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Semiconductor Manufacturing International Corporation (SMIC)


No. 18 Zhangjiang Road     Pudong New Area     Shanghai 201203 China
T 86 (21) 3861 0000     F 86 (21) 5080 2868     www.smics.com     Sinead_Jiang@smics.com

General Information

  • Year Founded: 2000
  • Number of Employees: 17911

Social Media

Semiconductor Manufacturing International Corporation (SMIC) is a pure-play IC foundry that offers 200mm and 300mm wafer fabrication at 0.35um to 28nm.

SMIC offers a comprehensive technology portfolio comprising logic, mixed-signal/RF, high voltage, DRAM, NOR/NAND flash, eNVM (eFlash, eEEPROM, OTPROM), MEMS, PMIC and more. SMIC is committed to be a leading provider in selected differentiated technologies while continuing to invest in advanced technologies.

SMIC has manufacturing facilities in:
Shanghai: 300mm wafer fab; 200mm mega-fab
Beijing: 300mm mega-fab; a majority-owned 300mm fab for advanced nodes
Tianjin: 200mm wafer fab
Jiangyin: a majority-owned joint-venture 300mm bumping facility
Shenzhen: 200mm wafer fab under construction
Italy: a majority-owned 200mm fab

Service Type

  • Wafer Foundry
  • Outsourced Semiconductor Assembly and Test

Fab Details

Fab Name: S1
  • Location: Shanghai
  • Technology:
  • Geometry: .35um to 90nm
  • Wafer Size: 08-INCH
Fab Name: B1, Mega-fab
  • Location: Beijing
  • Technology:
  • Geometry: .18um to 28nm
  • Wafer Size: 12-INCH
Fab Name: T1
  • Location: Tianjin
  • Technology: Not Available
  • Geometry: 0.35um to 90nm
  • Wafer Size: 08-INCH
Fab Name: S2A
  • Location: Shanghai
  • Technology: Not Available
  • Geometry: 45/40nm to 28nm
  • Wafer Size: 12-INCH
Fab Name: B2A
  • Location: Beijing
  • Technology: Not Available
  • Geometry: Not Available
  • Wafer Size: 12-INCH
Fab Name: B3
  • Location: Beijing
  • Technology: Not Available
  • Geometry: Not Available
  • Wafer Size: 12-INCH
Fab Name: P2
  • Location: Shenzhen
  • Technology: Not Available
  • Geometry: Not Available
  • Wafer Size: Not Available
Fab Name: P3
  • Location: Shenzhen
  • Technology: Not Available
  • Geometry: Not Available
  • Wafer Size: Not Available
Fab Name: G1
  • Location: Shenzhen
  • Technology: Not Available
  • Geometry: .35um to 90nm
  • Wafer Size: 08-INCH
Fab Name: SN1
  • Location: Shanghai
  • Technology: Not Available
  • Geometry: Not Available
  • Wafer Size: 12-INCH
Fab Name: Fab 7
  • Location: Shenzhen
  • Technology: Not Available
  • Geometry: .35um to 90nm
  • Wafer Size: 08-INCH
Fab Name: Fab 15
  • Location: Shenzhen
  • Technology: Not Available
  • Geometry: .35um to 90nm
  • Wafer Size: 08-INCH

Financials

  • Public: HKG: 0981
  • For additional financial information for all public semiconductor companies, and select suppliers, click here:

Mergers & Acquisitions

LFoundry S.r.l.
Transaction Type: ACQUIRE
Announced Date: 2016-06-24

Key Management

  • Dr. Tzu-Yin Chiu - Vice Chairman & Non-Executive Director
  • Dr. Zixue Zhou - Chairman
  • Dr. Yonggang Gao - CFO, Exec. VP, Strategic Planning and Exec. Director
  • Mong-song Liang - Co-CEO
  • Dr. Haijun Zhao - Co-CEO and Executive Director
  • Min Hwa Chi - Sr. VP, Operations
  • Mike Rekuc - Exec. VP, WW Sales and Marketing
  • Tianshen Tang - Exec. VP, Design Service

Updated: 2018-03-07

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