Siliconware Precision Industries Co., Ltd. (SPIL)
No. 468, Sec. 5, Chung Te Rd. Tantzu Taichung 427 Taiwan, R.O.C.
T 886-4-2534-1525 F 886-4-2534-2025 www.spil.com.tw email@example.com
Established in May 1984, Siliconware Precision Industries Co., Ltd. (SPIL) has become one of the leading providers of comprehensive semiconductor assembly and test services. The company's turnkey solutions range from bumping, wafer sort, assembly, final test, to shipment. Products include advanced leadframe and substrate based packages, which are widely used in, but not limited to, computers, tablets, cellular phones, set-top boxes, LCD monitors, wearable devices, smart appliances, IoT, fingerprint sensor, smart cars, VR/AR, digital cameras and video game consoles.
The company's dedication to enhancing quality and developing technical innovations to satisfy customers' needs has made SPIL one of the top leaders in creating high value-added solutions, now recognized as the world's third largest IC packaging and testing services provider. SPIL provides services and support to fabless design houses, integrated device manufacturers and wafer foundries globally.
- Outsourced Semiconductor Assembly and Test
Mergers & Acquisitions
Transaction Type: ACQUIRE
Announced Date: 2014-08-19
Transaction Type: MERGER
Announced Date: 2009-06-26
- Bough Lin - Chairman & Exec. Vice President
- C.W. Tsai - Vice Chairman and President (CEO)
- Randy Lo - Director, Board of Directors, SPIL and President & CEO, Siliconware USA