Haijun Zhao

Co-Chief Executive Officer

SMIC

Dr. Zhao Haijun serves as Co-Chief Executive Officer of the Company. Dr. Zhao also serves as a director of certain subsidiaries and affiliated companies of the Company. Dr. Zhao has more than 30 years of experience in semiconductor operations and technology development. Dr. Zhao served as an executive Director of the Company between 2017 and 2022, and served as the Chief Operating Officer and Executive Vice President of the Company, General Manager of SMNC from 2010 to 2016. Dr. Zhao holds a Bachelor’s and a Doctor’s degree in Electronic Engineering from Tsinghua University and a Master of Business Administration (MBA) degree from the University of Chicago.

Handel Jones

Founder and CEO

International Business Strategies (IBS)

Dr. Jones has over 50 years of experience in the electronics industry. He held senior management positions at ITT and other companies. At Rockwell, he was VP of Strategic Planning, Acquisitions, International Marketing, and Engineering of the Commercial Electronics Group. As VP of Engineering at Rockwell, Dr. Jones had over 1,500 engineers reporting to him, covering communications, avionics, and semiconductors. Dr. Jones was also the President and COO of a publicly traded semiconductor company. He steered the company through a successful public offering and a key acquisition.

Dr. Jones has written various books on China, including When AI Rules the World, Artificial Intelligence: How AI and IA Reshape the Future, China’s Globalization (How China Becomes No. 1), and Chinamerica (McGraw-Hill).

Hong Hou

President & CEO

Semtech

Dr. Hou has served as President and Chief Executive Officer of Semtech (Nasdaq: SMTC) since June 2024 and as a member of the Semtech Board of Directors since July 2023. He also serves as an independent board member of Wolfspeed (NYSE: WOLF) since September 2025. An accomplished multinational technology executive, Dr. Hou is recognized as a global enterprise leader with a strong track record of technical and business transformation in dynamic, ultra-competitive markets. He most recently served as President of the Semiconductor Group at Brooks Automation, and prior to that as Corporate Vice President and General Manager of the Cloud and Edge Networking Group at Intel Corporation (Nasdaq: INTC). He has also held executive leadership positions at Fabrinet (NYSE: FN), AXT (Nasdaq: AXTI), and Emcore (Nasdaq: EMKR), and earlier in his career held technical roles at Bell Laboratories and Sandia National Laboratories. Dr. Hou holds a Ph.D. in Electrical Engineering from the University of California, San Diego.

Wayne Dai

Chairman, President and CEO

VeriSilicon

Dr. Wayne Dai founded VeriSilicon in August 2001 and has served as the chairman of the board of directors, President and Chief Executive Officer since then. Prior to founding VeriSilicon, Dr. Dai was the Co-Chairman and Chief Technology Officer of Celestry Technologies, Inc., an EDA company, which was acquired by Cadence Design Systems in 2002. Prior to that, he was the founder, chairman of the board of directors, and Chief Executive Officer of Ultima Interconnect Technology, Inc., one of the predecessor companies to Celestry.

Dr. Dai was the founding Chairman of the IEEE Multi-Chip Module Conference and IEEE Symposium on IC/Package Design Integration, Co-Chairman of the Program Committee of the 2010 International Green Energy Forum. He was an Associate Editor of IEEE Transactions on Circuits and Systems and an Associate Editor of IEEE Transactions on VLSI Systems. He has published more than 100 papers in technical journals and conferences and received the NSF Presidential Young Investigator Award from the President of United States in 1990. He was recognized as top ten venture-backed entrepreneurs and top ten talents of science and technology in China in 2005. He was honored with The Ernst & Young Entrepreneur of the Year in China in 2007. He won the ACE’s Executive of the Year award in 2013, the Hurun Industry Achievement Award in 2014, the APAC Innovator of the year of WEAA in 2018, and was recognized as a “Leading Pioneer” in 2018 by Shanghai Smart City Construction, 2019 Contributor of the year and 2021 Outstanding Contributor of Industry Progress of WEAA, the 2021 Sci-Tech Innovation Golden Horse Awards Outstanding Leader award, 2023 Annual Outstanding Person of China IC Industry, and High Tech Contributor of the Year of 2023 Compass Tech Award. He is currently the Vice Chairman of Global Innovation Center, the Executive Vice President of the International Union for Science and Technology Innovation, the Vice President of the China Semiconductor Industry Association IC Design Branch, the President of the China RISC-V Industry Consortium, the Vice President and the Expert Committee Member of the Automotive Electronics Industry Alliance, the President of the Shanghai Open Processor Innovation Center, the Vice President of Shanghai Integrated Circuit Industry Association, the Vice Chairman of the Expert Committee of the Shanghai IC Industry Cluster Development Promotion Institution, and the President of Berkeley Club of Shanghai.

Dr. Dai received his B.A. degree in Computer Science and his Ph.D. degree in Electrical Engineering from the University of California at Berkeley. He was a professor in the department of Computer Engineering at the University of California at Santa Cruz.