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Powerchip Technology Corporation


No. 12, Li-Hsin Road 1     Hsinchu Science Park     Hsinchu 300 Taiwan, R.O.C.
T 886-3-5795000     F 886-3-5788565     www.psc.com.tw

General Information

  • Year Founded: 1994
  • Number of Employees: 4800

Powerchip Technology Corporation's major scope of business includes the manufacturing of memory products as well as foundry services.

Service Type

  • Wafer Foundry

Fab Details

Fab Name: Fab P1
  • Location: Hinschu
  • Technology: DRAM
  • Geometry: 0.11um to 65nm
  • Wafer Size: 12-INCH
Fab Name: Fab P2
  • Location: Hinschu
  • Technology: DRAM
  • Geometry: 0.11um to 65NM
  • Wafer Size: 12-INCH
Fab Name: Fab P3
  • Location: Hinschu
  • Technology: DRAM
  • Geometry: 65nm
  • Wafer Size: 12-INCH
Fab Name: Not Available
  • Location: Hefei
  • Technology: DRAM
  • Geometry: 0.11um to 90nm
  • Wafer Size: 12-INCH

Financials

  • Private

Mergers & Acquisitions

Lontium Semiconductor Corporation (Minority Stake)
Transaction Type: ACQUIRE
Announced Date: 2010-07-22
Payment Method: Stock

Key Management

  • Sui-Ren Huang - Founder & CEO
  • Dr. Alex Wang - President
  • Peter Chen - VP, Administration
  • Milton Hsieh - VP, Business Development
  • Lico Li - VP, Operations
  • James Liu - VP, Production Management
  • Eric Tang - VP, Investor, Public Relations and Spokeperson
  • Peter Ting - Sr. VP, Sales & Marketing
  • K.T. Tong - Sr. VP, Administration
  • Joe Wu - VP, International Sales

Updated: 2018-06-20

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