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Q4 Meet-Up | Enhancements in Manufacturing

November 14, 2017 1:30 PM - 5:30 PM CST

Overview

As the industry focuses on integrating more functions onto a single chip and chip performance increases with improvements in process technologies, packaging technology and new materials have gained even greater importance.  Speakers from the leading OSATs and manufacturers will talk about their latest technology in packaging, assembly, test and materials. A networking opportunity will be provided after the session.

Event Agenda

Time Agenda Item
1:30 – 2:00 Registration
2:00 – 3:30 Packaging, Assembly and Test Technology Session
Benefits of SiP Packaging Ron Huemoeller / Corporate VP, Research & Development– Amkor Technology
Next Generation Advanced Packaging Solutions John Miranda / Director of Product Technology Marketing  – STATS ChipPac, a JCET Company
Latest in Wafer Level Packaging Hong Xie / General Manager – FlipChip International, LLC, a division of Huatian Technology Corporation
New Approach to Package Design Jawad Nasrullah / Co-Founder, President & CTO – zGlue
3:30 – 4:00 Q&A Session
4:00 – 5:00 Networking Reception
5:00 – Adjournment

Details

Date:
November 14, 2017
Time:
1:30 PM - 5:30 PM CST