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United Microelectronics Corporation (UMC)


No. 3, Li-Hsin 2nd Road     Hsinchu Science Park     Hsinchu 300 Taiwan, R.O.C.
T 886-3-578-2258     F 886-3-577-9392     www.umc.com/english

General Information

  • Year Founded: 1980
  • Number of Employees: 19539

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United Microelectronics Corporation (UMC) is a leading global semiconductor foundry that provides advanced technology and manufacturing services for applications spanning several major sectors of the IC industry. The company's customer-driven foundry solutions enable chip designers to leverage the strength of their leading-edge processes, which include 28nm, mixed signal/RFCMOS, and a wide range of specialty technologies.

UMC is a 300mm manufacturing leader with two advanced 300mm fabs in operation. Fab12A, in Tainan, Taiwan is currently at the production capacity of over 50,000 wafers per month, while Fab 12i, in Pasir Ris Wafer Park, Singapore is also in volume production, with capacity at 45,000 wafers per month. In addition, the company has seven 8-inch fabs and one 6-inch fab that manufactures products targeting several major sectors of the semiconductor industry.

UMC's core services as a pure play foundry involve delivering leading-edge technology through advanced research & development while providing advanced manufacturing capabilities. This includes 40nm production on 300mm wafers in fabs in Taiwan and Singapore. In addition, UMC employs a comprehensive IP program, protected by a security policy to guard the intellectual property rights of its customers and vendors.









Service Type

  • Wafer Foundry
  • Outsourced Semiconductor Assembly and Test
  • Intellectual Property (IP)

Fab Details

Fab Name: 6A
  • Location: Hsinchu
  • Technology: CMOS, NMOS
  • Geometry: 0.45um to 3.5um
  • Wafer Size: 06-INCH
Fab Name: 8AB
  • Location: Hsinchu
  • Technology: CMOS
  • Geometry: 0.25um to 0.50um
  • Wafer Size: 08-INCH
Fab Name: 8C
  • Location: Hsinchu
  • Technology: CMOS
  • Geometry: 0.11um to 0.35um
  • Wafer Size: 08-INCH
Fab Name: 8D
  • Location: Hsinchu
  • Technology: CMOS
  • Geometry: 90nm to 0.13um
  • Wafer Size: 08-INCH
Fab Name: 8E
  • Location: Hsinchu
  • Technology: CMOS
  • Geometry: 0.18um to 0.50um
  • Wafer Size: 08-INCH
Fab Name: 8F
  • Location: Hsinchu
  • Technology: CMOS
  • Geometry: 0.11um to 0.18um
  • Wafer Size: 08-INCH
Fab Name: 8S
  • Location: Hsinchu
  • Technology: CMOS
  • Geometry: 0.11um to 0.18um
  • Wafer Size: 08-INCH
Fab Name: 8N
  • Location: Suzhou
  • Technology: CMOS
  • Geometry: .5 um to 0.13um
  • Wafer Size: 08-INCH
Fab Name: 12i
  • Location: Paris Ris
  • Technology: CMOS
  • Geometry: .13um to 40nm
  • Wafer Size: 12-INCH
Fab Name: 12A
  • Location: Tainan
  • Technology: CMOS
  • Geometry: .18um to 14nm
  • Wafer Size: 12-INCH
Fab Name: 12X
  • Location: Xiamen
  • Technology: Not Available
  • Geometry: 28nm to 40nm
  • Wafer Size: 12-INCH
Fab Name: Wavetek
  • Location: Hsinchu
  • Technology: Not Available
  • Geometry: .35um to .45um
  • Wafer Size: 06-INCH

Financials

  • Public: TPE;NYSE: 2303;UMC
  • For additional financial information for all public semiconductor companies, and select suppliers, click here:

Mergers & Acquisitions

Mie Fujitsu Semiconductor Limited (MIFS)
Transaction Type: ACQUIRE
Announced Date: 2018-06-29
Payment Method: $522.2
Fujitsu Semiconductor Limited (9.3% stake in new subsidiary)
Transaction Type: ACQUIRE
Announced Date: 2014-08-29
Hejian Technology (35.7% stake)
Transaction Type: ACQUIRE
Announced Date: 2011-11-03
Payment Method: Undisclosed

Key Management

  • Stan Hung - Chairman
  • Po Wen Yen - Former UMC CEO
  • Chi-Tung Liu - CFO & Deputy GM
  • Peter Courture - Sr. Vice President & General Counsel
  • Steven S Liu - VP, Corporate Marketing
  • Walter Ng - VP, Business Management
  • Dr. Jyuo-Min Shyu - Independent Director
  • Robert Larrabee - Sr. Manager, Business Development

Updated: 2017-07-17

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