2026 GSA International Summit
Event Recap
The 2026 GSA International Summit (GIS) in Shanghai was a great success, bringing together semiconductor industry leaders, innovators, and executives for an afternoon of insightful discussions and meaningful connections. From AI infrastructure to physical AI, our speakers explored the technologies and opportunities shaping the industry’s next phase of growth. Handel Jones of IBS examined how agentic AI is driving semiconductor demand, while Feng Chen of Arm China discussed the evolving value of compute in the AI era. Wayne Dai of VeriSilicon explored AI ASIC opportunities across cloud, edge, and devices. Dr. Haoli Qian of Credo and Hong Hou of Semtech addressed critical memory, connectivity, and power challenges in AI infrastructure. Dr. Youm Huh of Silicon Mitus, Rock Yang of Striding AI, and Ivan Lee of Poncan Semiconductor brought perspectives on edge AI, robotics, and connecting intelligence to the physical world. A closing panel moderated by Yu Yang of Yole Group connected these themes, with insights from Dr. Haoli Qian, Hong Hou, and Wei Wang of SITRI. The conversations continued into the evening at the VIP Reception and Dinner, where industry leaders strengthened relationships and made new connections in a warm and engaging atmosphere.
A big thank you to all our speakers, sponsors, and attendees for making GIS 2026 such a memorable event!
Executive Fireside Chat
Program
Abstract: The increased adoption of agents is resulting in high growth in demand for tokens, which is resulting in strong demand for semiconductors. The result is that there are shortages of many semiconductor products, which is expected to continue through Q1/2028. There is also growth of physical AI, including humanoid robots, smart glasses, and other areas, which has a positive impact on the semiconductor market in 2030 to 2035. There are rapid enhancements in AI capabilities, and leadership in AI will have a major impact on competitiveness in the global economy. Abstract: With the rapid advancement of AI technology, AIGC models are creating massive computing power demands for training and inference in the cloud, as well as fine-tuning and inference at the edge. Meanwhile, as on-device AI continues developing, AI is accelerating its integration into smart devices, positioning applications such as AI glasses, AI toys, AI rings, and intelligent driving as key incremental drivers of industrial growth. Compared to cloud AI, edge and on-device AI impose more stringent requirements on chip power consumption, energy efficiency, and real-time responsiveness, and these demands, along with fast-growing personal AI agents, are creating new development opportunities for AI ASICs. This presentation will outline implementation solutions and key technical specifications of VeriSilicon’s cloud, edge, and on-device AI ASIC design platforms. Abstract: Global data center capex is on a trajectory to more than $2 trillion annually by the end of the decade, driven by agentic AI, inference, and enterprise adoption. Yet the binding constraint on AI infrastructure is no longer compute — it is connectivity and power. This keynote examines the AI data center network across its four connectivity domains — scale-in, scale-up, scale-out, and scale-across — and how the mix of copper and optical solutions is evolving as data rates move from 800G to 1.6T and 3.2T. It will address the growing role of linear signal integrity (“linear when you can, retimed when you must”), which cuts interconnect power by 50–60% versus DSP-retimed architectures; the emergence of new form factors such as XPO, NPO, and CPO; and why. The talk closes with a perspective on optical I/O scaling and what a co-optimized, open ecosystem of analog, photonic, and packaging technologies means for the semiconductor industry and the AI build-out ahead.
Registration
Welcome Remarks
Agentic AI Factors Impacting Growth of Semiconductor Market and Activities of US and Chinese Companies in Agentic AI
From Watts to Bits: Reshaping the Value of Compute and Unlocking New Industry Opportunities In the AI Era
AI ASIC in the Cloud,at the Edge, on the Device
OmniConnect: Fanout Solution Addressing AI Inference Memory Wall
The Impact of AI on Edge-Side Semiconductors
Networking Break
Networking for AI Data Centers: Breaking Connectivity and Power Walls
Striding into the era of Embodied AI – How to bring Robot to the Real World
Beyond AI: Connecting Intelligence to the Physical World
Panel – Connecting Intelligence: Semiconductor Innovation from AI Infrastructure to Physical AI
Closing Remarks
VIP Reception & VIP Dinner
Speakers
MORE SPEAKERS TO BE ANNOUNCED SOON

Feng Chen
CEO
Arm Technology (China) Co., Ltd.
Feng Chen
CEO
Arm Technology (China) Co., Ltd.
Mr. Chen Feng currently serves as the CEO of Arm Technology (China) Co., Ltd., overseeing the company’s overall operations and strategic management.
As a veteran in the semiconductor industry, he possesses decades of hands-on experience and profound technical expertise in integrated circuit design. Earlier in his career at Bell Labs (USA), he pioneered R&D in mobile communication ICs and was granted multiple international patents. After returning to China in 2002, he served as Director of Design Services Department at SMIC, spearheading several national-level key R&D initiatives. Prior to joining Arm China, Mr. Chen held the position of Senior Vice President at Rockchip, where he drove significant business growth amid intense market competition.
Mr. Chen holds a Bachelor of Science in Applied Physics from Tsinghua University and a Master of Science in Electrical Engineering from Lehigh University (USA).

Haijun Zhao
Co-Chief Executive Officer
SMIC
Haijun Zhao
Co-Chief Executive Officer
SMIC
Dr. Zhao Haijun serves as Co-Chief Executive Officer of the Company. Dr. Zhao also serves as a director of certain subsidiaries and affiliated companies of the Company. Dr. Zhao has more than 30 years of experience in semiconductor operations and technology development. Dr. Zhao served as an executive Director of the Company between 2017 and 2022, and served as the Chief Operating Officer and Executive Vice President of the Company, General Manager of SMNC from 2010 to 2016. Dr. Zhao holds a Bachelor’s and a Doctor’s degree in Electronic Engineering from Tsinghua University and a Master of Business Administration (MBA) degree from the University of Chicago.

Handel Jones
Founder and CEO
International Business Strategies (IBS)
Handel Jones
Founder and CEO
International Business Strategies (IBS)
Dr. Jones has over 50 years of experience in the electronics industry. He held senior management positions at ITT and other companies. At Rockwell, he was VP of Strategic Planning, Acquisitions, International Marketing, and Engineering of the Commercial Electronics Group. As VP of Engineering at Rockwell, Dr. Jones had over 1,500 engineers reporting to him, covering communications, avionics, and semiconductors. Dr. Jones was also the President and COO of a publicly traded semiconductor company. He steered the company through a successful public offering and a key acquisition.
Dr. Jones has written various books on China, including When AI Rules the World, Artificial Intelligence: How AI and IA Reshape the Future, China’s Globalization (How China Becomes No. 1), and Chinamerica (McGraw-Hill).

Dr. Haoli Qian
Chief R&D Officer
Credo
Dr. Haoli Qian
Chief R&D Officer
Credo
Dr. Haoli Qian has over 20 years of communication system architect experience with deep knowledge and insights in mixed-signal architecture optimization. He is Credo’s Chief R&D Officer. He previously served as the company’s Vice President, Engineering. Prior to Credo, Dr. Qian was the design manager and system architect leader for Marvell Ethernet Products. He received degrees from University of Buffalo and Tsinghua University.

Hong Hou
President & CEO
Semtech
Hong Hou
President & CEO
Semtech
Dr. Hou has served as President and Chief Executive Officer of Semtech (Nasdaq: SMTC) since June 2024 and as a member of the Semtech Board of Directors since July 2023. He also serves as an independent board member of Wolfspeed (NYSE: WOLF) since September 2025. An accomplished multinational technology executive, Dr. Hou is recognized as a global enterprise leader with a strong track record of technical and business transformation in dynamic, ultra-competitive markets. He most recently served as President of the Semiconductor Group at Brooks Automation, and prior to that as Corporate Vice President and General Manager of the Cloud and Edge Networking Group at Intel Corporation (Nasdaq: INTC). He has also held executive leadership positions at Fabrinet (NYSE: FN), AXT (Nasdaq: AXTI), and Emcore (Nasdaq: EMKR), and earlier in his career held technical roles at Bell Laboratories and Sandia National Laboratories. Dr. Hou holds a Ph.D. in Electrical Engineering from the University of California, San Diego.

Ivan Lee
Co-Founder and CEO
Poncan Semiconductor
Ivan Lee
Co-Founder and CEO
Poncan Semiconductor
Ivan Lee is Co-Founder and CEO of Poncan Semiconductor, where he leads the company’s strategy and development of advanced semiconductor solutions for high-speed optical connectivity across automotive, robotics, industrial, and broadband markets.
A seasoned semiconductor executive and technology leader, Ivan spent 12 years at Marvell Technology, serving as Vice President of the Mobile Chip Business Unit, leading multiple generations of industry-leading 3G/4G smartphone chipsets, and later as Interim CTO and Vice President of Central Engineering, overseeing critical technologies, including high-speed SerDes IP for networking products.
Previously, he held VP/GM positions at UTStarcom and began his career as an IC Design Engineer at Texas Instruments. He holds an MSEE from Georgia Tech and a BSEE from University of Texas at Austin and has received multiple industry awards.

Jodi Shelton
CEO
GSA
Jodi Shelton
CEO
GSA
Jodi Shelton is the co-founder and CEO of GSA. A pioneer within the technology space, Shelton was instrumental in the creation of the Alliance and has continuously addressed global issues in the industry as the voice of its members. Under her leadership, GSA has grown its membership to include companies throughout the supply chain representing 45 countries across the globe. In her role as CEO, Shelton ensures that the Alliance remains focused on achieving its defined mission and goal to foster a more effective ecosystem through collaboration, integration and innovation. She is the key liaison between GSA and the business community at high-level financial and industry conferences, providing insight on key topics pertaining to the global fabless supply chain. Shelton earned her bachelor’s degree in political science from San Diego State University and her master’s degree in political science from the University of Houston. She received Corporate Governance program certification from Columbia Business School.

Rock Yang
Co-Founder and President
Striding AI
Rock Yang
Co-Founder and President
Striding AI
Rock Yang, Co-Founder and President of Striding AI, response for global business development, Ecosystem and commercialization. Rock has 25 years of experiences of commercialization, investment and fund raising in mobile, semiconductor intelligent vehicle and AI industry. Before joining Striding AI, Rock was Chief Marketing Officer of Black Sesame Technologies (02533.HK), in charge of Marketing, fund raising and investment, Business Development and ecosystem. Prior to Black Sesame, Rock was Board Member and Vice President of Thundersoft(300496.SZ), response for Strategy, Investment and M&A, Business Development, Marketing Communication etc., and Chairman and CEO of Arm Accelerator which was the joint venture of Thundersoft and Arm at the same time. Before Thundersoft, Rock has worked with Nufront, Arm, BDA China and Panasonic on Sales and Marketing area.
Rock graduated from Precision Instrument Department, Tsinghua University. TEEC(Tsinghua Entrepreneur and Executive Club) Member.
Wayne Dai
Chairman, President and CEO
VeriSilicon
Wayne Dai
Chairman, President and CEO
VeriSilicon
Dr. Wayne Dai founded VeriSilicon in August 2001 and has served as the chairman of the board of directors, President and Chief Executive Officer since then. Prior to founding VeriSilicon, Dr. Dai was the Co-Chairman and Chief Technology Officer of Celestry Technologies, Inc., an EDA company, which was acquired by Cadence Design Systems in 2002. Prior to that, he was the founder, chairman of the board of directors, and Chief Executive Officer of Ultima Interconnect Technology, Inc., one of the predecessor companies to Celestry.
Dr. Dai was the founding Chairman of the IEEE Multi-Chip Module Conference and IEEE Symposium on IC/Package Design Integration, Co-Chairman of the Program Committee of the 2010 International Green Energy Forum. He was an Associate Editor of IEEE Transactions on Circuits and Systems and an Associate Editor of IEEE Transactions on VLSI Systems. He has published more than 100 papers in technical journals and conferences and received the NSF Presidential Young Investigator Award from the President of United States in 1990. He was recognized as top ten venture-backed entrepreneurs and top ten talents of science and technology in China in 2005. He was honored with The Ernst & Young Entrepreneur of the Year in China in 2007. He won the ACE’s Executive of the Year award in 2013, the Hurun Industry Achievement Award in 2014, the APAC Innovator of the year of WEAA in 2018, and was recognized as a “Leading Pioneer” in 2018 by Shanghai Smart City Construction, 2019 Contributor of the year and 2021 Outstanding Contributor of Industry Progress of WEAA, the 2021 Sci-Tech Innovation Golden Horse Awards Outstanding Leader award, 2023 Annual Outstanding Person of China IC Industry, and High Tech Contributor of the Year of 2023 Compass Tech Award. He is currently the Vice Chairman of Global Innovation Center, the Executive Vice President of the International Union for Science and Technology Innovation, the Vice President of the China Semiconductor Industry Association IC Design Branch, the President of the China RISC-V Industry Consortium, the Vice President and the Expert Committee Member of the Automotive Electronics Industry Alliance, the President of the Shanghai Open Processor Innovation Center, the Vice President of Shanghai Integrated Circuit Industry Association, the Vice Chairman of the Expert Committee of the Shanghai IC Industry Cluster Development Promotion Institution, and the President of Berkeley Club of Shanghai.
Dr. Dai received his B.A. degree in Computer Science and his Ph.D. degree in Electrical Engineering from the University of California at Berkeley. He was a professor in the department of Computer Engineering at the University of California at Santa Cruz.
Wei Wang, Ph.D.
Sr. Director
SITRI
Wei Wang, Ph.D.
Sr. Director
SITRI
Wei Wang, Ph.D. from the Institute of Semiconductors, Chinese Academy of Sciences; Senior Director of Silicon Photonics at Shanghai Industrial μTechnology Research Institute (SITRI); Jointly Appointed Advisor at Shanghai University; Shanghai Overseas High-Level Talent; Expert of the Overall Expert Group for the Information Optoelectronics Special Project of the National Key R&D Program. He has been engaged in R&D of silicon-based optoelectronic processes and devices for over 15 years, and has published more than 80 papers in top international conferences and journals in this field, with over 30 national invention patents. As project/task leader, he has led multiple key and major national and municipal projects, and spearheaded the completion of the silicon photonics process platform construction at the Industrial μTechnology Research Institute as well as the company’s external silicon photonics tape-out services.
Dr. Youm Huh
Founder and Chairman
Silicon Mitus Inc.
Dr. Youm Huh
Founder and Chairman
Silicon Mitus Inc.
Dr. Youm Huh is a leading figure in the Korean semiconductor industry, with more than 40 years of experience. He is the Founder and Chairman of Silicon Mitus Inc., Honorary Chairman of the Korea Fabless Semiconductor Association (KFSA), and former Vice Chairman of the Korea Semiconductor Industry Association (KSIA). He is also a Senior Member of the National Academy of Engineering of Korea (NAEK).
Previously, Dr. Huh served as the founding CEO of MagnaChip Semiconductor, which was spun off from Hynix Semiconductor in 2004. Prior to that, he served as Corporate Executive Vice President and President of the System IC Company at Hynix Semiconductor from 1997 to 2004, and as Executive Director at Samsung Electronics from 1989 to 1994.
Dr. Huh earned his Ph.D. from Stanford University, M.S. from the Korea Advanced Institute of Science and Technology (KAIST), and B.S. from Seoul National University, all in Electrical Engineering.

Yu Yang
Principal Lead Analyst, Automotives & Robotics
Yole Group
Yu Yang
Principal Lead Analyst, Automotives & Robotics
Yole Group
Yu Yang, PhD is Principal Lead Analyst, Automotives & Robotics at Yole Group.
Based in Belgium, he is responsible for technology and market products, dedicated to the automotive industry and extending to humanoid robotics.
Prior to Yole Group, Dr. Yang worked as a business development partner and R&D project leader at Punch Powertrain (Belgium), R&D project manager at Bekaert (Belgium), and doctorate researcher at IMEC (Belgium).
Dr. Yang holds a PhD in materials engineering from Leuven University (Katholieke Universiteit Leuven) in Belgium and a master in electrical engineering and a bachelor in materials science & engineering both from Tsinghua University (China).
Dr. Yang serves in technical committees and advisory boards in multiple international conferences and events.
Sponsors
VIP Dinner Sponsor
VIP Dinner Sponsor
Under the its unique “Silicon Platform as a Service” (SiPaaS) business model, VeriSilicon is committed to providing customers with platform-based, all-around, one-stop custom silicon services and semiconductor IP licensing services leveraging its in-house semiconductor IP. For more information, please visit: www.verisilicon.com.
Platinum Sponsor
Platinum Sponsor
Semiconductor Manufacturing International Corporation (SMIC,00981.HK/688981.SH) is one of the leading foundries in the world and is the front runner in manufacturing capability, manufacturing scale, and comprehensive service in the Chinese Mainland. SMIC Group provides semiconductor foundry and technology services to global customers on 8-inch and 12-inch wafers. Headquartered in Shanghai, China, SMIC Group has an international manufacturing and service base, with 8-inch and 12-inch wafer fabrication facilities in Shanghai, Beijing, Tianjin and Shenzhen. SMIC Group also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan, China.
Platinum Sponsor
Platinum Sponsor
TSMC created the semiconductor Dedicated IC Foundry business model when it was founded in 1987. In 2023, TSMC served 528 customers and manufactured 11,895 products for various applications covering a variety of end markets including high performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. Annual capacity of the manufacturing facilities managed by TSMC and its subsidiaries exceeded 16 million 12-inch equivalent wafers in 2023.
Gold Sponsor
Gold Sponsor
Bosch Sensortec GmbH, a fully owned subsidiary of Robert Bosch GmbH, develops and markets a wide portfolio of microelectromechanical systems (MEMS) sensors and solutions tailored for smartphones, tablets, wearables and hearables, AR/VR devices, drones, robots, smart home and IoT (Internet of Things) applications. The product portfolio includes 3–axis accelerometers, gyroscopes and magnetometers, integrated 6– and 9–axis sensors, smart sensors, barometric pressure sensors, humidity sensors, gas sensors, optical microsystems and comprehensive software. Since its foundation in 2005, Bosch Sensortec has emerged as the MEMS technology leader in the markets it addresses. Bosch has been both a pioneer and one of the leading providers in the MEMS sensor segment since 1995 and has, to date, sold more than 26 billion MEMS sensors.
For more information, please visit www.bosch–sensortec.com
Travel

Regent Shanghai on The Bund
2F, REGENT BALLROOM
Shanghai, China
60 HUANGPU ROAD, HONGKOU DISTRICT, SHANGHAI 200080
Please send your room booking request to Communicationcenter@regentonthebund.com and mention the Group Code: G22, shall you have any query please feel free to contact us.