP-retimed architectures; the emergence of new form factors such as XPO, NPO, and CPO; and why. The talk closes with a perspective on optical I/O scaling and what a co-optimized, open ecosystem of analog, photonic, and packaging technologies means for the semiconductor industry and the AI build-out ahead.

  • Hong Hou / President & CEO / Semtech
16:20 Keynote

Striding into the era of Embodied AI – How to bring Robot to the Real World

  • Rock Yang / Co-Founder and President / Striding AI
16:40 Keynote

Beyond AI: Connecting Intelligence to the Physical World

  • Ivan Lee / Co-Founder & CEO / Poncan Semiconductor Limited
17:00 Panel

Panel – Connecting Intelligence: Semiconductor Innovation from AI Infrastructure to Physical AI

Moderator:
Yu Yang / Principal Lead Analyst, Automotives & Robotics / Yole Group
Panelists:
  • Dr. Haoli Qian / Chief R&D Officer / Semtech
  • Hong Hou / President & CEO / Semtech
  • Wei Wang, Ph.D. / Sr. Director / SITRI
17:30

Closing Remarks

17:35

VIP Reception & VIP Dinner

Speakers

MORE SPEAKERS TO BE ANNOUNCED SOON

Feng Chen

CEO

Arm Technology (China) Co., Ltd.

Haijun Zhao

Co-Chief Executive Officer

SMIC

Handel Jones

Founder and CEO

International Business Strategies (IBS)

Dr. Haoli Qian

Chief R&D Officer

Credo

Hong Hou

President & CEO

Semtech

Ivan Lee

Co-Founder and CEO

Poncan Semiconductor

Jodi Shelton

CEO

GSA

Rock Yang

Co-Founder and President

Striding AI

Wayne Dai

Chairman, President and CEO

VeriSilicon

Wei Wang, Ph.D.

Sr. Director

SITRI

Dr. Youm Huh

Founder and Chairman

Silicon Mitus Inc.

Yu Yang

Principal Lead Analyst, Automotives & Robotics

Yole Group

Sponsors

Travel

Regent Shanghai on The Bund
Regent Shanghai on The Bund

2F, REGENT BALLROOM
Shanghai,  China

60 HUANGPU ROAD, HONGKOU DISTRICT, SHANGHAI 200080

   

Please send your room booking request to Communicationcenter@regentonthebund.com and mention the Group Code: G22, shall you have any query please feel free to contact us.